Fabrication, microstructure, and electrical and mechanical properties of Ag/TEMPO‑oxidized cellulose nanofiber composite films, Tatsuya Kobayashi, Sota Mori, Ikuo Shohji, Yes, Yes, Yes, Sep. 2026, Journal of Materials Science, 61, 25829, 25845, Scientific journal

Analysis of Generation and Propagation of Fatigue Crack in Oxygen-Free Copper Using Electron Backscattered Diffraction Method, Hiroki Yonekura, Tatsuya Kobayashi, Ikuo Shohji, No, No, No, 15 Jan. 2026, Solid State Phenomena, 383, 89, 95, Scientific journal

Fabrication and Bonding Properties of Joints Formed by Transient Liquid Phase Diffusion Bonding Using Electroplated Films, Tatsuya Kobayashi, Shunsuke Totsuka, Ikuo Shohji, Yes, Yes, 12 Jan. 2026, Materials Science Forum, 1174, 107, 112

Fabrication and characterization of zinc-coated aluminum particle joining materials via zincate treatment, Tatsuya Kobayashi , Rika Goto, Ikuo Shohji, Yes, No, Yes, Nov. 2024, Journal of Materials Science, 59, 20812, 20823, Scientific journal

Yes, No, Yes, Nov. 2024, 13, 6, 301, 306

Recent Development of Joining Materials, Methods of Reliability Evaluations and Conductive Materials for Electronic Components, Tatsuya Kobayashi, Toshihiro Kuzuya, Tetsuya Ando, Yes, No, No, Sep. 2024, Materials Transactions, 65, 9, 176, 179

Yes, No, Yes, Aug. 2024, 63, 1, 176, 179, Scientific journal

Application of Metal Sputtering Treatment to Cellulose Materials Used as Co-Deposited Material for Electrolytic Nickel Composite Plating, 2023, 41, 4, 337, 347

Investigation of Deposition Conditions and Basic Properties of CNF Composite Ni Plated Film by Electroless Plating Method, Wataru Kawanabe, Makoto Iioka, Tatsuya Kobayashi, Ikuo Shohji, No, No, No, Materials Science Forum, 1106, 69, 74

Effect of Special Plating Films on Galvanic Corrosion Behavior between Metal and CFRTP, Tatsuya Kobayashi, Kei Shimizu, Ikuo Shohji, Yes, Yes, 2023, Materials Science Forum, 1106, 63, 68

Investigation of Effects of Electroplating Conditions on TEMPO-Oxidized Cellulose Nanofiber Composited Nickel Electroplated Films, Makoto Iioka, Wataru Kawanabe, Tatsuya Kobayashi, Ikuo Shohji, No, No, No, 2023, Materials Science Forum, 1106, 55, 62

Effect of High Temperature and Humidity on Bond Strength of Al/Resin Adhesive Joints, Itsuki Watanabe, Tatsuya Kobayashi, Ikuo Shohji, No, No, No, 2023, Key Engineering Materials, 967, 63, 68

Effect of Sb Addition on Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Ball Joints, Marina Oyama, Tatsuya Kobayashi, Ikuo Shohji, Mohd Arif Anuar Mohd Salleh, No, No, No, 2023, Key Engineering Materials, 967, 43, 49

Fabrication of High-Temperature Solder by Zn Plating Films Containing Al Particles, Tatsuya Kobayashi, Yuki Abiko, Ikuo Shohji, Yes, Yes, Yes, 2023, Key Engineering Materials, 967, 37, 42

Effect of Plating Potential on Three-Dimensional Structural Plating Films and their Adhesion to Epoxy Resin, Tatsuya Kobayashi, Thai Anh Pham, Ikuo Shohji, Yes, Yes, 2023, Key Engineering Materials, 966, 31, 36

Microstructure and Mechanical Properties of A6061/GA980 Resistance Spot Weld, Toshiki Nonomura, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Muneyoshi Iyota, No, No, No, 2023, Key Engineering Materials, 966, 25, 30

Fabrication of Electroplated Nickel Composite Films Using Cellulose Nanofibers Introducedwith Carboxy Groups as Co-Deposited Materials, Makoto Iioka, Wataru Kawanabe, Tatsuya Kobayashi, Ikuo Shohji and Kota Sakamoto, No, No, No, 2023, Surface, 6, 2, 164, 178

No, No, No, 2023, 26, 3, 266, 274

Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens, Tatsuya Kobayashi, Masaki Yokoi, Kyosuke Kobayashi, Kohei Mitsui, and Ikuo Shohji, Yes, Yes, Yes, 2018, Solid State Phenomena, 273, 232, 239

Analysis of Stress-strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints, Ikuo Shohji, Tatsuya Kobayashi and Tomotake Tohei, 2011, Key Engineering Materials, 462-463, 76, 81

Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu Solder Ball, Chiko Yorita, Tatsuya Kobayashi and Ikuo Shohji, 2011, Key Engineering Materials, 462-463, 849, 854

An Experimental Study of Fabrication of Cellulose Nano-Fiber Composited Ni Film by Electroplating, Makoto Iioka, Wataru Kawanabe, Ikuo Shohji and Tatsuya Kobayashi, 2022, Materials Transactions, 63, 6, 821, 828

2022, 11, 5, 188, 193

No, No, No, 2023, 11, 5, 194, 201

No, No, No, 2021, 10, 6, 359, 364

Mechanistic Study of Ni–Cr–P Alloy Electrodeposition and Characterization of Deposits, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake,Hiroki Yamamoto, Yuichiro Kamakoshi, No, No, No, 31 Jul. 2021, Journal of Electroanalytical Chemistry, 897, 15, 115582

Low Cycle Fatigue Characteristics of Oxygen-Free Copper for Electric Power Equipment, Takuma Tanaka, Togo Sugioka, Tatsuya Kobayashi, Ikuo Shohji, Yuya Shimada, Hiromitsu Watanabe and Yuichiro Kamakoshi, No, No, No, 29 Jul. 2021, Materials, 14, 4237

Microstructure and Properties of SUS304 Stainless Steel Joints Brazed with Electrodeposited Ni-Cr-P Alloy Coating, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Katsuharu Osanai, Tetsuya Ando, Junichiro Hirohashi, Tsunehito Wake, Katsufumi Inoue and Hiroki Yamamoto, No, No, No, 28 Jul. 2021, Materials, 14, 4216

Microstructure and Fatigue Behaviors of Dissimilar A6061/Galvannealed Steel Joints Fabricated by Friction Stir Spot Welding, Koki Kumamoto, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Yuichiro Kamakoshi, No, No, No, 12 Jul. 2021, Materials, 14, 3877

Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder, Mizuki Yamamoto, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui, Hirohiko Watanabe, No, No, No, 07 Jul. 2021, Materials, 14, 3799

Joining process of dissimilar materials using three-dimensional electrodeposited Ni-Cu film, T. Kobayashi, I. Shohji, Yes, Yes, Yes, Jan. 2021, Materials and Manufacturing Processes

Investigation of Mechanical Properties of High Tg Epoxy Resin Material, Xinya ZHAO, Hironao MITSUGI, Ikuo SHOHJI and Tatsuya KOBAYASHI, No, 2021, 10, 6, 365, 371

Mechanistic Study of Ni–Cr–P Alloy Electrodeposition and Characterization of Deposits, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake,Hiroki Yamamoto, Yuichiro Kamakoshi, No, 2021, Journal of Electroanalytical Chemistry, 897, 115582

Low Cycle Fatigue Characteristics of Oxygen-Free Copper for Electric Power Equipment, Takuma Tanaka, Togo Sugioka, Tatsuya Kobayashi, Ikuo Shohji, Yuya Shimada, Hiromitsu Watanabe and Yuichiro Kamakoshi, No, 2021, Materials, 14, 4237

Microstructure and Properties of SUS304 Stainless Steel Joints Brazed with Electrodeposited Ni-Cr-P Alloy Coating, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Katsuharu Osanai, Tetsuya Ando, Junichiro Hirohashi, Tsunehito Wake, Katsufumi Inoue and Hiroki Yamamoto, No, 2021, Materials, 14, 4216

Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder, Mizuki Yamamoto, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui, Hirohiko Watanabe, 2021, Materials, 14, 3799

Recent Development of Joining and Conductive Materials for Electronic Components, Tatsuya Kobayashi, Tetsuya Ando, Yes, Yes, Yes, 2021, Materials Transactions, 62, 8, 1270, 1276

Brazing of Stainless Steel Using Electrolytic Ni-P Plating Film and Investigation of Corrosion Behavior, Anna Hashimoto, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake, Susumu Arai, Yuichiro Kamakoshi, No, 2021, Materials Science Forum, 1016, 522, 527

Fabrication of three-dimensional microstructure film by Ni-Cu alloy electrodeposition for joining dissimilar materials, Tatsuya Kobayashi, Ikuo Shohji, Yes, 2021, Materials Science Forum, 1016, 738, 743

Effect of Microstructure on Joint Strength of Fe/Al Resistance Spot Welding for Multi-Material Components, Koki Kumamoto, Ikuo Shohji, Tatsuya Kobayashi, Muneyoshi Iyota, No, 2021, Materials Science Forum, 1016, 774, 779

