Researcher Profile and Settings

Researcher

• Name

  SHOHJI IKUO

Profile and Settings

• Name

  IKUO, SHOHJI

Foreign language

• Use in presentation

  English

• Use in publication

  English

Affiliation

• Gunma University, Professor

Education

• 1998, Osaka University
• 1992, Kyoto University
• 1990, Kyoto University, Faculty of Engineering

Degree

• Doctor(Engineering)

Association Memberships

• IMAPS(International Microelectronics and Packaging Society)

Research Experience

• 1992, 1994, IBM Japan, Ltd. Yasu Technology Application Laboratory
• 1994, 2000, IBM Japan, Ltd., Yasu Site
• 2002, 2002

Research Activities

Research Areas

• Nanotechnology/Materials, Material fabrication and microstructure control

Research Interests

• Electronic packaging materials
• Microjoining
• Lead-free solder
• Thermal fatigue
• Brazing
• Interfacial reaction
• Surafce finish

Published Papers

• An Evaluation of the Wear Resistance of Electroplated Nickel Coatings Composited with 2,2,6,6-tetramethylpiperidine 1-oxyl-Oxidized Cellulose Nanofibers, Makoto Iioka, Wataru Kawanabe, Subaru Tsujimura, Tatsuya Kobayashi, Ikuo Shohji, 12 Jan. 2024, Polymers 2024, 16(2), 224, 1, 21

  DOI
• Application of Metal Sputtering Treatment to Cellulose Materials Used as Co-Deposited Material for Electrolytic Nickel Composite Plating, 飯岡諒, 川鍋渉, 小林竜也, 荘司郁夫, 30 Dec. 2023, 41, 4, 337, 347

  DOI
• Investigation of Deposition Conditions and Basic Properties of CNF Composite Ni Plated Film by Electroless Plating Method, Wataru Kawanabe, Makoto Iioka, Tatsuya Kobayashi, Ikuo Shohji, Dec. 2023, Materials Science Forum, 1106, 69, 74

  DOI
• Effect of Special Plating Films on Galvanic Corrosion Behavior between Metal and CFRTP, Tatsuya Kobayashi, Kei Shimizu, Ikuo Shohji, Dec. 2023, Materials Science Forum, 1106, 63, 68

  DOI
• Investigation of Effects of Electroplating Conditions on TEMPO-Oxidized Cellulose Nanofiber Composited Nickel Electroplated Films, Makoto Iioka, Wataru Kawanabe, Tatsuya Kobayashi, Ikuo Shohji, Dec. 2023, Materials Science Forum, 1106, 55, 62

  DOI
• Effect of High Temperature and Humidity on Bond Strength of Al/Resin Adhesive Joints, Itsuki Watanabe, Tatsuya Kobayashi, Ikuo Shohji, Dec. 2023, Key Engineering Materials, 967, 63, 68

  DOI
• Effect of Sb Addition on Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Ball Joints, Marina Oyama, Tatsuya Kobayashi, Ikuo Shohji, Mohd Arif Anuar Mohd Salleh, Dec. 2023, Key Engineering Materials, 967, 43, 49

  DOI
• Fabrication of High-Temperature Solder by Zn Plating Films Containing Al Particles, Tatsuya Kobayashi, Yuki Abiko, Ikuo Shohji, Dec. 2023, Key Engineering Materials, 967, 37, 42

  DOI
• Effect of Plating Potential on Three-Dimensional Structural Plating Films and their Adhesion to Epoxy Resin, Tatsuya Kobayashi, Thai Anh Pham, Ikuo Shohji, Dec. 2023, Key Engineering Materials, 967, 31, 36

  DOI
• Microstructure and Mechanical Properties of A6061/GA980 Resistance Spot Weld, Toshiki Nonomura, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Muneyoshi Iyota, Dec. 2023, Key Engineering Materials, 966, 25, 30

  DOI
• Fabrication of Electroplated Nickel Composite Films Using Cellulose Nanofibers Introducedwith Carboxy Groups as Co-Deposited Materials, Makoto Iioka, Wataru Kawanabe, Tatsuya Kobayashi, Ikuo Shohji and Kota Sakamoto, 19 May 2023, Surfaces, 6, 2, 164, 178

  DOI
• Sn-Sb-Ag 系高温鉛フリーはんだの疲労特性に及ぼす添加元素の影響, 三ツ井恒平, 山本瑞貴, 川井健太郎, 小林竜也, 荘司郁夫, 渡邉裕彦, 01 May 2023, 26, 3, 266, 274

  DOI
• 拡散付着型 Mo 系合金鋼粉の焼結冷間鍛造および真空浸炭窒化熱処理による疲労強度および耐摩耗性の向上, 鎌腰雄一郎, 芦塚康佑, 宇波繁, 井上吉弘, 井上紀子, 阿部竜一, 中村哲也, 荘司郁夫, 15 Feb. 2023, 70, 2, 77, 86

  DOI
• Sn-Sb-Ag 系はんだダイボンド接合部のパワーサイクル損傷挙動に及ぼす添加元素の影響, 山中佑太, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦, Sep. 2022, 11, 5, 194, 201

  DOI
• 半導体パッケージ検査用プローブ材と Sn-58Bi はんだ界面における反応層成長過程, 渡會和己, 荘司郁夫, 小林竜也, 星野智久, 佐藤賢一, 小林俊介, 小谷直仁, Sep. 2022, 11, 5, 188, 193

  DOI
• Erosion Resistance of Iron-Boron Nitride Composite Plating to Molten Lead-Free Solder, Jun Watanabe, Kenji Hatsuzawa, Shigeyuki Ogata, Shinichi Yoshida, Dmitri Golberg and Ikuo Shohji, Aug. 2022, Materials Transactions, 63, 8, 1112, 1119

  DOI
• Microstructure and Thermal Cycle Reliability of Sn­Ag­Cu­In­Sb Solder Joint, Yukihiko Hirai, Kouki Oomori, Hayato Morofushi, Masaaki Sarayama, Makoto Iioka and Ikuo Shohji, Jul. 2022, Materials Transactions, 63, 7, 1021, 1027

  DOI
• Solid State Bonding of Tin and Copper by Metal Salt Generation Bonding Technique Using Citric Acid, Shinji Koyama, Ikuo Shohji and Takako Muraoka, Jul. 2022, Materials Transactions, 63, 7, 987, 992

  DOI
• An Experimental Study of Fabrication of Cellulose Nano-Fiber Composited Ni Film by Electroplating, Makoto Iioka, Wataru Kawanabe, Ikuo Shohji and Tatsuya Kobayashi, Jun. 2022, Materials Transactions, 63, 6, 821, 828

  DOI
• Low Temperature Solid-State Bonding of Nickel and Tin with Formic Acid Surface Modifications, Shinji Koyama, Ikuo Shohji and Takako Muraoka, Jun. 2022, Materials Transactions, 63, 6, 813, 820
• Formation of Cu­Ni Alloy Plating Film for Improving Adhesion between Metal and Resin, Tatsuya Kobayashi, Akifumi Kubo and Ikuo Shohji, Jun. 2022, Materials Transactions, 63, 6, 800, 804

  DOI
• Investigation of Mechanical Properties of High Tg Epoxy Resin Material, Xinya ZHAO, Hironao MITSUGI, Ikuo SHOHJI and Tatsuya KOBAYASHI, Nov. 2021, 10, 6, 365, 371

  DOI
• 電子実装用エポキシ樹脂および Ni/ 樹脂接着部の吸水劣化挙動, 三ツ木寛尚, 鈴木陸, 荘司郁夫, 小林竜也, Nov. 2021, 10, 6, 359, 364

  DOI
• Mechanistic Study of Ni–Cr–P Alloy Electrodeposition and Characterization of Deposits, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake, Hiroki Yamamoto, Yuichiro Kamakoshi, Sep. 2021, Journal of Electroanalytical Chemistry, 897, 115582, 115582

  DOI
• Low Cycle Fatigue Characteristics of Oxygen-Free Copper for Electric Power Equipment, Takuma Tanaka, Togo Sugioka, Tatsuya Kobayashi, Ikuo Shohji, Yuya Shimada, Hiromitsu Watanabe and Yuichiro Kamakoshi, Jul. 2021, Materials, 14, 15, 4237, 4237

  DOI
• Microstructure and Properties of SUS304 Stainless Steel Joints Brazed with Electrodeposited Ni-Cr-P Alloy Coatings, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Katsuharu Osanai, Tetsuya Ando, Junichiro Hirohashi, Tsunehito Wake, Katsufumi Inoue and Hiroki Yamamoto, Jul. 2021, Materials, 14, 15, 4216, 4216

  DOI
• Microstructure and Fatigue Behaviors of Dissimilar A6061/Galvannealed Steel Joints Fabricated by Friction Stir Spot Welding, Koki Kumamoto, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Yuichiro Kamakoshi, Jul. 2021, Materials, 14, 14, 3877, 3877

  DOI
• Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder, Mizuki Yamamoto, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui, Hirohiko Watanabe, Jul. 2021, Materials, 14, 14, 3799, 3799

  DOI
• Effect of Si Concentration of a Brazing Precursor on the Bonding Strength of Aluminum Foam Bonded via Foaming Bonding, Ryosuke Suzuki, Yoshihiko Hangai, Yusuke Asakawa, Ikuo Shohji, Hidetoshi Fujii, Masaaki Matsubara, Apr. 2021, Material Transactions, 62, 8, 1210, 1215

  DOI
• Joining process of dissimilar materials using three-dimensional electrodeposited Ni-Cu film, T. Kobayashi & I. Shohji, 15 Feb. 2021, Materials and Manufacturing Processes

  DOI
• Investigation of Bonding Strength of Al Solid Phase Diffusion Bonded Joint with Surface Treatment UsingElectrolyzed Water, Takuma Tanaka, Ikuo Shohji, Tatsuya Kobayashi, Hisashi Imai, Jan. 2021, Materials Science Forum, 1016, 1466, 1472

  DOI
• Effect of Temperature and Humidity on Degradation Behavior of Cu/Epoxy Interface under High Temperature andHigh Humidity Aging, Riku Suzuki, Ikuo Shohji, Tatsuya Kobayashi, Yu Tonozuka, Jan. 2021, Materials Science Forum, 1016, 1436, 1442

  DOI
• Effect of Microstructure on Joint Strength of Fe/Al Resistance Spot Welding for Multi-Material Components, Koki Kumamoto, Ikuo Shohji, Tatsuya Kobayashi, Muneyoshi Iyota, Jan. 2021, Materials Science Forum, 1016, 774, 779

  DOI
• Fabrication of three-dimensional microstructure film by Ni-Cu alloy electrodeposition for joining dissimilar materials, Tatsuya Kobayashi, Ikuo Shohji, Jan. 2021, Materials Science Forum, 1016, 738, 743

  DOI
• Microstructure and Tensile Properties of Sn-Ag-Cu-In-Sb Solder, Yukihiko Hirai, Kouki Oomori, Hayato Morofushi, Ikuo Shohji, Jan. 2021, Materials Science Forum, 1016, 553, 560

  DOI
• Brazing of Stainless Steel Using Electrolytic Ni-P Plating Film and Investigation of Corrosion Behavior, Anna Hashimoto, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake, Susumu Arai, Yuichiro Kamakoshi, Jan. 2021, Materials Science Forum, 1016, 522, 527

  DOI
• 縦型双ロ-ルキャスティングを用いたプリカーサ法によるポーラスアルミニウム合金の製作, 鈴木良祐, 増渕匠, 西田進一, 荘司郁夫, 半谷禎彦, 藤井英俊, 松原雅昭, Nov. 2020, 92, 11, 577, 582

  DOI
• Sn-Sb-Ag系高温鉛フリーはんだ合金の機械的性質に及ぼす微量Ni及びGe添加の影響, 三ツ井恒平, 荘司郁夫, 小林竜也, 渡邉裕彦, May 2020, 9, 3, 133, 139

  DOI
• ステンレス鋼製熱交換器用Niろうの腐食挙動, 深井祐佑, 荘司郁夫, 小林竜也, 安藤哲也, 吉田拓也, 柏瀬毅, 大友昇, May 2020, 9, 3, 127, 132

  DOI
• 接着継手の高温高湿環境下における樹脂材凝集力および接着界面の劣化挙動調査, 安孫子瞳, 荘司郁夫, 小林竜也, 冨田雄吾, 松永達則, Mar. 2020, 9, 2, 75, 81

  DOI
• Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens, Tatsuya Kobayashi, Ikuo Shohji, 14 Dec. 2019, Metals 2019, 9, 12, 1348

  DOI
• Erosion Resistance Properties of Iron-Carbon Composite Plating to Molten Lead-Free Solder, Jun Watanabe,Kenji Hatsuzawa,Shigeyuki Ogata,Shinichi Yoshida,Ikuo Shohji, 05 Jul. 2019, Applied Sciences, 9, 13, 2724

  DOI
• Effect of Bi addition on Tensile Properties of Sn-Ag-Cu Solder at Low Temperature, Yukihiko Hirai,Kouki Oomori,Hayato Morofushi,Ikuo Shohji, Jun. 2019, Materials Transactions, 60, 6, 909, 914

  DOI
• Effects of Ni Addition to Sn-5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties, Tatsuya Kobayashi,Kohei Mitsui,Ikuo Shohji, Jun. 2019, Materials Transactions, 60, 6, 888, 894

  DOI
• 超音波フリップチップボンディングのチップ傾斜に対するロバスト性改善, 冨岡泰造,井口知洋,荘司郁夫, May 2019, 60, 700, 142, 146

  DOI
• Bondability Investigations of Thermosonic Flip Chip Bonding using Ultrasonic Vibration Pe rpendicular to the Interface, Taizo Tomioka,Ikuo Shohji, Apr. 2019, Transactions of the Japan Institute of Electronics Packaging, 12, E-18-013, 1, 7

  DOI
• Micro-Brazing of Stainless Steel Using Ni-P Alloy Plating, Shubin Liu,Ikuo Shohji,Makoto Iioka,Anna Hashimoto,Junichiro Hirohashi,Tsunehito Wake,Susumu Arai, 15 Mar. 2019, Applied Sciences, 9, 6, 1094

  DOI
• Finite Element Method Analysis of Densification Process of Sintered Steelfor Automobile in Cold Forging, Y. Morokuma, Y. Kamakoshi, S.Nishida, I. Shohji, 24 Feb. 2019, International Journal of Technology and Engineering Studies, 5, 1, 30, 36

  DOI
• A Study on Reliability of Pillar-Shaped Intermetallic Compounds DispersedLead-Free Solder Joint, Yusuke Nakata,Motoki Kurasawa,Tomihito Hashimoto,Kenji Miki,IkuoShohji, Dec. 2018, Materials Science Forum, Vol.941, 2087, 2092