Effect of Temperature and Humidity on Degradation Behavior of Cu/Epoxy Interface under High Temperature and High Humidity Aging, Riku Suzuki, Ikuo Shohji, Tatsuya Kobayashi, Yu Tonozuka, No, 2021, Materials Science Forum, 1016, 1436, 1442

Investigation of Bonding Strength of Al Solid Phase Diffusion Bonded Joint with Surface Treatment Using Electrolyzed Water, Takuma Tanaka, Ikuo Shohji, Tatsuya Kobayashi, Hisashi Imai, No, 2021, Materials Science Forum, 1016, 1466, 1472

Large area bonding for power devices by pillar-like IMC effective dispersion control, Ikuo Shohji, Tatsuya Kobayashi, Yusuke Nakata, No, 2020, Impact, 2020, 1, 76, 78

No, 2020, 9, 3, 127, 132

No, 2020, 9, 3, 133, 139

Investigation of Degradation Behavior of Cohesion of Resin and Adhesion Interface under High Temperature and High Humidity Conditions, ABIKO Hitomi;SHOHJI Ikuo;KOBAYASHI Tatsuya;TOMITA Yugo;MATSUNAGA Tatsunori, 2019, Journal of Smart Processing, 9, 2, 75, 81

Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge Lead-Free Solder, Masaki Yokoi, Tatsuya Kobayashi and Ikuo Shohji, No, Dec. 2018, Materials Science Forum

Effect of Cooling Rate on Intermetallic Compounds Formation in Sn-Ag-Cu-In Solder, Kenji Miki, Tatsuya Kobayashi, Ikuo Shohji and Yusuke Nakata, No, Dec. 2018, Materials Science Forum

Investigation of Crack Initiation in Glass Substrate by Residual Stress Analysis, Amon Shinohara, Tatsuya Kobayashi, Ikuo Shohji and Yuki Umemura, No, Dec. 2018, Materials Science Forum

Microstructures and Mechanical Properties of Welded Joints of Several HighTensile Strength Steel, Takahiro Izumi, Tatsuya Kobayashi, Ikuo Shohji and Hiroaki Miyanaga, No, Dec. 2018, Materials Science Forum

Plastic Deformation Simulation of Sintered Ferrous Material in Cold-Forging Process, Yuki Morokuma, Shinichi Nishida, Yuichiro Kamakoshi, Koshi Kanbe, TatsuyaKobayashi and Ikuo Shohji, No, Dec. 2018, Materials Science Forum

No, Mar. 2018, 7, 4, 128-134

Sn-W Structure Produced at the Interface Between Sn-3Ag-0.5Cu Solder and Plating Metallization on W Substrate, YORITA Chiko;HARADA Masahide;NISHIKAWA Toru;KOBAYASHI Tatsuya;SHOHJI Ikuo, 2014, Journal of Smart Processing, 3, 4, 232, 239

Microstructure and Fatigue Behaviors of Dissimilar A6061/Galvannealed Steel Joints Fabricated by Friction Stir Spot Welding, Koki Kumamoto, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Yuichiro Kamakoshi, No, 2021, Materials, 14, 3877

Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens, Kobayashi, Tatsuya;Shohji, Ikuo, Yes, Yes, 2019, METALS, 9, 12

Effects of Ni Addition to Sn-5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties, Kobayashi, Tatsuya;Mitsui, Kohei;Shohji, Ikuo, Yes, Yes, 2019, MATERIALS TRANSACTIONS, 60, 6, 888, 894

Recent Development of Joining and Conductive Materials for Electronic Components, Kobayashi, Tatsuya;Ando, Tetsuya, Yes, Yes, 2021, MATERIALS TRANSACTIONS, 62, 8, 1270, 1276

Formation of Cu-Ni Alloy Plating Film for Improving Adhesion between Metal and Resin, Kobayashi, Tatsuya;Kubo, Akifumi;Shohji, Ikuo, Yes, Yes, Yes, 2022, MATERIALS TRANSACTIONS, 63, 6, 800, 804

Recent Development of Joining and Conductive Materials for Electronic Components, Kobayashi Tatsuya;Ando Tetsuya, Yes, Yes, Yes, Aug. 2021, MATERIALS TRANSACTIONS, 62, 8, 1270, 1276

Effects of Ni Addition to Sn–5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties, Kobayashi Tatsuya;Mitsui Kohei;Shohji Ikuo, Jun. 2019, MATERIALS TRANSACTIONS, 60, 6, 888, 894

Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints, Kobayashi, Tatsuya;Shohji, Ikuo;Nakata, Yusuke, Yes, Yes, 2018, ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2018

Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens, Kobayashi, Tatsuya;Kobayashi, Kyosuke;Mitsui, Kohei;Shohji, Ikuo, Yes, Yes, 2018, ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2018

An Evaluation of the Wear Resistance of Electroplated Nickel Coatings Composited with 2,2,6,6-Tetramethylpiperidine 1-oxyl-Oxidized Cellulose Nanofibers., Iioka Makoto;Kawanabe Wataru;Tsujimura Subaru;Kobayashi Tatsuya;Shohji Ikuo, No, No, No, Jan. 2024, Polymers, 16, 2

Evaluation of Joining Properties Between Potential-Controlled Ni-Cu Alloy Plating Film and Pb-Free Solder Potential-Controlled Ni-Cu Alloy Plating Film and Pb-Free Solder, Tatsuya Kobayashi, Sota Mori, Ikuo Shohji, Yes, Yes, 16 Jan. 2026, Key Engineering Materials, 1039, 61, 66

Comparison of Pd-42Cu-10Ni and Pd-30Cu-29.5Ag-0.5Zn as Probe Material in Interfacial Reaction with Sn of Pd-42Cu-10Ni and Pd-30Cu-29.5Ag-0.5Zn as Probe Material in Interfacial Reaction with Sn, Rin Hashizume, Tatsuya Kobayashi, Ikuo Shohji, Tomohisa Hoshino, Kenichi Sato, Shunsuke Kobayashi, Naohito Odani, No, No, 16 Jan. 2026, Materials Science Forum, 1175, 117, 122

Degradation Behaviour of Sn-Ag-Cu Lead-Free Solder Joint with Electrolytic Ni Plated Electrode due to Electromigration Sn-Ag-Cu Lead-Free Solder Joint with Electrolytic Ni Plated Electrode due to Electromigration, Kenta Kawaguchi, Marina Oyama, Tatsuya Kobayashi, Ikuo Shohji, Keishi Nakamura, Koichi Hirasawa, Hitoshi Amemiya, No, No, 20 Jan. 2026, Key Engineering Materials, 1040, 63, 68

Investigation of Degradation Behavior of Adhesion between Sealing Resin and Copper by Aging Treatment Degradation Behavior of Adhesion between Sealing Resin and Copper by Aging Treatment, Anzu Tozaki, Tatsuya Kobayashi, Ikuo Shohji, Hiroto Takenaka, Hirose Suzuki, Minoru Ueshima, No, No, 19 Jan. 2026, Materials Science Forum, 1176, 59, 64

Assessment of Adhesion Degradation in A1050/Epoxy Resin Interface under High-Humidity and High-Temperature Aging Conditions under High-Humidity and High-Temperature Aging Conditions, Tatsuya Kobayashi, Ryota Nakagawa, Ikuo Shohji, Fumiya Funatomi, Kyohei Ohashi, Ryuki Sakai, Yes, Yes, 16 Jan. 2026, Key Engineering Materials, 1039, 53, 59

2025, 73, 102, 103

No, 2020, 7, 11, 50, 54, Introduction commerce magazine

Yes, Yes, Yes, 2021, 69, 9, 132, 133, Introduction commerce magazine

Joint work, 28 Jun. 2024, Textbook

Contributor, 2024

Fabrication and Wear Resistance of Ag–CNF Composite Plating Films, Tatsuya Kobayashi, The 12th Pacific Rim International Conference on Advanced Materials and Processing (PRICM12), 11 Aug. 2026, Gold Coast

03 Dec. 2025, 03 Dec. 2025, 03 Dec. 2025, Japanese

19 Sep. 2025, 17 Sep. 2025, 19 Sep. 2025, Japanese

Microstructural analysis and mechanical properties evaluation of zinc-coated aluminum particles, Tatsuya Kobayashi, TMS2025, 24 Mar. 2025, 23 Mar. 2025, 27 Mar. 2025, English

24 Jan. 2025

19 Mar. 2025

26 Jul. 2024

14 Sep. 2023

25 Jan. 2023

13 Nov. 2022

03 Dec. 2021

29 Jul. 2021

03 Sep. 2019

26 Jul. 2019

30 Jan. 2019

Effect of Ni Addition on Tensile and Fatigue Properties of Sn-Sb Alloy, Tatsuya Kobayashi, Kohei Mitsui and Ikuo Shohji, 4th International Conference on Nanojoining and Microjoining, 03 Dec. 2018, Nara

Comparison between Sn-Sb and Sn-Ag-Cu- Ni-Ge Alloys in Tensile Properties Using Miniature Size Specimen, Tatsuya Kobayashi, Masaki Yokoi, Kyosuke Kobayashi, Kohei Mitsui and Ikuo Shohji, Electronic Packaging Interconnect Technology Symposium 2017 , 02 Nov. 2017, Fukuoka

Patent right, 2018-219012, 22 Nov. 2018