  DOI
• Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01GeLead-Free Solder, Masaki Yokoi,Tatsuya Kobayashi,Ikuo Shohji, Dec. 2018, Materials Science Forum, Vol.941, 2081, 2086

  DOI
• Effect of Cooling Rate on Intermetallic Compounds Formation in Sn-Ag-Cu-InSolder, Kenji Miki,Tatsuya Kobayashi,Ikuo Shohji,Yusuke Nakata, Dec. 2018, Materials Science Forum, Vol.941, 2075, 2080

  DOI
• Investigation of Crack Initiation in Glass Substrate by Residual StressAnalysis, Amon Shinohara,Tatsuya Kobayashi,Ikuo Shohji,Yuki Umemura, Dec. 2018, Materials Science Forum, Vol.941, 2069, 2074

  DOI
• Plastic Deformation Simulation of Sintered Ferrous Material in Cold-ForgingProcess, Yuki Morokuma,Shinichi Nishida,Yuichiro Kamakoshi,Koshi Kanbe,TatsuyaKobayashi,Ikuo Shohji, Dec. 2018, Materials Science Forum, Vol.941, 552, 557

  DOI
• Microstructures and Mechanical Properties of Welded Joints of Several HighTensile Strength Steel, Takahiro Izumi,Tatsuya Kobayashi,Ikuo Shohji,Hiroaki Miyanaga, Dec. 2018, Materials Science Forum, Vol.941, 224, 229

  DOI
• Mo 系低合金焼結鋼の靱性および疲労強度向上のための焼結冷間鍛造工法と浸炭熱処理条件の最適化, 鎌腰雄一郎,荘司郁夫,井上紀子,福田俊二, Dec. 2018, Vol.7, No.6, 251, 259

  DOI
• 鋳造プリカーサ法によるポーラスアルミニウムの作製, 鈴木良祐,西本拓真,半谷禎彦,荘司郁夫,松原雅昭, Sep. 2018, 82, 9, 349, 357

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• 高温高湿環境下における銅／エポキシ樹脂界面の劣化寿命評価, 戸野塚悠,小林竜也,荘司郁夫,外薗洋昭,髙橋邦明,江連徳, Jul. 2018, Vol.7, No.4, 128, 134

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• Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties Using Miniature SizeSpecimens, Tatsuya Kobayashi,Kyosuke Kobayashi,Kohei Mitsui,Ikuo Shohji, Jun. 2018, Advances in Materials Science and Engineering, Volume 2018, Article ID 1416942

  DOI
• Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints, Tatsuya Kobayashi,Ikuo Shohji,Yusuke Nakata, May 2018, Advances in Materials Science and Engineering, Volume 2018, Article ID 4829508

  DOI
• Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens, Tatsuya Kobayashi,Masaki Yokoi,Kyosuke Kobayashi,Kohei Mitsui,Ikuo Shohji, Apr. 2018, Solid State Phenomena, ISSN:1662-9779, Vol. 273, 83, 90

  DOI
• 荷重プロファイルが超音波フリップチップボンディングの接合性へ与える影響, 冨岡 泰造,井口 知洋,荘司 郁夫, Jan. 2018, 36, 1, 16, 20

  DOI
• Formation mechanism of pillar-shaped intermetallic compounds dispersed lead-free solder joint, Y Nakata,T Hashimoto,M Kurasawa,Y Hayashi,I Shohji, Aug. 2017, IOP Conf. Series: Materials Science and Engineering, 257, 012014

  DOI
• Finite element method analysis of cold forging for deformation and densification of Mo alloyed sintered steel, Y Kamakoshi,S Nishida,K Kanbe,I Shohji, Aug. 2017, IOP Conf. Series: Materials Science and Engineering, 257, 012012

  DOI
• Improvement of mechanical strength of sintered Mo alloyed steel by optimization of sintering and cold-forging processes with densification, Y Kamakoshi,I Shohji,Y Inoue,S Fukuda, Aug. 2017, IOP Conf. Series: Materials Science and Engineering, 257, 012011

  DOI
• Liquid phase diffusion bonding of A1070 by using metal formate coated Zn sheet, K. Ozawa,S. Koyama,I. Shohji, Jul. 2017, Journal of Physics, Conf. Series 843, 012005
• The effect of boriding on wear resistance of cold work tool steel, Y. Anzawa,S. Koyama,I. Shohji, Jul. 2017, Journal of Physics, Conf. Series 843, 012064

  DOI
• 金属塩被膜付与Znシートを用いた鋳造用Al合金の液相拡散接合, 西城舜哉,小山真司,荘司郁夫, 15 Jun. 2017, Vol.6, No.5, 195, 199

  DOI
• Effect of Bonding Time and Bonding Temperature on Lead-Free Solder Joints Dispersed Pillar Shaped IMCs, Yawara Hayashi,Yusuke Nakata,Ikuo Shohji,Shinji Koyama,Tomihito Hashimoto, 02 May 2017, Procedia Engineering, 184, 214, 222

  DOI
• Bonding Characteristics of Sn-57Bi-1Ag Low-Temperature Lead-Free Solder to Gold-Plated Copper, Yuki Maruya,Hanae Hata,Ikuo Shohji,Shinji Koyama, 02 May 2017, Procedia Engineering, 184, 223, 230

  DOI
• Fracture Behaviors of Miniature Size Specimens of Sn-5Sb Lead-Free Solder under Tensile and Fatigue Conditions, Kyosuke Kobayashi,Ikuo Shohji,Shinji Koyama,Hiroaki Hokazono, 02 May 2017, Procedia Engineering, 184, 238, 245

  DOI
• Liquid Phase Diffusion Bonding of AC2C/ADC12 Aluminum Casting Alloy by Using Metal Salt Coated Zn Sheet, Shunya Saijo,Shinji Koyama,Ikuo Shohji, 02 May 2017, Procedia Engineering, 184, 284, 289

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• Degradation Behaviors of Adhesion Strength between Epoxy Resin and Copper under Aging at High Temperature, Yu Tonozuka,Ikuo Shohji,Shinji Koyama,Hiroaki Hokazono, 02 May 2017, Procedia Engineering, 184, 648, 654

  DOI
• Change of Crystallographic Orientation Characteristics of (001)-Oriented Electrodeposited Silver Films during Self-Annealing at Room Temperature, Yumi Hayashi,Ikuo Shohji,Hiroshi Miyazawa, 02 May 2017, Procedia Engineering, 184, 725, 731

  DOI
• Effect of Rust Inhibitor in Brine on Corrosion Properties of Copper, Kazunari Higuchi,Ikuo Shohji,Tetsuya Ando,Shinji Koyama,Yoshikazu Mizutani,Yukio Inoue, 02 May 2017, Procedia Engineering, 184, 743, 749

  DOI
• Degradation Behaviors of Adhesion Strength of Structural Adhesive for Weld-Bonding under High Temperature and Humidity Conditions, Yugo Tomita,Ikuo Shohji,Shinji Koyama,Seigo Shimizu, 02 May 2017, Procedia Engineering, 184, 231, 237

  DOI
• Effect of Added Elements on Microstructures and Joint Strength ofLead-free Sn-Based Solder Joint Dispersed IMC Pillar, Yawara Hayashi,Ikuo Shohji,Yusuke Nakata,Tomihito Hashimoto, Nov. 2016, Materials Science Forum, Vol. 879, 2216, 2221

  DOI
• Comparison of Self-Annealing Behaviors in (001)- and (111)-Oriented Electrodeposited Silver Films by In Situ EBSP Analysis, Yumi Hayashi,Ikuo Shohji,Hiroshi Miyazawa, Nov. 2016, Materials Science Forum, Vol. 879, 2243, 2248

  DOI
• Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-Free Solder, Kyosuke Kobayashi,Ikuo Shohji,Hiroaki Hokazono, Nov. 2016, Materials Science Forum, Vol. 879, 2377, 2382

  DOI
• ピラー状ＩＭＣ分散鉛フリーはんだ接合, 中田裕輔,橋本富仁,林和,荘司郁夫, Sep. 2016, Vol.5, No.5, 309, 314

  DOI
• Microstructure and Electrochemical Corrosion Behavior of Fe-Cr System Alloys as Substitutes for Ni-Based Brazing Filler Metal, Kangdao Shi,Takahiro Tsunoda,Ikuo Shohji,Kotaro Matsui,Yasuhiro Taguchi, Aug. 2016, ACTA METALLURGICA SINICA-ENGLISH LETTERS, 29, 8, 697, 706

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• Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder, Zhang Haidong,Ikuo Shohji,Masayoshi Shimoda,Hirohiko Watanabe, 01 Jun. 2016, MATERIALS TRANSACTIONS, 57, 6, 873, 880

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• Effect of Interfacial Hardness on Failure Modes of Liquid Phase Diffusion Bonded Sn/Sn with Bi Filler, Shinji Koyama,Issei Oya,Ikuo Shohji, 01 Jun. 2016, MATERIALS TRANSACTIONS, 57, 6, 810, 814

  DOI
• In Situ Observation of Self-Annealing Behaviors of (001)-Oriented Electrodeposited Silver Film by EBSD Method, Yumi Hayashi,Hiroshi Miyazawa,Kohei Minamitani,Ikuo Shohji, 01 Jun. 2016, MATERIALS TRANSACTIONS, 57, 6, 815, 818

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• Interfacial Reactions in Sn-57Bi-1Ag Solder Joints with Cu and Au Metallization, Hanae Hata,Yuuki Maruya,Ikuo Shohji, 01 Jun. 2016, MATERIALS TRANSACTIONS, 57, 6, 887, 891

  DOI
• Evaluation on Mechanical Properties of Sn-Bi-Ag Solder and Reliability of the Solder Joint, Hanae Shimokawa,Tasao Soga,Koji Serizawa,Kaoru Katayama,Ikuo Shohji, Dec. 2015, Transactions of the Japan Institute of Electronics Packaging, 8, 1, 46, 54

  DOI
• Fe-Cr 系ろうによる SUS304 ステンレス鋼ろう付継手の接合強度, 石康道,角田貴宏,楠元一臣,荘司郁夫,松康太郎,田口育宏, 20 Sep. 2015, 4, 5, 247, 253

  DOI
• Evaluation of Corrosion Resistance of SUS304 Stainless Steel Joint Brazed with Fe-Cr System Alloy, Kangdao Shi,Takahiro Tsunoda,Kazuomi Kusumoto,Ikuo Shohji,Kotaro Matsu,Yasuhiro Taguchi, 20 Jul. 2015, Journal of Smart Processing - for Materials, Environment & Energy -, 4, 4, 215, 221

  DOI
• Cu/Cu Direct Bonding by Metal Salt Generation Bonding Technique with Organic Acid and Its Persistence of Reformed Layer, Shinji Koyama,Naoki Hagiwara,Ikuo Shohji, 19 Jan. 2015, Japanese Journal of Applied Physics, 54, 030216, 1, 4

  DOI
• Effect of Filler Content and Coupling Agent on Mechanical Properties of Underfill Material, Hironao Mitsugi,Shinya Kitagoh,Ikuo Shohji,Shinji Koyama, Dec. 2014, Transactions of the Japan Institute of Electronics Packaging, 7, 25, 31

  DOI
• 銀めっき膜の{200}配向に及ぼす高シアン液中セレンの影響, 宮澤寛,尾形雅史,篠原圭介,菅原章,荘司郁夫, Aug. 2014, 53, 1, 266, 271
• Sn-3Ag-0.5CuはんだとW基板上Ni-Bめっきメタライズ界面に生成するSn-W構造, 依田智子,原田正英,西川徹,小林竜也,荘司郁夫, 20 Jul. 2014, 3, 4, 232, 239

  DOI
• Solid State Bonding of Al Alloy/SUS304 by Metal Salt Generation Bonding Technique with Acetic Acid, Kota Matsubara,Shinji Koyama,Hideo Nagata,Yoshiyuki Suda,Ikuo Shohji, May 2014, Advanced Materials Research, 922, 491, 496

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• Cu / Cu Direct Bonding by Metal Salt Generation Bonding Technique with Formic Acid and Citric Acid, Naoki Hagiwara,Shinji Koyama,Ikuo Shohji, May 2014, Advanced Materials Research, 922, 219, 223

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• Effect of Strain Rate on Tensile Properties of Miniature Size Specimens of Several Lead-free Alloys, Ikuo Shohji,Yuichiro Toyama, May 2014, Materials Science Forum, 783-786, 2810, 2815

  DOI
• Effect of Se content in high-cyanide silver plating solution on {200} crystal plane orientation ratio of electrodeposited silver layer, Hiroshi Miyazawa,Masafumi Ogata,Keisuke Shinohara,Akira Sugawara,Ikuo Shohji, May 2014, Materials Science Forum, 783-786, 1458, 1463

  DOI
• フリップチップ接合用材料の機械的特性がフリップチップのパッド下部配線層の熱応力に与える影響, 久田隆史,荘司郁夫,山田靖治,藤本公三, 20 Jan. 2014, 3, 1, 47, 53

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• A Study of the Effect of Indium Filler Metal on the Bonding Strength of Copper and Tin, Shinji Koyama,Seng Keat Ting,Yukinari Aoki,Ikuo Shohji, Dec. 2013, Transactions of the Japan Institute of Electronics Packaging, 6, 93, 98

  DOI
• Effect of Surface Modification by Aqueous NaOH Solution on Bond Strength of Solid-State Bonded Interface of Al, Shinji Koyama,Ting Seng Keat,Shun Amari,Kouta Matsubara,Ikuo Shohji, 01 Oct. 2013, MATERIALS TRANSACTIONS, 54, 10, 1975, 1980, Scientific journal

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• 鉛フリー無電解Ni めっき皮膜中の共析物がはんだ実装信頼性に及ぼす影響, 土田徹勇起,大久保利一,狩野貴宏,荘司郁夫, Sep. 2013, 16, 6, 484, 491

  DOI
• Sn-Ag-Cu-Ni系鉛フリーはんだ接合部の接合特性に及ぼすGeおよびP添加の影響, 荘司 郁夫,渡邉 裕彦,新井 亮平, 01 Nov. 2012, J95, 11, 324, 332
• Study on erosion resistance characteristics of Fe-MWCNT composite plating against lead-free solder, J. Watanabe,N. Sekimori,K. Hatsuzawa,T. Uetani,I. Shohji, Apr. 2012, Journal of Physics: Conference Series, 379, 012025

  DOI
• SUS304ステンレス鋼のB添加溶融塩浴を用いたほう化処理に及ぼす処理温度の影響, 小山 真司,高田 大士,川澄 健太郎,福田 達也,荘司 郁夫, Dec. 2011, 75, 12, 684, 689

  DOI
• SUS304ステンレス鋼のほう化処理に及ぼす溶融塩浴中のB添加量の影響, 小山 真司,高田 大士,川澄 健太郎,福田 達也,荘司 郁夫, Dec. 2011, 75, 12, 678, 683

  DOI
• Al添加溶融ほう砂浴を用いたSUS304ステンレス鋼のほう化処理に及ぼす処理温度の影響, 小山 真司,川澄 健太郎,福田 達也,荘司 郁夫, Nov. 2011, 77, 783, 1986, 1993

  DOI
• レーザ変位法を用いたソルダペーストぬれ性評価装置の開発, 荘司 郁夫,小山 真司,大屋 一生,伊坂 俊宏,宮本 博永,西室 将,平本 清, Aug. 2011, 14, 5, 390, 393

  DOI
• Sn-Cu-Ni系およびSn-Zn系鉛フリーはんだへのCuの溶解特性, 荘司 郁夫,渡邉 裕彦,永井 麻里江,大澤 勤, Aug. 2011, 14, 5, 382, 389

  DOI
• Sn/Ni接合界面の引張強さに及ぼすInフィラーメタルの適用効果, 小山 真司,伊坂 俊宏,荘司 郁夫, Aug. 2011, 14, 5, 377, 381

  DOI
• Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu Solder Ball, Chiko Yorita,Tatsuya Kobayashi,Ikuo Shohji, 2011, FRACTURE AND STRENGTH OF SOLIDS VII, PTS 1 AND 2, 462-463, 849, 854, International conference proceedings

  DOI
• Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni Addition, Hirohiko Watanabe,Masayoshi Shimoda,Noboru Hidaka,Ikuo Shohji, 2011, FRACTURE AND STRENGTH OF SOLIDS VII, PTS 1 AND 2, 462-463, 247, 252, International conference proceedings

  DOI
• Effect of Ag Content on Mechanical Properties of Lead-free Sn-Ag-Cu-Ni-Ge Alloy, Ikuo Shohji,Ryohei Arai,Hisao Ishikawa,Masao Kojima, 2011, FRACTURE AND STRENGTH OF SOLIDS VII, PTS 1 AND 2, 462-463, 82, 87, International conference proceedings

  DOI
• Analysis of Stress-strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints, Ikuo Shohji,Tatsuya Kobayashi,Tomotake Tohei, 2011, FRACTURE AND STRENGTH OF SOLIDS VII, PTS 1 AND 2, 462-463, 76, 81, International conference proceedings

  DOI
• Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge Alloy, Hirohiko Watanabe,Marie Nagai,Tsutomu Osawa,Ikuo Shohji, 2011, FRACTURE AND STRENGTH OF SOLIDS VII, PTS 1 AND 2, 462-463, 70, 75, International conference proceedings

  DOI
• Cu-Sn-Zr-P Alloy for High-Strength Heat Exchanger Tube, Tetsuya Ando,Hirokazu Tamagawa,Ikuo Shohji, Dec. 2010, Transactions of the Japan Institute of Electronics Packaging, 3, 14, 17

  DOI
• Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper, Shinji Koyama,Yukinari Aoki,Ikuo Shohji, Oct. 2010, MATERIALS TRANSACTIONS, 51, 10, 1759, 1763, Scientific journal

  DOI
• Fluxless Bonding of Ni-P/Cu Plated Al Alloy and Cu Alloy with Lead-Free Sn-Cu Foil, Ikuo Shohji,Shinji Koyama,Itaru Oshiro,Hideaki Nara,Yoshiharu Iwata, Oct. 2010, MATERIALS TRANSACTIONS, 51, 10, 1753, 1758, Scientific journal

  DOI
• Boron Particle Composite Plating with Ni-B Alloy Matrix, Susumu Arai,Shuji Kasai,Ikuo Shohji, 2010, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 157, 2, D119, D125, Scientific journal

  DOI
• Comparison of Erosion Rates of SUS304 and SUS316 Stainless Steels by Molten Sn-3Ag-0.5Cu Solder, Ikuo Shohji,Kazuhito Sumiyoshi,Makoto Miyazaki, Dec. 2009, Transactions of the Japan Institute of Electronics Packaging, 2, 35, 39

  DOI
• Effect of Impurities of Au and Pd on Tensile Properties of Eutectic Sn-Pb Solder for Aerospace Application, Ikuo Shohji,Yuta Saitoh,Norio Nemoto,Tsuyoshi Nakagawa,Nobuaki Ebihara,Fusao Iwase, Dec. 2009, Transactions of the Japan Institute of Electronics Packaging, 2, 29, 34

  DOI
• Phosphorus Particle Composite Plating with Ni-P Alloy Matrix, Yosuke Suzuki,Susumu Arai,Ikuo Shohji,Eiji Kobayashi, 2009, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 156, 8, D283, D286, Scientific journal

  DOI
• Effect of Shear Speed on Ball Shear Strength of Sn-3Ag-0.5Cu Solder Ball Joint, Ikuo Shohji,Satoshi Shimoyama,Hisao Ishikawa,Masao Kojima, Dec. 2008, Transactions of the Japan Institute of Electronics Packaging, 1, 9, 14

  DOI
• Impact Properties of Sn-0.75Cu Lead-free Solder Ball Joint, Ikuo Shohji,Tsutomu Osawa,Takeshi Okashita,Hirohiko Watanabe, Sep. 2008, Key Engineering Materials, 385-387, 745, 748

  DOI
• Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint, Ikuo Shohji,Tomotake Tohei,Keisuke Yoshizawa,Masaharu Nishimoto,Yasushi Ogawa,Takayuki Kawano, Sep. 2008, Key Engineering Materials, 385-387, 433, 436

  DOI
• Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-free Solder Ball Joints, Ikuo Shohji,Satoshi Shimoyama,Hisao Ishikawa,Masao Kojima, Sep. 2008, Key Engineering Materials, 385-387, 429, 432

  DOI
• Impact Properties of Lead-free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode, Ikuo Shohji,Hirohiko Watanabe,Takeshi Okashita,Tsutomu Osawa, Jul. 2008, Materials Transactions, 49, 7, 1513, 1517

  DOI
• Electrodeposition of Ni-P Composite Films Using Watts Base Bath Containing Phosphorous Particles, Yosuke Suzuki,Susumu Arai,Ikuo Shohji,Eiji Kobayashi, May 2008, Journal of The Surface Finishing Society of Japan, 59, 5, 343, 345

  DOI
• Estimation of Thermal Fatigue Resistance of Sn-Bi(-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index, Kiyokazu Yasuda,Ikuo Shohji,Tadashi Takemoto, May 2008, Materials Science Forum, 580-582, 221, 224

  DOI
• Effect of specimen size and aging on tensile properties of Sn-Ag-Cu lead-free solders, Ikuo Shohji,Tsutomu Osawa,Takashige Matsuki,Yoshiharu Kariya,Kiyokazu Yasuda,Tadashi Takemoto, May 2008, MATERIALS TRANSACTIONS, 49, 5, 1175, 1179, Scientific journal

  DOI
• Effect of Underfill Materials on Thermal Fatigue Lives of Chip Size Package Solder Joints, Ikuo Shohji,Tomotake Tohei,Keisuke Yoshizawa,Masaharu Nishimoto,Yasushi Ogawa,Takayuki Kawano, Mar. 2008, Smart Processing Technology, 2, 111, 114
• Growth Kinetics of Interfacial Reactions and Ball Shear Strength of Sn-9Zn Solder Joints on Electroless Ni/Au Plated Electrodes, Ikuo Shohji,Satoshi Shimoyama,Hisao Ishikawa,Masao Kojima, Mar. 2008, Smart Processing Technology, 2, 103, 106
• Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimens, Ikuo Shohji,Tsutomo Osawa,Takashige Matsuki,Yoshiharu Kariya,Kiyokazu Yasuda,Tadashi Takemoto, Mar. 2008, Smart Processing Technology, 2, 99, 102
• アンダーフィル封止CSP鉛フリーはんだ接合部の熱疲労寿命評価, 東平知丈,荘司郁夫,吉澤啓介,西元正治,川野崇之,水谷弓子,大崎理彦, Mar. 2008, 72, 3, 244, 248

  DOI
• Cu-P複合めっき膜のろう付特性に及ぼす添加P粒子径の影響, 荘司郁夫,新井進,狩野直樹,上西正久,大友昇, Dec. 2007, 58, 12, 831, 835

  DOI
• 無電解Ni-Pめっき処理アルミニウム合金とポリアセタールとの摩耗特性, 荘司郁夫,新井進,内川順一,松井孝典,小林栄仁, Dec. 2007, 58, 12, 846, 850

  DOI
• Influence of Content of Ni and Ag on Microstructure and Joint Strength of Sn-Ag-Cu-Ni-Ge Lead-Free Solder Joint, Ikuo Shohji,Satoshi Tsunoda,Hirohiko Watanabe,Tatsuhiko Asai, Oct. 2007, Key Engineering Materials, 353-358, 2033, 2036

  DOI
• Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package, Ikuo Shohji,Keisuke Yoshizawa,Masaharu Nishimoto,Takayuki Kawano, Oct. 2007, Key Engineering Materials, 353-358, 2029, 2032

  DOI
• Development of Cu Brazing Sheet with Cu-P Composite Plating, Ikuo Shohji,Susumu Arai,Naoki Kano,Noboru Otomo,Masahisa Uenishi, Oct. 2007, Key Engineering Materials, 353-358, 2025, 2028

  DOI
• スクリーン印刷用電鋳Ni-Co合金メッシュの耐刷性, 荘司郁夫,村田陽三,山本亮一,佐々木信夫,外舘公生, 01 Sep. 2007, 10, 6, 491, 494

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• Cu-P複合めっき, 新井 進,鈴木 陽介,飯高 正裕,荘司 郁夫,上西 正久,大友 昇, Feb. 2007, 第58巻,第2号,pp.139-141

  DOI
• An Evaluation of Low-Cycle Fatigue Property for Sn-3.5Ag and Sn-0.7Cu Lead-free Solder Using Surface Deformation, Takehiko Takahashi,Susumu Hioki,SHOHJI IKUO,Osamu Kamiya, Oct. 2006, Key Engineering Materials, 326-328, 1035, 1038

  DOI
• Thermal stress relief in lead-free solder joint for chip size package with encapsulant material, SHOHJI IKUO,Keisuke Yoshizawa,Masaharu Nishimoto,Takayuki Kawano, Aug. 2006, Smart Processing Technology, Vol.1, 175, 178
• Sn-3.5Ag, Sn-0.7Cu鉛フリーはんだの表面変形度合による低サイクル疲労寿命の定義, 高橋 武彦,日置 進,荘司 郁夫,神谷 修, Aug. 2006, 第24巻, 第3号, 253, 258

  DOI
• 合金としてのウイスカ抑制Pbフリーはんだ, 林田 喜任,髙橋義之,大野隆生,荘司 郁夫, Mar. 2006, Vol.70, No.3, 220, 225

  DOI
• Low cycle Fatigue behavior and Surface Feature by Image Processing of Sn-0.7Cu Lead-free Solder, Takehiko Takahashi,Susumu Hioki,SHOHJI IKUO,Osamu Kamiya, Mar. 2006, Key Engineering Materials, 306-308, 115, 120
• Influence of an immersion gold plating layer on reliability of a lead-free solder joint, Shohji\, I,H Goto,K Nakamura,T Ookubo, Dec. 2005, MATERIALS TRANSACTIONS, 46, 12, 2725, 2729, Scientific journal

  DOI
• Reliability of solder joint with Sn-Ag-Cu-Ni-Ge lead-free alloy under heat exposure conditions, Shohji\, I,S Tsunoda,H Watanabe,T Asai,M Nagano, Dec. 2005, MATERIALS TRANSACTIONS, 46, 12, 2737, 2744, Scientific journal

  DOI
• Comparison of Immersion Gold Plating in Reliability of a Lead-free Solder Joint with Autocatalytic Electroless Gold Plating, Kiyotomo Nakamura,Toshikazu Ookubo,SHOHJI IKUO,Hiroki Goto, Dec. 2005, Materials Transactions, Vol.46, No.12, 2730, 2736

  DOI
• Estimation of thermal fatigue resistances of Sn-Ag and Sn-Ag-Cu lead-free solders using strain rate sensitivity index, Shohji\, I,K Yasuda,T Takemoto, Nov. 2005, MATERIALS TRANSACTIONS, 46, 11, 2329, 2334, Scientific journal

  DOI
• Fatigue damage evaluation by surface feature for Sn-3.5Ag and Sn-0.7Cu solders, T Takahashi,S Hioki,Shohji\, I,O Kamiya, Nov. 2005, MATERIALS TRANSACTIONS, 46, 11, 2335, 2343, Scientific journal

  DOI
• Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with Sn-3Ag-0.5Cu, SHOHJI IKUO,Hiroki Goto,Kiyotomo Nakamura,Toshikazu Ookubo, Nov. 2005, Key Engineering Materials, 297-300, 2864, 2869
• High Speed Bonding of Resin Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil, SHOHJI IKUO,Tsukasa Sakurai,Shinji Arai, Nov. 2005, Key Engineering Materials, 297-300, 2819, 2824
• Mechanical Properties and Microstructure of SUS304 Brazed Joint with Ni-Base Filler Metals Added Cr Powder, SHOHJI IKUO,Satoshi Takayama,NAKAZAWA TAKANORI,Ken Matsumoto,Masanori Hikita, Nov. 2005, Key Engineering Materials, 297-300, 2767, 2771
• Sn-0.7Cu鉛フリーはんだの低サイクル疲労特性および画像を用いた疲労被害評価, 高橋武彦,日置進,荘司 郁夫,神谷修, Aug. 2005, 第23巻, 第3号, 436, 441

  DOI
• 高周波巻線チップコイル用被覆銅線の超音波接合, 荘司 郁夫,新井 慎二,櫻井 司,久米原 宏之,薄波 圭司,木村 由孝,須齋 嵩, Nov. 2004, 7, 7, 622, 628

  DOI
• Creep properties of Sn-8Mass%Zn-3Mass%Bi lead-free alloy, Shohji\, I,C Gagg,WJ Plumbridge, Aug. 2004, JOURNAL OF ELECTRONIC MATERIALS, 33, 8, 923, 927, Scientific journal

  DOI
• Tensile Properties of Sn-0.7mass%Cu Lead-free Solder, SHOHJI IKUO,Tomohiro Yoshida,Takehiko Takahashi,Susumu Hioki, Aug. 2004, Transactions of Materials Research Society of Japan, 29, 5, 2001, 2004
• Growth kinetics of reaction layers in flip chip joints with Cu-cored lead-free solder balls, Shohji\, I,Y Shiratori,H Yoshida,M Mizukami,A Ichida, Mar. 2004, MATERIALS TRANSACTIONS, 45, 3, 754, 758, Scientific journal

  DOI
• Tensile properties of Sn-Ag based lead-free solders and strain rate sensitivity, Shohji\, I,T Yoshida,T Takahashi,S Hioki, Feb. 2004, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 366, 1, 50, 55, Scientific journal

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• 熱交換機用ステンレス鋼のNiろう接合継手の強度と組織, 高山 智司,有倉 洋平,荘司 郁夫,中澤 崇徳,松本 健,曳田 昌徳, Feb. 2004, 第68巻, 第2号, 130, 133

  DOI
• Solder Joint Reliability Evaluation of Chip Scale Package by Modified Coffin-Manson Equation, SHOHJI IKUO,Hideo Mori,Yasumitsu Orii, Feb. 2004, Microelectronics Reliability, 44, 269, 274

  DOI
• Comparison of Low-melting Lead-free Alloys in Tensile Properties with Sn-Pb Eutectic Solder, SHOHJI IKUO,Tomohiro Yoshida,Takehiko Takahashi,Susumu Hioki, Feb. 2004, Journal of Materials Science: Materials in Electronics, 15, 4, 219, 223

  DOI
• ソルダ供給量に及ぼすソルダペースト中の平均粒径の影響, 荘司 郁夫,白鳥 祐司,宮崎 誠, Jan. 2004, 7, 1, 62, 66

  DOI
• Microstructures and hardness of Mo heater chip brazed with Au-18 mass% Ni, Shohji\, I,Y Kawabata,Y Kimura, May 2003, MATERIALS TRANSACTIONS, 44, 5, 866, 869, Scientific journal

  DOI
• Cu-7mass%PろうによるSUS316鋼のろう付組織と機械的特性, 荘司 郁夫,藤平 光宏,大金 彰,中澤 崇徳,上西 正久,大友 昇, Nov. 2002, 20, 4, 517, 522

  DOI
• Tensile properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu lead-free solders, Shohji\, I,T Yoshida,T Takahashi,S Hioki, Aug. 2002, MATERIALS TRANSACTIONS, 43, 8, 1854, 1857, Scientific journal

  DOI
• Interface reaction and mechanical properties of lead-free Sn-Zn alloy/Cu joints, Shohji\, I,T Nakamura,F Mori,S Fujiuchi, Aug. 2002, MATERIALS TRANSACTIONS, 43, 8, 1797, 1801, Scientific journal

  DOI
• 無電解Ni/Auめっきパッドを用いたBGA接合部組織と強度に及ぼすはんだボール中のCuコアの影響, 佐伯 敏男,清野 紳弥,上西 啓介,小林 紘二郎,荘司 郁夫,山本 雅春, Jul. 2001, 4, 4, 306, 311

  DOI
• 熱サイクル負荷を受けるSn-Ag系Pbフリーはんだ接合部の破断寿命評価, 荘司 郁夫,森 史成,藤内 伸一,山下 勝, Jul. 2001, 4, 4, 306, 311

  DOI
• Thermal fatigue behavior of flip-chip joints with lead-free solders, Shohji\, I,F Mori,KF Kobayashi, May 2001, MATERIALS TRANSACTIONS, 42, 5, 790, 793, Scientific journal

  DOI
• Effect of Cu in Pb free solder ball on the microstructure of BGA joints with Au/Ni coated Cu pads, K Uenishi,T Saeki,Y Kohara,KF Kobayashi,Shoji\, I,M Nishiura,M Yamamoto, May 2001, MATERIALS TRANSACTIONS, 42, 5, 756, 760, Scientific journal

  DOI
• CuコアSn-3.5Agはんだを用いたBGA接合部組織とせん断強度, 小原 泰浩,佐伯 敏男,上西 啓介,小林 紘二郎,荘司 郁夫,山本 雅春, May 2001, 4, 3, 192, 199

  DOI
• Sn-Ag系Pbフリーはんだを用いたマイクロ接合部の熱疲労組織, 荘司 郁夫,森 史成,藤内 伸一,山下 勝, May 2001, 4, 2, 133, 137

  DOI
• 高密度実装基板におけるフリップチップリワーク法, 森 史成,鳥山和重,勝 直樹,荘司郁夫, Jul. 2000, 3, 4, 335, 338

  DOI
• Intermetallic Compound Layer Formation Between Au and In-48Sn Solder, I.Shohji,S.Fujiwara,S.Kiyono,K.F.Kobayashi, Jul. 1999, Scripta Materialia, 40, 7, 815, 820

  DOI
• BGA接合部組織と強度に及ぼすはんだボール中のCuコアの影響, 清野紳弥,上西啓介,小林紘二郎,荘司 郁夫,山本雅春, Jul. 1999, 2, 4, 298, 302

  DOI
• AuとIn-Sn系はんだの界面における金属間化合物成長過程, 荘司 郁夫,藤原 伸一,清野 紳弥,藤井 俊夫,小林 紘二郎, Mar. 1999, 2, 2, 121, 126

  DOI
• Auバンプを用いたフリップチップ接合部の組織と熱疲労特性, 荘司郁夫,折井靖光,小林紘二郎, May 1998, 16, 2, 215, 222

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• フリップチップ接合用はんだ材のせん断特性, 荘司 郁夫,折井 靖光,小林 紘二郎, Feb. 1998, 16, 1, 51, 58

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• AuとIn-48Snはんだの界面における金属間化合物成長過程, 荘司 郁夫,藤原 伸一,清野 紳弥,小林 紘二郎, Jan. 1998, 13, 1, 24, 29

  DOI
• In系はんだによる狭ピッチフリップチップアタッチ接合技術, 荘司 郁夫,山田毅,木村 英夫,藤内 伸一,折井 靖光, Jan. 1997, 12, 1, 25, 28

  DOI
• Whisker-free Pb-free solder through alloying, Hayashida, Yoshitou;Takahashi, Yoshiyuki;Ohno, Takao;Shohji, Ikuo, 2006, JOURNAL OF THE JAPAN INSTITUTE OF METALS, 70, 3, 220, 225
• Thermal fatigue life evaluation of lead-free solder joint of chip size package with underfill, Tohei, Tomotake;Shohji, Ikuo;Yoshizawa, Keisuke;Nishimoto, Masaharu;Kawano, Takayuki;Mizutani, Yumiko;Ohsaki, Yoshihiko, 2008, JOURNAL OF THE JAPAN INSTITUTE OF METALS, 72, 3, 244, 248
• Effect of specimen size and aging on tensile properties of Sn-Ag-Cu lead-free solders, Shohji, Ikuo;Osawa, Tsutomu;Matsuki, Takashige;Kariya, Yoshiharu;Yasuda, Kiyokazu;Takemoto, Tadashi, 2008, MATERIALS TRANSACTIONS, 49, 5, 1175, 1179

  DOI
• Impact properties of lead-free Sn-Ag-Cu-Ni-Ge solder joint with Cu electrode, Shohji, Ikuo;Watanabe, Hirohiko;Okashita, Takeshi;Osawa, Tsutomu, 2008, MATERIALS TRANSACTIONS, 49, 7, 1513, 1517

  DOI
• Phosphorus Particle Composite Plating with Ni-P Alloy Matrix, Suzuki, Yosuke;Arai, Susumu;Shohji, Ikuo;Kobayashi, Eiji, 2009, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 156, 8, D283, D286

  DOI
• Boron Particle Composite Plating with Ni-B Alloy Matrix, Arai, Susumu;Kasai, Shuji;Shohji, Ikuo, 2010, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 157, 2, D119, D125

  DOI
• Flux less Bonding of Ni-P/Cu Plated Al Alloy and Cu Alloy with Lead-Free Sn-Cu Foil, Shohji, Ikuo;Koyama, Shinji;Oshiro, Itaru;Nara, Hideaki;Iwata, Yoshiharu, 2010, MATERIALS TRANSACTIONS, 51, 10, 1753, 1758

  DOI
• Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper, Koyama, Shinji;Aoki, Yukinari;Shohji, Ikuo, 2010, MATERIALS TRANSACTIONS, 51, 10, 1759, 1763

  DOI
• Effect of B Contents in Fused Salt Bath on Boriding of SUS304 Stainless Steel, Koyama, Shinji;Takada, Masashi;Kawasumi, Kentaro;Fukuda, Tatsuya;Shohji, Ikuo, 2011, JOURNAL OF THE JAPAN INSTITUTE OF METALS, 75, 12, 678, 683
• Influence of Processing Temperature on Boriding of SUS304 Stainless Steel by B Added Fused Salt Bath, Koyama, Shinji;Fukuda, Tatsuya;Kawasumi, Kentaro;Shohji, Ikuo, 2011, JOURNAL OF THE JAPAN INSTITUTE OF METALS, 75, 12, 684, 689
• Effect of Surface Modification by Aqueous NaOH Solution on Bond Strength of Solid-State Bonded Interface of Al, Koyama, Shinji;Keat, Ting Seng;Amari, Shun;Matsubara, Kouta;Shohji, Ikuo, 2013, MATERIALS TRANSACTIONS, 54, 10, 1975, 1980

  DOI
• Cu/Cu direct bonding by metal salt generation bonding technique with organic acid and persistence of reformed layer, Koyama, Shinji;Hagiwara, Naoki;Shohji, Ikuo, 2015, JAPANESE JOURNAL OF APPLIED PHYSICS, 54, 3

  DOI
• Special Issue on Frontier Researches Related to Interconnection, Packaging and Microjoining Materials and Microprocessing for Such Materials PREFACE, Kariya, Yoshiharu;Shohji, Ikuo, 2016, MATERIALS TRANSACTIONS, 57, 6, 796, 796
• Effect of Interfacial Hardness on Failure Modes of Liquid Phase Diffusion Bonded Sn/Sn with Bi Filler, Koyama, Shinji;Oya, Issei;Shohji, Ikuo, 2016, MATERIALS TRANSACTIONS, 57, 6, 810, 814

  DOI
• In Situ Observation of Self-Annealing Behaviors of (001)-Oriented Electrodeposited Silver Film by EBSD Method, Hayashi, Yumi;Miyazawa, Hiroshi;Minamitani, Kohei;Shohji, Ikuo, 2016, MATERIALS TRANSACTIONS, 57, 6, 815, 818

  DOI
• Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder, Zhang Haidong;Shohji, Ikuo;Shimoda, Masayoshi;Watanabe, Hirohiko, 2016, MATERIALS TRANSACTIONS, 57, 6, 873, 880

  DOI
• Interfacial Reactions in Sn-57Bi-1Ag Solder Joints with Cu and Au Metallization, Hata, Hanae;Maruya, Yuuki;Shohji, Ikuo, 2016, MATERIALS TRANSACTIONS, 57, 6, 887, 891

  DOI
• Microstructure and Electrochemical Corrosion Behavior of Fe-Cr System Alloys as Substitutes for Ni-Based Brazing Filler Metal, Shi, Kangdao;Tsunoda, Takahiro;Shohji, Ikuo;Matsui, Kotaro;Taguchi, Yasuhiro, 2016, ACTA METALLURGICA SINICA-ENGLISH LETTERS, 29, 8, 697, 706

  DOI
• Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints, Kobayashi, Tatsuya;Shohji, Ikuo;Nakata, Yusuke, 2018, ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2018

  DOI
• Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens, Kobayashi, Tatsuya;Kobayashi, Kyosuke;Mitsui, Kohei;Shohji, Ikuo, 2018, ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2018

  DOI
• Micro-Brazing of Stainless Steel Using Ni-P Alloy Plating, Liu, Shubin;Shohji, Ikuo;Iioka, Makoto;Hashimoto, Anna;Hirohashi, Junichiro;Wake, Tsunehito;Arai, Susumu, 2019, APPLIED SCIENCES-BASEL, 9, 6

  DOI
• Special Issue on Frontier Researches Related to Interconnection, Packaging and Microjoining Materials and Microprocessing for Such Materials -Part II- PREFACE, Shohji, Ikuo;Kariya, Yoshiharu, 2019, MATERIALS TRANSACTIONS, 60, 6, 849, 849

  DOI
• Effects of Ni Addition to Sn-5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties, Kobayashi, Tatsuya;Mitsui, Kohei;Shohji, Ikuo, 2019, MATERIALS TRANSACTIONS, 60, 6, 888, 894

  DOI
• Effect of Bi Addition on Tensile Properties of Sn-Ag-Cu Solder at Low Temperature, Hirai, Yukihiko;Oomori, Kouki;Morofushi, Hayato;Shohji, Ikuo, 2019, MATERIALS TRANSACTIONS, 60, 6, 909, 914

  DOI
• Erosion Resistance Properties of Iron-Carbon Composite Plating to Molten Lead-Free Solder, Watanabe, Jun;Hatsuzawa, Kenji;Ogata, Shigeyuki;Yoshida, Shinichi;Shohji, Ikuo, 2019, APPLIED SCIENCES-BASEL, 9, 13

  DOI
• Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens, Kobayashi, Tatsuya;Shohji, Ikuo, 2019, METALS, 9, 12

  DOI
• Microstructure and Fatigue Behaviors of Dissimilar A6061/Galvannealed Steel Joints Fabricated by Friction Stir Spot Welding, Kumamoto, Koki;Kosaka, Tsuyoshi;Kobayashi, Tatsuya;Shohji, Ikuo;Kamakoshi, Yuichiro, 2021, MATERIALS, 14, 14

  DOI
• Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder, Yamamoto, Mizuki;Shohji, Ikuo;Kobayashi, Tatsuya;Mitsui, Kohei;Watanabe, Hirohiko, 2021, MATERIALS, 14, 14

  DOI
• Low Cycle Fatigue Characteristics of Oxygen-Free Copper for Electric Power Equipment, Tanaka, Takuma;Sugioka, Togo;Kobayashi, Tatsuya;Shohji, Ikuo;Shimada, Yuya;Watanabe, Hiromitsu;Kamakoshi, Yuichiro, 2021, MATERIALS, 14, 15

  DOI
• Microstructure and Properties of SUS304 Stainless Steel Joints Brazed with Electrodeposited Ni-Cr-P Alloy Coatings, Liu, Shubin;Shohji, Ikuo;Kobayashi, Tatsuya;Osanai, Katsuharu;Ando, Tetsuya;Hirohashi, Junichiro;Wake, Tsunehito;Inoue, Katsufumi;Yamamoto, Hiroki, 2021, MATERIALS, 14, 15

  DOI
• Effect of Si Concentration of a Brazing Precursor on the Bonding Strength of Aluminum Foam Bonded via Foaming Bonding, Suzuki, Ryosuke;Hangai, Yoshihiko;Asakawa, Yusuke;Shohji, Ikuo;Fujii, Hidetoshi;Matsubara, Masaaki, 2021, MATERIALS TRANSACTIONS, 62, 8, 1210, 1215

  DOI
• Mechanistic study of Ni-Cr-P alloy electrodeposition and characterization of deposits, Liu, Shubin;Shohji, Ikuo;Kobayashi, Tatsuya;Hirohashi, Junichiro;Wake, Tsunehito;Yamamoto, Hiroki;Kamakoshi, Yuichiro, 2021, JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 897

  DOI
• Microstructure and Properties of SUS304 Stainless Steel Joints Brazed with Electrodeposited Ni-Cr-P Alloy Coatings (vol 14, 4216, 2021), Liu, Shubin;Shohji, Ikuo;Kobayashi, Tatsuya;Osanai, Katsuharu;Ando, Tetsuya;Hirohashi, Junichiro;Wake, Tsunehito;Inoue, Katsufumi;Yamamoto, Hiroki, 2021, MATERIALS, 14, 19

  DOI
• Low Temperature Solid-State Bonding of Nickel and Tin with Formic Acid Surface Modifications, Koyama, Shinji;Shohji, Ikuo;Muraoka, Takako, 2022, MATERIALS TRANSACTIONS, 63, 6, 813, 820

  DOI
• An Experimental Study of Fabrication of Cellulose Nano-Fiber Composited Ni Film by Electroplating, Iioka, Makoto;Kawanabe, Wataru;Shohji, Ikuo;Kobayashi, Tatsuya, 2022, MATERIALS TRANSACTIONS, 63, 6, 821, 828

  DOI
• Special Issue on Frontier Research on Bonding and Interconnect Materials for Electric Components and Related Microprocessing -Part III-, Shohji, Ikuo;Kariya, Yoshiharu, 2022, MATERIALS TRANSACTIONS, 63, 6, 753, 753
• Formation of Cu-Ni Alloy Plating Film for Improving Adhesion between Metal and Resin, Kobayashi, Tatsuya;Kubo, Akifumi;Shohji, Ikuo, 2022, MATERIALS TRANSACTIONS, 63, 6, 800, 804

  DOI
• Solid State Bonding of Tin and Copper by Metal Salt Generation Bonding Technique Using Citric Acid, Koyama, Shinji;Shohji, Ikuo;Muraoka, Takako, 2022, MATERIALS TRANSACTIONS, 63, 7, 987, 992

  DOI
• Microstructure and Thermal Cycle Reliability of Sn-Ag-Cu-In-Sb Solder Joint, Hirai, Yukihiko;Oomori, Kouki;Morofushi, Hayato;Sarayama, Masaaki;Iioka, Makoto;Shohji, Ikuo, 2022, MATERIALS TRANSACTIONS, 63, 7, 1021, 1027

  DOI
• Erosion Resistance of Iron-Boron Nitride Composite Plating to Molten Lead-Free Solder, Watanabe, Jun;Hatsuzawa, Kenji;Ogata, Shigeyuki;Yoshida, Shinichi;Golberg, Dmitri;Shohji, Ikuo, 2022, MATERIALS TRANSACTIONS, 63, 8, 1112, 1119

  DOI
• Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders, SHOHJI Ikuo;MORI Fuminari;KOBAYASHI Kojiro F., May 2001, MATERIALS TRANSACTIONS, 42, 5, 790, 793

  DOI
• Microstructures and Hardness of Mo Heater Chip Brazed with Au-18 mass%Ni, SHOHJI Ikuo;KAWABATA Yoshinori;KIMURA Yoshitaka, May 2003, 44, 5, 866, 869
• Joint Strength and Microstructure of SUS304 Brazed with Nickel-base Filler Metal for Heat Exchangers, TAKAYAMA Satoshi;ARIKURA Youhei;SHOHJI Ikuo;NAKAZAWA Takanori;MATSUMOTO Ken;HIKITA Masanori, Feb. 2004, 68, 2, 130, 133
• Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls, SHOHJI Ikuo;SHIRATORI Yuji;YOSHIDA Hiroshi;MIZUKAMI Masahiko;ICHIDA Akira, Mar. 2004, Materials Transactions, 45, 3, 754, 758
• Ultrasonic Bonding of Resin-Coated Cu Wire for High-Frequency Chip Coils, SHOHJI Ikuo;ARAI Shinji;SAKURAI Tsukasa;KUMEHARA Hiroyuki;USUNAMI Keiji;KIMURA Yoshitaka;SUSAI Takashi, Nov. 2004, Journal of Japan Institute of Electronics Packaging, 7, 7, 622, 628
• Estimation of Thermal Fatigue Resistances of Sn-Ag and Sn-Ag-Cu Lead-Free Solders Using Strain Rate Sensitivity Index, SHOHJI Ikuo;YASUDA Kiyokazu;TAKEMOTO Tadashi, Nov. 2005, Materials Transactions, 46, 11, 2329, 2334
• Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu Solders, TAKAHASHI Takehiko;HIOKI Susumu;SHOHJI Ikuo;KAMIYA Osamu, Nov. 2005, Materials Transactions, 46, 11, 2335, 2343
• Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint, SHOHJI Ikuo;GOTO Hiroki;NAKAMURA Kiyotomo;OOKUBO Toshikazu, Dec. 2005, Materials Transactions, 46, 12, 2725, 2729
• Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating, NAKAMURA Kiyotomo;SHOHJI Ikuo;GOTO Hiroki;OOKUBO Toshikazu, Dec. 2005, Materials Transactions, 46, 12, 2730, 2736
• Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-Free Alloy under Heat Exposure Conditions, SHOHJI Ikuo;TSUNODA Satoshi;WATANABE Hirohiko;ASAI Tatsuhiko;NAGANO Megumi, Dec. 2005, Materials Transactions, 46, 12, 2737, 2744
• Whisker-Free Pb-Free Solder through Alloying, HAYASHIDA Yoshitou;TAKAHASHI Yoshiyuki;OHNO Takao;SHOHJI Ikuo, Mar. 2006, Journal of the Japan Institute of Metals and Materials, 70, 3, 220, 225

  DOI
• Cu-P Composite Plating, ARAI Susumu;SUZUKI Yosuke;IIDAKA Masahiro;SHOHJI Ikuo;UENISHI Masahisa;OTOMO Noboru, Feb. 2007, Journal of The Surface Finishing Society of Japan, 58, 2, 139, 141

  DOI
• Effect of P Particle Size on Brazability of Cu-P Composite Plating Film, SHOHJI Ikuo;ARAI Susumu;KANO Naoki;UENISHI Masahisa;OTOMO Noboru, Dec. 2007, Journal of The Surface Finishing Society of Japan, 58, 12, 831, 835

  DOI
• Wear Properties of Electroless Ni-P Plated Al Alloy and Polyacetal, SHOHJI Ikuo;ARAI Susumu;UCHIKAWA Junichi;MATSUI Takanori;KOBAYASHI Eiji, Dec. 2007, Journal of The Surface Finishing Society of Japan, 58, 12, 846, 850

  DOI
• Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders, SHOHJI Ikuo;OSAWA Tsutomu;MATSUKI Takashige;KARIYA Yoshiharu;YASUDA Kiyokazu;TAKEMOTO Tadashi, May 2008, Materials Transactions, 49, 5, 1175, 1179
• Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode, SHOHJI Ikuo;WATANABE Hirohiko;OKASHITA Takeshi;OSAWA Tsutomu, Jul. 2008, Materials Transactions, 49, 7, 1513, 1517
• Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill, TOHEI Tomotake;SHOHJI Ikuo;YOSHIZAWA Keisuke;NISHIMOTO Masaharu;KAWANO Takayuki;MIZUTANI Yumiko;OHSAKI Yoshihiko, Mar. 2008, 72, 3, 244, 248
• Electrodeposition of Ni-P Composite Films Using Watts Base Bath Containing Phosphorous Particles, SUZUKI Yosuke;ARAI Susumu;SHOHJI Ikuo;KOBAYASHI Eiji, May 2008, Journal of The Surface Finishing Society of Japan, 59, 5, 343, 345

  DOI
• Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints, SHOHJI Ikuo;NAKAMURA Takao;MORI Fuminari;FUJIUCHI Shinichi, Aug. 2002, MATERIALS TRANSACTIONS, 43, 8, 1797, 1801

  DOI
• Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders, SHOHJI Ikuo;YOSHIDA Tomohiro;TAKAHASHI Takehiko;HIOKI Susumu, Aug. 2002, MATERIALS TRANSACTIONS, 43, 8, 1854, 1857

  DOI
• Fluxless Bonding of Ni-P/Cu Plated Al Alloy and Cu Alloy with Lead-Free Sn-Cu Foil, SHOHJI Ikuo;KOYAMA Shinji;OSHIRO Itaru;NARA Hideaki;IWATA Yoshiharu, Oct. 2010, MATERIALS TRANSACTIONS, 51, 10, 1753, 1758

  DOI
• Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper, KOYAMA Shinji;AOKI Yukinari;SHOHJI Ikuo, Oct. 2010, MATERIALS TRANSACTIONS, 51, 10, 1759, 1763

  DOI
• Effect of Indium Filler Metal on Tensile Strength of Sn/Ni Bond Interface, Koyama Shinji;Isaka Toshihiro;Shohji Ikuo, 2011, Journal of The Japan Institute of Electronics Packaging, 14, 5, 377, 381

  DOI
• Dissolution Properties of Cu in Sn-Cu-Ni and Sn-Zn Lead-Free Alloys, Shohji Ikuo;Watanabe Hirohiko;Nagai Marie;Osawa Tsutomu, 2011, Journal of The Japan Institute of Electronics Packaging, 14, 5, 382, 389

  DOI
• Development of Wettability Evaluation Equipment for Solder Paste Using Laser Displacement Method, Shohji Ikuo;Koyama Shinji;Oya Issei;Isaka Toshihiro;Miyamoto Hironaga;Nishimuro Masashi;Hiramoto Kiyoshi, 2011, Journal of The Japan Institute of Electronics Packaging, 14, 5, 390, 393

  DOI
• Effect of B Contents in Fused Salt Bath on Boriding of SUS304 Stainless Steel, Koyama Shinji;Takada Masashi;Kawasumi Kentaro;Fukuda Tatsuya;Shohji Ikuo, 2011, Journal of the Japan Institute of Metals and Materials, 75, 12, 678, 683

  DOI
• Influence of Processing Temperature on Boriding of SUS304 Stainless Steel by B Added Fused Salt Bath, Koyama Shinji;Fukuda Tatsuya;Kawasumi Kentaro;Shohji Ikuo, 2011, Journal of the Japan Institute of Metals and Materials, 75, 12, 684, 689

  DOI
• The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint, TSUCHIDA Tetsuyuki;OKUBO Toshikazu;KANO Takahiro;SHOHJI Ikuo, Apr. 2012, 63, 4, 233, 238
• The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint, TSUCHIDA Tetsuyuki;OKUBO Toshikazu;KANO Takahiro;SHOHJI Ikuo, 2013, Journal of Smart Processing, 2, 1, 22, 25

  DOI
• The Influence of Incorporated Additives in Lead-Free Electroless Nickel Plating Film on the Reliability of Solder Joint, Tsuchida Tetsuyuki;Okubo Toshikazu;Kano Takahiro;Shohji Ikuo, 2013, Journal of The Japan Institute of Electronics Packaging, 16, 6, 484, 491

  DOI
• Effect of Surface Modification by Aqueous NaOH Solution on Bond Strength of Solid-State Bonded Interface of Al, Koyama Shinji;Keat Ting Seng;Amari Shun;Matsubara Kouta;Shohji Ikuo, 2013, MATERIALS TRANSACTIONS, 54, 10, 1975, 1980

  DOI
• Influence of the Diameter of Solder Powder in Solder Paste on the Applied Solder Volume by Paste Printing, SHOHJI Ikuo;SHIRATORI Yuji;MIYAZAKI Makoto, Jan. 2004, Journal of Japan Institute of Electronics Packaging, 7, 1, 62, 66
• Evaluation of the Microstructures of CSP Microjoints with Sn-Ag Lead-Free Solders, SHOHJI Ikuo;MORI Fuminari;FUJIUCHI Shinichi;YAMASHITA Masaru, Mar. 2001, Journal of Japan Institute of Electronics Packaging, 4, 2, 133, 137
• The Microstructure and Shear Strength of the BGA Joint Using Cu Cored Sn-3.5Ag Solder, KOHARA Yasuhiro;SAEKI Toshio;UENISHI Keisuke;KOBAYASHI Kojiro F.;SHOHJI Ikuo;YAMAMOTO Masaharu, May 2001, Journal of Japan Institute of Electronics Packaging, 4, 3, 192, 199
• Development of Flip Chip Rework Method for High Dense Printed Circuit Board, MORI Fuminari;TORIYAMA Kazushige;KATSU Naoki;SHOHJI Ikuo, Jul. 2000, Journal of Japan Institute of Electronics Packaging, 3, 4, 335, 338
• Rupture Life of CPS Solder Joints with Sn-Ag Lead-Free Solders under Thermal Cycle Condition, SHOHJI Ikuo;MORI Fuminari;FUJIUCHI Shinichi;YAMASHITA Masaru, Jul. 2001, Journal of Japan Institute of Electronics Packaging, 4, 4, 289, 292
• Effect of Cu Cored Ball in Solder Ball on Microstucture and Strength of BGA Joint Using Electroless Plated Ni/Au Pad, SAEKI Toshio;KIYONO Shinya;UENISHI Keisuke;KOBAYACHI Kojiro f;SHOHJI Ikuo;YAMAMOTO Masaharu, Jul. 2001, Journal of Japan Institute of Electronics Packaging, 4, 4, 306, 311
• Effect of Plate Thickness on Joint Strength of SUS304 Brazed with Nickel-Base Filler Metal for a Heat Exchanger, TAKAYAMA Statoshi;ARIKURA Youhei;SHOHJI Ikuo;NAKAZAWA Takanori;MATSUMOTO Ken;HIKITA Masanori, 2003, 2003, 77, 78
• 2004 Review of Welding in Japan : Micro Joining, IWATA Yoshiharu;SHOJI Ikuo, Jul. 2005, Journal of the Japan Welding Society, 74, 5, 307, 310
• Microstructures and Mechanical Properties of SUS316 Steel Brazed with Cu-7 mass%P Filler, SHOJI Ikuo;FUJIHIRA Mitsuhiro;OGANE Akira;NAKAZAWA Takanori;UENISHI Masahisa;OTOMO Noboru, Nov. 2002, Quarterly journal of the Japan Welding Society., 20, 4, 517, 522
• Low Cycle Fatigue Properties and Surface Feature by an Image Processing of Sn-0.7Cu Lead-free Solder, TAKAHASHI Takehiko;HIOKI Susumu;SHOHJI Ikuo;KAMIYA Osamu, Aug. 2005, QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY, 23, 3, 436, 441

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• Brazing of SUS316 Stainless Steel with Cu-P filler, FUJIHIRA Mitsuhiro;SHOHJI Ikuo;NAKAZAWA Takenori;UENISHI Masahisa;OTOMO Noboru, Mar. 2001, 68, 238, 239
• Aging microstructures of Sn-Zn/Cu lead-free joints, SHOHJI Ikuo;NAKAMURA Takao;MORI Fuminari;FUJIUCHI Shinichi;KOISHI Takazoh, Sep. 2001, 69, 262, 263
• Tensile properties of Sn-Ag lead-free solders, SHOHJI Ikuo;YOSHIDA Tomohiro;TAKAHASHI Takehiko;HIOKI Susumu, Apr. 2002, 70, 134, 135
• Brazing of SUS444 Stainless Steel with Cu-P filler, SHOHJI Ikuo;OGANE Akira;NAKAZAWA Takanori;UENISHI Masahisa;OTOMO Noboru, Apr. 2002, 70, 278, 279
• Effect of Cu Addition to Sn-Pb or Sn-Ag Solder on BGA Joint Microstructure, SAEKI T.;KOHARA Y.;UENISHI K.;KOBAYASHI K. F.;SHOJI I.;YAMAMOTO M., Sep. 2000, 67, 154, 155
• Low-Cycle Fatigue Life Definition for Sn-3.5Ag and Sn-0.7Cu Lead-free Solders Using Surface Deformation, TAKAHASHI Takehiko;HIOKI Susumu;SHOHJI Ikuo;KAMIYA Osamu, Aug. 2006, Quarterly journal of the Japan Welding Society., 24, 3, 253, 258
• Shohji Laboratory Department of Mechanical System Engineering Faculty of Engineering Gunma University, SHOHJI Ikuo, Mar. 2007, Journal of Japan Institute of Electronics Packaging, 10, 2
• Printing Durability of Electroformed Ni-Co Alloy Mesh for Screen Printing, SHOHJI Ikuo;MURATA Yozo;YAMAMOTO Ryoichi;SASAKI Nobuo;TODATE Kousei, Sep. 2007, Journal of Japan Institute of Electronics Packaging, 10, 6, 491, 494
• 208 Interfacial reaction between Sn-Ag-Cu-Ni-Ge lead-free solder and Cu electrode, TSUNODA Satoshi;SHOHJI Ikuo;WATANABE Hirohiko;ASAI Tatsuhiko, 2006, 2006, 47, 48
• 209 Evaluation of thermal stress relief in lead-free solder joint for chip size package by finite element analysis, YOSHIZAWA Keisuke;SHOHJI Ikuo;NISHIMOTO Masaharu;KAWANO Takayuki, 2006, 2006, 49, 50
• 416 Education of installation of large equipment, SHOHJI Ikuo, 2006, 2006, 129, 130
• 「激動の世紀を生きて」, ロバートW.カーン著, 小岩昌宏訳, アグネ技術センター, A5判, 定価2000円+税, 荘司 郁夫, Sep. 2008, Journal of Japan Institute of Electronics Packaging, 11, 6
• Effect of Ge and P Addition in Sn-Ag-Cu-Ni Lead-Free Solder on the Solder Joint Properties, SHOHJI Ikuo;WATANABE Hirohiko;ARAI Ryohei, Nov. 2012, The transactions of the Institute of Electronics, Information and Communication Engineers. C, 95, 11, 324, 332
• Effect of Shear Speed on the Ball Shear Strength of Sn-3Ag-0.5Cu Solder Ball Joints, Shohji Ikuo;Shimoyama Satoshi;Ishikawa Hisao;Kojima Masao, 2008, Transactions of The Japan Institute of Electronics Packaging, 1, 1, 9, 14

  DOI
• Effect of Impurities of Au and Pd on Tensile Properties of Eutectic Sn-Pb Solder for Aerospace Applications, Shohji Ikuo;Saitoh Yuta;Nemoto Norio;Nakagawa Tsuyoshi;Ebihara Nobuaki;Iwase Fusao, 2009, Transactions of The Japan Institute of Electronics Packaging, 2, 1, 29, 34

  DOI
• Comparison of Erosion Rates of SUS304 and SUS316 Stainless Steels by Molten Sn-3Ag-0.5Cu Solder, Shohji Ikuo;Sumiyoshi Kazuhito;Miyazaki Makoto, 2009, Transactions of The Japan Institute of Electronics Packaging, 2, 1, 35, 39

  DOI
• Cu-Sn-Zr-P Alloy for a High-Strength Heat-Exchanger Tube, Ando Tetsuya;Tamagawa Hirokazu;Shohji Ikuo, 2010, Transactions of The Japan Institute of Electronics Packaging, 3, 1, 14, 17

  DOI
• Influence of Processing Temperature on Boriding of SUS304 Stainless Steel by Al Added Fused Salt Bath, KOYAMA Shinji;KAWASUMI Kentaro;FUKUDA Tatsuya;SHOHJI Ikuo, 2011, TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, 77, 783, 1986, 1993

  DOI
• The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint, TSUCHIDA Tetsuyuki;OKUBO Toshikazu;KANO Takahiro;SHOHJI Ikuo, 2012, Journal of The Surface Finishing Society of Japan, 63, 4, 233

  DOI
• Printing Durability of Electroformed Ni-Co Alloy Mesh for Screen Printing, SHOHJI Ikuo;MURATA Yozo;YAMAMOTO Ryoichi;SASAKI Nobuo;TODATE Kousei, 2007, Journal of The Japan Institute of Electronics Packaging, 10, 6, 491, 494

  DOI
• Development of Flip Chip Rework Method for High Dense Printed Circuit Board., MORI Fuminari;TORIYAMA Kazushige;KATSU Naoki;SHOHJI Ikuo, 2000, Journal of The Japan Institute of Electronics Packaging, 3, 4, 335, 338

  DOI
• Evaluation of the Microstructures of CSP Microjoints with Sn-Ag Lead-Free Solders., SHOHJI Ikuo;MORI Fuminari;FUJIUCHI Shinichi;YAMASHITA Masaru, 2001, Journal of The Japan Institute of Electronics Packaging, 4, 2, 133, 137

  DOI
• The Microstructure and Shear Strength of the BGA Joint Using Cu Cored Sn-3.5Ag Solder., KOHARA Yasuhiro;SAEKI Toshio;UENISHI Keisuke;KOBAYASHI Kojiro F.;SHOHJI Ikuo;YAMAMOTO Masaharu, 2001, Journal of The Japan Institute of Electronics Packaging, 4, 3, 192, 199

  DOI
• Effect of Cu Cored Ball in Solder Ball on Microstructure and Strength of BGA Joint Using Electroless Plated Ni/Au Pad., SAEKI Toshio;KIYONO Shinya;UENISHI Keisuke;KOBAYASHI Kojiro F.;SHOHJI Ikuo;YAMAMOTO Masaharu, 2001, Journal of The Japan Institute of Electronics Packaging, 4, 4, 306, 311

  DOI
• Influence of the Diameter of Solder Powder in Solder Paste on the Applied Solder Volume by Paste Printing, SHOHJI Ikuo;SHIRATORI Yuji;MIYAZAKI Makoto, 2004, Journal of The Japan Institute of Electronics Packaging, 7, 1, 62, 66

  DOI
• Ultrasonic Bonding of Resin-Coated Cu Wire for High-Frequency Chip Coils, SHOHJI Ikuo;ARAI Shinji;SAKURAI Tsukasa;KUMEHARA Hiroyuki;USUNAMI Keiji;KIMURA Yoshitaka;SUSAI Takashi, 2004, Journal of The Japan Institute of Electronics Packaging, 7, 7, 622, 628

  DOI
• Microstructures and Mechanical Properties of SUS316 Steel Brazed with Cu-7 mass%P Filler., SHOHJI Ikuo;FUJIHIRA Mitsuhiro;OGANE Akira;NAKAZAWA Takanori;UENISHI Masahisa;OTOMO Noboru, 2002, QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY, 20, 4, 517, 522

  DOI
• Low-Cycle Fatigue Life Definition for Sn-3.5Ag and Sn-0.7Cu Lead-free Solders Using Surface Deformation, TAKAHASHI Takehiko;HIOKI Susumu;SHOHJI Ikuo;KAMIYA Osamu, 2006, QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY, 24, 3, 253, 258

  DOI
• Microstructures and Hardness of Mo Heater Chip Brazed with Au-18 mass%Ni, Shohji Ikuo;Kawabata Yoshinori;Kimura Yoshitaka, 2003, MATERIALS TRANSACTIONS, 44, 5, 866, 869

  DOI
• Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls, Shohji Ikuo;Shiratori Yuji;Yoshida Hiroshi;Mizukami Masahiko;Ichida Akira, 2004, MATERIALS TRANSACTIONS, 45, 3, 754, 758

  DOI
• Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index, Shohji Ikuo;Yasuda Kiyokazu;Takemoto Tadashi, 2005, MATERIALS TRANSACTIONS, 46, 11, 2329, 2334

  DOI
• Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders, Takahashi Takehiko;Hioki Susumu;Shohji Ikuo;Kamiya Osamu, 2005, MATERIALS TRANSACTIONS, 46, 11, 2335, 2343

  DOI
• Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint, Shohji Ikuo;Goto Hiroki;Nakamura Kiyotomo;Ookubo Toshikazu, 2005, MATERIALS TRANSACTIONS, 46, 12, 2725, 2729

  DOI
• Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating, Nakamura Kiyotomo;Shohji Ikuo;Goto Hiroki;Ookubo Toshikazu, 2005, MATERIALS TRANSACTIONS, 46, 12, 2730, 2736

  DOI
• Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions, Shohji Ikuo;Tsunoda Satoshi;Watanabe Hirohiko;Asai Tatsuhiko;Nagano Megumi, 2005, MATERIALS TRANSACTIONS, 46, 12, 2737, 2744

  DOI
• Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders, Shohji Ikuo;Osawa Tsutomu;Matsuki Takashige;Kariya Yoshiharu;Yasuda Kiyokazu;Takemoto Tadashi, 2008, MATERIALS TRANSACTIONS, 49, 5, 1175, 1179

  DOI
• Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode, Shohji Ikuo;Watanabe Hirohiko;Okashita Takeshi;Osawa Tsutomu, 2008, MATERIALS TRANSACTIONS, 49, 7, 1513, 1517

  DOI
• Joint Strength and Microstructure of SUS304 Brazed with Nickel-base Filler Metal for Heat Exchangers, Takayama Satoshi;Arikura Youhei;Shohji Ikuo;Nakazawa Takanori;Matsumoto Ken;Hikita Masanori, 2004, Journal of the Japan Institute of Metals and Materials, 68, 2, 130, 133

  DOI
• Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill, Tohei Tomotake;Shohji Ikuo;Yoshizawa Keisuke;Nishimoto Masaharu;Kawano Takayuki;Mizutani Yumiko;Ohsaki Yoshihiko, 2008, Journal of the Japan Institute of Metals and Materials, 72, 3, 244, 248

  DOI
• A Study of the Effect of Indium Filler Metal on the Bonding Strength of Copper and Tin, Koyama Shinji;Ting Seng Keat;Aoki Yukinari;Shohji Ikuo, 2013, Transactions of The Japan Institute of Electronics Packaging, 6, 1, 93, 98

  DOI
• Effect of Mechanical Properties of Joining Materials for Flip Chip on Thermo-mechanical Stress at Wiring Layer under Flip Chip Pad, HISADA Takashi;SHOHJI Ikuo;YAMADA Yasuharu;FUJIMOTO Kozo, 2014, Journal of Smart Processing, 3, 1, 47, 53

  DOI
• Standardization of method for testing mechanical characteristics of lead-free solder:JIS Z 3198-2, Shohji Ikuo;Hioki Susumu, 2004, Proceedings of JIEP Annual Meeting, 18, 0, 47, 48

  DOI
• Joining of Aluminum to Copper by Sn-Cu Lead-free Solder in Vacuum, Nara Hideaki;Oshiro Itaru;Shohji Ikuo;Otomo Noboru;Uenishi Masahisa, 2009, Preprints of the National Meeting of JWS, 2009, 0, 101, 101

  DOI
• Sn-W Structure Produced at the Interface Between Sn-3Ag-0.5Cu Solder and Plating Metallization on W Substrate, YORITA Chiko;HARADA Masahide;NISHIKAWA Toru;KOBAYASHI Tatsuya;SHOHJI Ikuo, 2014, Journal of Smart Processing, 3, 4, 232, 239

  DOI
• Ability of Low-Ag Lead-free Solder, SHOHJI Ikuo, 2014, JOURNAL OF THE JAPAN WELDING SOCIETY, 83, 7, 528, 530

  DOI
• Participation Report of the 2014 International Conference on Electronics Packaging (ICEP 2014), SHOHJI Ikuo, 2014, JOURNAL OF THE JAPAN WELDING SOCIETY, 83, 7, 571, 573

  DOI
• Effect of Filler Content and Coupling Agent on Mechanical Properties of Underfill Material, Mitsugi Hironao;Kitagoh Shinya;Shohji Ikuo;Koyama Shinji, 2014, Transactions of The Japan Institute of Electronics Packaging, 7, 1, 25, 31

  DOI
• Evaluation on Mechanical Properties of Sn-Bi-Ag Solder and Reliability of the Solder Joint, Shimokawa Hanae;Soga Tasao;Serizawa Koji;Katayama Kaoru;Shohji Ikuo, 2015, Transactions of The Japan Institute of Electronics Packaging, 8, 1, 46, 54

  DOI
• Evaluation of Corrosion Resistance of SUS304 Stainless Steel Joint Brazed with Fe-Cr System Alloy, SHI Kangdao;TSUNODA Takahiro;KUSUMOTO Kazuomi;SHOHJI Ikuo;MATSU Kotaro;TAGUCHI Yasuhiro, 2015, Journal of Smart Processing, 4, 4, 215, 221

  DOI
• Effect of Interfacial Hardness on Failure Modes of Liquid Phase Diffusion Bonded Sn/Sn with Bi Filler, Koyama Shinji;Oya Issei;Shohji Ikuo, 2016, MATERIALS TRANSACTIONS, 57, 6, 810, 814

  DOI
• Special Issue on Frontier Researches Related to Interconnection, Packaging and Microjoining Materials and Microprocessing for Such Materials, Kariya Yoshiharu;Shohji Ikuo, 2016, MATERIALS TRANSACTIONS, 57, 6, 796, 796

  DOI
• Interfacial Reactions in Sn-57Bi-1Ag Solder Joints with Cu and Au Metallization, Hata Hanae;Maruya Yuuki;Shohji Ikuo, 2016, MATERIALS TRANSACTIONS, 57, 6, 887, 891

  DOI
• Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder, Haidong Zhang;Shohji Ikuo;Shimoda Masayoshi;Watanabe Hirohiko, 2016, MATERIALS TRANSACTIONS, 57, 6, 873, 880

  DOI
• In Situ Observation of Self-Annealing Behaviors of (001)-Oriented Electrodeposited Silver Film by EBSD Method, Hayashi Yumi;Miyazawa Hiroshi;Minamitani Kohei;Shohji Ikuo, 2016, MATERIALS TRANSACTIONS, 57, 6, 815, 818

  DOI
• Joint Strength of SUS304 Stainless Steel Joint Brazed with Fe-Cr System Alloy, SHI Kangdao;TSUNODA Takahiro;KUSUMOTO Kazuomi;SHOHJI Ikuo;MATSU Kotaro;TAGUCHI Yasuhiro, 2015, Journal of Smart Processing, 4, 5, 247, 253

  DOI
• Influence of flux residue on reliability for underfill encapsulant, Watanabe Jun;Miyazaki Makoto;Hatsuzawa Kenji;Shohji Ikuo, 2010, Proceedings of JIEP Annual Meeting, 24, 0, 316, 317

  DOI
• The investigation about applicability of Fe-MWCNT composite film to lead free solder iron chip, Watanabe Jun;Sekimori Norihisa;Miyazaki Makoto;Hatsuzawa Kenji;Uetani Takashi;Shohji Ikuo, 2011, Proceedings of JIEP Annual Meeting, 25, 0, 391, 392

  DOI
• Effect of bond force profile on bondability of thermosonic flip chip bonding, TOMIOKA Taizo;IGUCHI Tomohiro;SHOHJI Ikuo, 2018, QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY, 36, 1, 16, 20

  DOI
• Fabrication of Aluminum Foam by Casting Precursor Method, Suzuki Ryosuke;Nishimoto Takuma;Hangai Yoshihiko;Shoji Ikuo;Matsubara Masaaki, Sep. 2018, Journal of the Japan Institute of Metals and Materials, 82, 9, 349, 357

  DOI
• IMC Pillar Dispersed Lead-free Solder Joint, NAKATA Yusuke;HASHIMOTO Tomihito;HAYASHI Yawara;SHOHJI Ikuo, 2016, Journal of Smart Processing, 5, 5, 309, 314

  DOI
• Liquid Phase Diffusion Bonding of Aluminum Casting Alloy by Using Metal Salt Coated Zn Sheet, SAIJO Shunya;KOYAMA Shinji;SHOHJI Ikuo, 2017, Journal of Smart Processing, 6, 5, 195, 199

  DOI
• Evaluation of Deterioration Life of Interface of Copper and Epoxy Resin under High Temperature and High Humidity Conditions, TONOZUKA Yu;KOBAYASHI Tatsuya;SHOHJI Ikuo;HOKAZONO Hiroaki;TAKAHASHI Kuniaki;EZURE Toku, 2018, Journal of Smart Processing, 7, 4, 128, 134

  DOI
• Optimization of Sintering, Cold-forging and Carburizing Processes to Improve Toughness and Fatigue Strength of Sintered Mo-Alloyed Steel, KAMAKOSHI Yuichiroh;SHOHJI Ikuo;INOUE Noriko;FUKUDA Shunji, 2018, Journal of Smart Processing, 7, 6, 251, 259

  DOI
• Bondability Investigations of Thermosonic Flip Chip Bonding Using Ultrasonic Vibration Perpendicular to the Interface, Tomioka Taizo;Shohji Ikuo, 2019, Transactions of The Japan Institute of Electronics Packaging, 12, 0, E18-013-1, E18-013-7

  DOI
• Robustness Improvement of Thermosonic Flip Chip Bonding to Device Chip Tilt, TOMIOKA Taizo;IGUCHI Tomohiro;SHOHJI Ikuo, 2019, Journal of the Japan Society for Technology of Plasticity, 60, 700, 142, 146

  DOI
• PREFACE, Shohji Ikuo;Kariya Yoshiharu, Jun. 2019, MATERIALS TRANSACTIONS, 60, 6, 849, 849

  DOI
• Effects of Ni Addition to Sn–5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties, Kobayashi Tatsuya;Mitsui Kohei;Shohji Ikuo, 2019, MATERIALS TRANSACTIONS, 60, 6, 888, 894

  DOI
• Effect of Bi Addition on Tensile Properties of Sn–Ag–Cu Solder at Low Temperature, Hirai Yukihiko;Oomori Kouki;Morofushi Hayato;Shohji Ikuo, Jun. 2019, MATERIALS TRANSACTIONS, 60, 6, 909, 914

  DOI
• High Reliable Bonding Technology by Intermetallic Compound (IMC) Pillar Dispersed Lead-free Solder Joint, ;;;;, 2016, Proceedings of Microelectronics Symposium, 26, 0, 119, 122

  DOI
• Investigation of Degradation Behavior of Cohesion of Resin and Adhesion Interface under High Temperature and High Humidity Conditions, ABIKO Hitomi;SHOHJI Ikuo;KOBAYASHI Tatsuya;TOMITA Yugo;MATSUNAGA Tatsunori, 2019, Journal of Smart Processing, 9, 2, 75, 81

  DOI
• Corrosion Behavior of Nickel-based Brazing Filler Metal for Stainless Steel Heat Exchanger, FUKAI Yusuke;SHOHJI Ikuo;KOBAYASHI Tatsuya;ANDO Tetsuya;YOSHIDA Takuya;KASHIWASE Tsuyoshi;OTOMO Noboru, 2019, Journal of Smart Processing, 9, 3, 127, 132

  DOI
• Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Lead-free Solder Alloy on its Mechanical Properties, MITSUI Kohei;SHOHJI Ikuo;KOBAYASHI Tatsuya;WATANABE Hirohiko, 2019, Journal of Smart Processing, 9, 3, 133, 139

  DOI
• The influence of Additives in Lead-free Electroless Nickel Plating Film on the Reliability of Solder Joint, ;;;, 2012, Proceedings of Microelectronics Symposium, 22, 0, 141, 144

  DOI
• Fabrication of Porous Aluminum Alloy by Precursor Method Using Vertical Type Twin-Roll Casting, Suzuki Ryosuke;Masubuchi Takumi;Nishida Shinichi;Shoji Ikuo;Hangai Yoshihiko;Fujii Hidetoshi;Matsubara Masaaki, Nov. 2020, Journal of Japan Foundry Engineering Society, 92, 11, 577, 582

  DOI
• The influence of lead and sulfur contained in electroless nickel plating film on the reliability of solder joint with the electroless Ni/ Pd/Au plating, ;;;, 2011, Proceedings of Microelectronics Symposium, 21, 0, 145, 148

  DOI
• Effect of Si Concentration of a Brazing Precursor on the Bonding Strength of Aluminum Foam Bonded via Foaming Bonding, Suzuki Ryosuke;Hangai Yoshihiko;Asakawa Yusuke;Shohji Ikuo;Fujii Hidetoshi;Matsubara Masaaki, Aug. 2021, MATERIALS TRANSACTIONS, 62, 8, 1210, 1215

  DOI
• 鋳造を利用したプリカーサ法における溶湯への増粘剤粒子添加方法の検討, ;;;;, 2021, Journal of the Reports of the Japan Foundry Engineering Society Meeting, 177, 0, 102, 102

  DOI
• Investigation of Mechanical Properties of High Tg Epoxy Resin Material, ZHAO Xinya;MITSUGI Hironao;SHOHJI Ikuo;KOBAYASHI Tatsuya, 2021, Journal of Smart Processing, 10, 6, 365, 371

  DOI
• Deterioration Behavior of Epoxy Resin for Electronics Packaging and Its Adhesive Joint with Ni by Water Absorption, MITSUGI Hironao;SUZUKI Riku;SHOHJI Ikuo;KOBAYASHI Tatsuya, 2021, Journal of Smart Processing, 10, 6, 359, 364

  DOI
• Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder., Yamamoto Mizuki;Shohji Ikuo;Kobayashi Tatsuya;Mitsui Kohei;Watanabe Hirohiko, Jul. 2021, Materials (Basel, Switzerland), 14, 14

  DOI
• Microstructure and Fatigue Behaviors of Dissimilar A6061/Galvannealed Steel Joints Fabricated by Friction Stir Spot Welding., Kumamoto Koki;Kosaka Tsuyoshi;Kobayashi Tatsuya;Shohji Ikuo;Kamakoshi Yuichiro, Jul. 2021, Materials (Basel, Switzerland), 14, 14

  DOI
• Microstructure and Properties of SUS304 Stainless Steel Joints Brazed with Electrodeposited Ni-Cr-P Alloy Coatings., Liu Shubin;Shohji Ikuo;Kobayashi Tatsuya;Osanai Katsuharu;Ando Tetsuya;Hirohashi Junichiro;Wake Tsunehito;Inoue Katsufumi;Yamamoto Hiroki, Jul. 2021, Materials (Basel, Switzerland), 14, 15

  DOI
• Low Cycle Fatigue Characteristics of Oxygen-Free Copper for Electric Power Equipment., Tanaka Takuma;Sugioka Togo;Kobayashi Tatsuya;Shohji Ikuo;Shimada Yuya;Watanabe Hiromitsu;Kamakoshi Yuichiro, Jul. 2021, Materials (Basel, Switzerland), 14, 15

  DOI
• Correction: Liu et al. Microstructure and Properties of SUS304 Stainless Steel Joints Brazed with Electrodeposited Ni-Cr-P Alloy Coatings. Materials 2021, 14, 4216., Liu Shubin;Shohji Ikuo;Kobayashi Tatsuya;Osanai Katsuharu;Ando Tetsuya;Hirohashi Junichiro;Wake Tsunehito;Inoue Katsufumi;Yamamoto Hiroki, Sep. 2021, Materials (Basel, Switzerland), 14, 19

  DOI
• Effects of Ni Addition to Sn–5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties, Kobayashi Tatsuya;Mitsui Kohei;Shohji Ikuo, Jun. 2019, MATERIALS TRANSACTIONS, 60, 6, 888, 894

  DOI

MISC

• Effect of HIgh Temperature and Humidity on Bond Strength of Al/Resin Adhesive Joints, Itsuki Watanabe, Tatsuya Kobayashi, Ikuo Shohji, 02 Jul. 2023, Abstract Book of THERMEC'2023, 597, 598
• Effect of Special Plating Films on Galvanic Corrosion Behavior between Metal and CFRTP, Kei Shimizu, Ikuo Shohji, Tatsuya Kobayashi, 02 Jul. 2023, Abstract Book of THERMEC'2023, 524, 525
• Effect of Plating Potential on Three-Dimensional Structural Plating Films and Their Adhesion to Epoxy Resin, Thai Anh Pham, Ikuo Shohji, Tatsuya Kobayashi, 02 Jul. 2023, Abstract Book of THERMEC'2023, 464, 465
• Effect of Sb Addition on Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Ball Joints, Marina Oyama, Tatsuya Kobayashi, Ikuo Shohji, Mohd Arif Anuar Mohd Salleh, 02 Jul. 2023, Abstract Book of THERMEC'2023, 445
• Microstructure and Mechanical Properties ofA6061/GA980 Resistance Spot Weld, Toshiki Nonomura, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Muneyoshi Iyota, 02 Jul. 2023, Abstract Book of THERMEC'2023, 430
• Investigation of deposition conditions and basic properties of CNF composite Ni plated film by electroless plating method, Wataru Kawanabe, Makoto Iioka, Tatsuya Kobayashi, Ikuo Shohji, 02 Jul. 2023, Abstract Book of THERMEC'2023, 300
• Investigation of Effects of Electroplating Conditions on Morphology of TEMPO Oxidized Cellulose Nanofiber Composited Nickel Films, Makoto Iioka, Wataru Kawanabe, Tatsuya Kobayashi, Ikuo Shohji, 02 Jul. 2023, Abstract Book of THERMEC'2023, 263, 264
• Fabrication of High-Temperature Solder by Zn Plating Films Containing Al Particles, Yuki Abiko, Ikuo Shohji, Tatsuya Kobayashi, 02 Jul. 2023, Abstract Book of THERMEC'2023, 88, 89
• Al/エポキシ樹脂接着部の高温高湿環境下における劣化挙動, 渡部樹, 荘司郁夫, 小林竜也, 24 Jan. 2023, 277, 278
• 高温高湿環境下における鋼/Al 合金接着剤継手強度に及ぼすTi 系化成処理の影響, 小坂豪志, 荘司郁夫, 小林竜也, 24 Jan. 2023, 271, 276
• 高温対応燃料電池用ステンレス鋼の Cr フリーろう材によるろう付, 松尾祐哉, 塚越皓也, 荘司郁夫, 小林竜也, 広橋順一郎, 井上勝文, 和氣庸人, 山本巨紀, 24 Jan. 2023, 211, 212
• 無電解法によるニッケルめっき膜へのセルロースナノファイバー複合化手法の検討, 川鍋渉, 飯岡諒, 荘司郁夫, 小林竜也, 24 Jan. 2023, 179, 180
• 複合めっき法による Zn-Al 系はんだめっきの作製と特性評価, 安彦祐輝, 荘司郁夫, 小林竜也, 24 Jan. 2023, 177, 178
• Al 粒子を用いた液相焼結型接合材の開発, 小林竜也, 荘司郁夫, 24 Jan. 2023, 175, 176
• 特殊めっき膜を用いた金属-CFRTP 接合におけるガルバニック腐食の抑制評価, 清水憩, 荘司郁夫, 小林竜也, 24 Jan. 2023, 171, 174
• 三次元構造めっき膜の電気化学的挙動とその応用, PHAM THAI ANH, 荘司郁夫, 小林竜也, 24 Jan. 2023, 167, 170
• Sn-3.0Ag-0.5Cu はんだボール接合部のミクロ組織およびせん断強度に及ぼす Sb 添加の影響, 小山真里奈, 荘司郁夫, 小林竜也, モハド・アリフ・アヌアル・モハド・サレー, 24 Jan. 2023, 152, 157
• Sn-58Bi はんだとの界面反応抑制効果を有するプローブ材の開発, 渡會和己, 荘司郁夫, 小林竜也, 星野智久, 佐藤賢一, 小谷直仁, 小林俊介, 24 Jan. 2023, 146, 151
• Deteriorated Characteristics on the Fatigue Strength of Dissimilar A6061/Galvannealed Steel Joints Fabricatedby Friction Stir Spot Welding, A. Toshimitsu Yokobori, Jr, Toshihito Ohmi, Go Ozeki, Ikuo Shohji, Tsutomu Katsumata and Toru Matsubara, Jul. 2022, Proc. of IIW2022 - International Conference on Welding and Joining, 309, 311
• Joining Dissimilar Materials Using Three- Dimensional Electrodeposited Film, T. Kobayashi, K. Yamazaki, I. Shohji, May 2022, ICEP2022 Proceedings, P06, 219, 220
• Development of Sn Solder Plating Containing Cellulose Nanofiber, T. Kobayashi, A. Kogure, I. Shohji, May 2022, ICEP2022 Proceedings, P05, 217, 218
• Formation of Specially Shaped Plating Film by Nickel–Copper Alloy Electrodeposition, T. Kobayashi, A. Kubo, I. Shohji, May 2022, ICEP2022 Proceedings, P04, 215, 216
• Effect of Wetting Agent on Morphology of Cellulose Nano-Fiber Composited Nickel Electroless Plating Film, M. Iioka, W. Kawanabe, I. Shohji, T. Kobayashi, May 2022, ICEP2022 Proceedings, FD3-2, 181, 182
• Effect of High Temperature and High Humidity Enviromment on Adhesion Strength of High Tg Epoxy Resin and Copper Joint, X. Zhao, H. Mitsugi, I. Shohji, T. Kobayashi, May 2022, ICEP2022 Proceedings, WE1-1, 29, 30
• スズ-セルロースナノファイバー複合めっきによる鉛フリーはんだの創製, 木暮明勇輝, 荘司郁夫, 小林竜也, Feb. 2022, Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., 257, 258
• 特殊形状めっき膜を用いた高撥水化技術の開発, 久保瑛史, 荘司郁夫, 小林竜也, Feb. 2022, Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., 249, 252
• パワー半導体用Sn-Sb-Ag系はんだ接合部のパワーサイクル損傷挙動に及ぼす添加元素の影響, 山中佑太, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦, Feb. 2022, Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., 157, 162
• 高温環境下でのSn-Sb-Ag-Ni-Ge系はんだ合金の機械的特性および疲労劣化挙動, 山本瑞貴, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦, Feb. 2022, Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., 137, 142
• Ni-P-Cr合金めっき膜を用いたSUS304鋼のろう付, 松尾祐哉, 劉澍彬, 荘司郁夫, 小林竜也, 広橋順一郎, 和氣庸人, 山本巨紀, Feb. 2022, Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., 116, 119
• Sn-Sb-Ag系鉛フリーはんだ接合部のボールせん断強度に及ぼす添加元素の影響, 赤石瑞季, 小山真里奈, 山本瑞貴, 山中佑太, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦, Feb. 2022, Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., 101, 102
• Pd-Cu-Ag-Zn合金/Sn-58Biはんだ界面における反応層成長挙動, 渡會和己, 荘司郁夫, 小林竜也, 星野智久, 佐藤賢一, 小林俊介, 小谷直仁, Feb. 2022, Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., 94, 98
• Effect of Aging Time on Strength of High Tg Epoxy Resin for Electronic Packaging and Its Joint with Copper, Xinya ZHAO, Hironao MITSUGI, Ikuo Shohji, and Tatsuya Kobayashi, Feb. 2022, 76, 77
• 特殊形状めっき膜を用いた金属/CFRTPの接合特性, 山﨑康平, 荘司郁夫, 小林竜也, Feb. 2022, Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., 50, 53
• 無電解めっき法によるセルロースナノファイバー含有ニッケル複合めっき成膜の検討, 飯岡諒, 川鍋渉, 荘司郁夫, 小林竜也, Feb. 2022, Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., 46, 47
• EBSD 法による電力機器用無酸素銅の低サイクル疲労損傷挙動調査, 椙岡桐吾, 田中拓真, 荘司郁夫, 小林竜也, 嶋田祐也, 渡辺広光, Feb. 2022, Mate 2022(Microjoining and Assembly Technology in Electronics) Proc., 13, 16
• セルロースナノファイバ含有ニッケル電解複合めっきの共析機構に関する初期的考察, 飯岡諒, 荘司郁夫, 小林竜也, Sep. 2021, 275, 278
• Sn-Sb-Ag 系高温鉛フリーはんだの機械的特性およびミクロ組織に及ぼす微量添加元素の影響, 山本瑞貴, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦, Jun. 2021
• Microstructure and Tensile Properties of Sn-Ag-Cu-In-Sb Lead-free Solder, Yukihiko Hirai, Kouki Oomori, Hayato Morofushi, Ikuo Shohji, Jun. 2021, THERMEC' 2021 Virtual Program, 110
• Accuracy Assessment of Quantification Method of Cellulose Nano-Fiber in Nickel Plating Film Using Image Analysis, Makoto Iioka, Ikuo Shohji, Tatsuya Kobayashi, May 2021, ICEP 2021 Proceedings, 07, 177, 178
• Sn-Sb-Ag系高温鉛フリーはんだのミクロ組織および疲労特性に及ぼす添加元素の影響, 山本瑞貴, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦, Feb. 2021, 308, 313
• パワー半導体用Sn-Sb-Ag系はんだ接合部のパワーサイクル損傷挙動, 山中佑太, 荘司郁夫, 小林竜也, 渡邉裕彦, Feb. 2021, 304, 305
• セルロースナノファイバー含有ニッケル複合めっき成膜条件の基礎研究, 飯岡諒, 荘司郁夫, 小林竜也, Feb. 2021, 290, 291
• 電解めっきを用いたNiろう被膜の創製, Liu Shubin, 荘司郁夫, 小林竜也, 広橋純一郎, 和気庸人, 鎌腰雄一郎, Feb. 2021, 276, 277
• A6061/亜鉛メッキ鋼板摩擦撹拌点接合部の疲労特性, 熊本光希, 荘司郁夫, 小林竜也, Feb. 2021, 272, 275
• マルチマテリアル用Fe/Alレーザ溶接部のミクロ組織と機械的特性, 中山耕作, 荘司郁夫, 小林竜也, 松永達則, Feb. 2021, 246, 249
• ビスフェノールＦ型エポキシ樹脂/はんだ接着界面の強度評価, 三ツ木寛尚, 鈴木陸, 荘司郁夫, 小林竜也, Feb. 2021, 127, 128
• 車載用マルチマテリアル抵抗接合部のミクロ組織および機械的特性評価, 荘司 郁夫、熊本 光希、伊與田 宗慶, Aug. 2020, 7, 11, 50, 54
• Society5.0のエネルギーシステムを支える革新的接合材料, 荘司郁夫, 小林竜也, Jun. 2020, 71, 6, 365, 370
• ウエルドボンド向け構造用接着剤の吸水劣化メカニズム, 荘司郁夫, 安孫子瞳, 冨田雄吾, 松永達則, 飯塚隆, Jun. 2020, 68, 6, 102, 107
• Large area bonding for power devices by pillar-like IMC effective dispersion control, Ikuo Shohji, Tatsuya Kobayashi, Yusuke Nakata, Feb. 2020, Impact, 2020, 1, 76, 78

  DOI
• Fe/Al異材マイクロ接合部の接合強度に及ぼす金属間化合物層の影響, 熊本光希, 荘司郁夫, 小林竜也, 伊與田宗慶, Jan. 2020, 293, 296
• 電析Ni-P非晶質合金被膜を利用したステンレス鋼の接合, 橋本晏奈, 荘司郁夫, 小林竜也, 劉澍彬, 広瀬順一郎, 和氣庸人, 鎌腰雄一郎, Jan. 2020, 273, 276
• Alの固相拡散接合に及ぼす電解水水溶液による表面処理の影響, 田中拓真, 荘司郁夫, 小林竜也, 今井久司, Jan. 2020, 265, 268
• Sn-Sb-Ag系合金の高温疲労特性に及ぼすNiおよびGe添加の影響, 三ツ井恒平, 荘司郁夫, 小林竜也, 渡邉裕彦, Jan. 2020, 187, 192
• ビスフェノールF型エポキシ樹脂/銅接着界面の劣化寿命に及ぼす時効条件の影響, 鈴木陸, 荘司郁夫, 小林竜也, 戸野塚悠, Jan. 2020, 143, 146
• Degradation Mechanism of Structural Adhesive under High Temperature and High Humidity Conditions, Hitomi ABIKO, Kosaku NAKAYAMA, Tatsuya KOBAYASHI, Ikuo SHOHJI, Yugo TOMITA, Tatsunori MATSUNAGA, Nov. 2019, Proc. of Visual-JW2019 & WSE 2019, PT-34, 231, 232
• Investigation of High Temperature Fatigue Properties and Microstructures of Sn-Sb-Ag alloys, Kohei MITSUI, Tatsuya KOBAYASHI, Ikuo SHOHJI, Hirohiko WATANABE, Nov. 2019, Proc. of Visual-JW2019 & WSE 2019, PT-42, 247, 248
• Investigation of Corrosion Resistance of Nickel-based Brazing Filler Metal for Stainless Steel by Electrochemical Measurement, Yusuke FUKAI, Tatsuya KOBAYASHI, Ikuo SHOHJI, Tetsuya ANDO, Takuya YOSHIDA, Tsuyoshi KASHIWASE, Noboru OTOMO, Nov. 2019, Proc. of Visual-JW2019 & WSE 2019, PT-41, 245, 246
• 熱交換器用Niろうの電気化学測定による腐食挙動調査, 深井祐佑, 荘司郁夫, 安藤哲也, 吉田拓也, 柏瀬毅, 大友昇, Jan. 2019, 375, 378
• Sn-５SbおよびSn-Sb-Ag三元共晶合金の高温疲労特性, 三ツ井恒平, 荘司郁夫, Jan. 2019, 327, 332
• 構造用接着剤の接着強度の劣化に及ぼす高温高湿環境の影響, 安孫子瞳, 荘司郁夫, 清水誠吾, 冨田雄吾, Jan. 2019, 213, 216
• Sn-Sb-Ni系高温用鉛フリーはんだの微細組織及び機械的特性, 小林竜也, 三ツ井恒平, 荘司郁夫, 2019, 321, 326
• Finite Element Method Analysis of Densification Process of Sintered Steel for Automobile in Cold Forging, Y. Morokuma, Y. Kamakoshi, S.Nishida, I. Shohji, 2019, ATE-2018 Conference Abstract Proceeding DVD, 14
• Residual Stress Analysis in Glass Substrate for Electronic Packaging byFinite Element Method, A. Shinohara, I. Shohji, and Y. Umemura, Dec. 2018, Final Program & Abstract Book of 4th International Conference on Nanojoining and Microjoining 2018 (NMJ2018), P32
• Micro-brazing of Stainless Steel using Ni-P Alloy Plating, Shubin Liu, Ikuo Shohji, Makoto Iioka, Anna Hashimoto, Junichiro Hirohashi,Tsunehito Wake and Susumu Arai, Dec. 2018, Final Program & Abstract Book of 4th International Conference on Nanojoining and Microjoining 2018 (NMJ2018), P31
• Erosion Resistance Properties of Iron-carbon Composite Plating to MoltenLead-free Solder, J. Watanabe, K. Hatsuzawa, S. Ogata, S. Yoshida, and I. Shohji, Dec. 2018, Final Program & Abstract Book of 4th International Conference on Nanojoining and Microjoining 2018 (NMJ2018), P21
• Effect of Ni Addition on Tensile and Fatigue Properties of Sn-Sb Alloy, T. Kobayashi, K. Mitsui, and I. Shohji, Dec. 2018, Final Program & Abstract Book of 4th International Conference on Nanojoiningand Microjoining 2018 (NMJ2018), P16
• 次世代鉛フリーはんだの動向と高信頼性接合　-低温鉛フリーはんだを用いた高融点接合部の創製‐, 荘司郁夫, Sep. 2018, 28, 9, 46, 50
• Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge Lead-Free Solder, Masaki Yokoi, Kobayashi Tatsuya, Shohji Ikuo, Jul. 2018, Book of abstracts of THERMEC'2018, 1548, 1045
• Investigation of Crack initiation in Glass Substrate by Residual Stress analysis, Amon Shinohara, Kobayashi Tatsuya, Shohji Ikuo, Umemura Yuki, Jul. 2018, Book of abstracts of THERMEC'2018, 1519, 1028
• A Study on Reliability of Pillar-Shaped intermetallic Compounds Dispersed Lead-Free Solder Joint, Yusuke Nakata, Kurasawa Motoki, Hashimoto Tomihito, Miki Kenji, Shohji Ikuo, Jul. 2018, Book of abstracts of THERMEC'2018, 1492, 1012
• Plastic Deformation Simulation of Sintered Ferrous Material in Cold-Forging Process, Yuki Morokuma, Nishida Shinichi, Kamakoshi Yuichiro, Kanbe Koshi, Kobayashi Tatsuya, Shohji Ikuo, Jul. 2018, Book of abstracts of THERMEC'2018, 1487, 1009
• Effect of Cooling Rate on intermetallic Compounds Formation in Sn-Ag-Cu-In Solder, Kenji Miki, Kobayashi Tatsuya, Shohji Ikuo, Nakata Yusuke, Jul. 2018, Book of abstracts of THERMEC'2018, 1479, 1004
• Microstructure and Mechanical Properties of Welded Joints of Several High Tensile Strength Steel, Takahiro Izumi, Kobayashi Tatsuya, Shohji Ikuo, Miyanaga Hiroaki, Jul. 2018, Book of abstracts of THERMEC'2018, 1445, 984, 985
• マルチスケール組織・界面制御学研究室の取り組み, 荘司郁夫, Jun. 2018, 2018年6月21日・29日, 31・26
• 有限要素法による多孔質材料の大変形シミュレーション, 諸隈湧気, 鎌腰雄一郎, 西田進一, 荘司郁夫, Jan. 2018, 257, 260
• 有限要素解析によるガラス基板のき裂発生メカニズムの調査, 篠原亜門, 荘司郁夫, 梅村優樹, Jan. 2018, 221, 224
• 高温高湿試験による銅/エポキシ樹脂接着界面の寿命評価, 戸野塚悠, 荘司郁夫, 外薗洋昭, 高橋邦明, 江連徳, Jan. 2018, 109, 114
• Sn-Ag-Cu-Ni-Ge微小試験片の引張特性および疲労特性に及ぼす温度の影響, 横井雅輝, 荘司郁夫, Jan. 2018, 75, 78
• Sn-57Bi-1Ag 鉛フリーはんだを用いた低温接合に及ぼすAg 電極材の影響, 丸屋優樹, 秦英恵, 荘司郁夫, Jan. 2018, 61, 64
• ピラー状金属間化合物分散鉛フリーはんだ接合部の信頼性に関する検討, 中田裕輔, 林和, 倉澤元樹, 橋本富仁, 三木健司, 荘司郁夫, Jan. 2018, 21, 24
• ピラー状金属間化合物分散鉛フリーはんだ接合部生成に及ぼす冷却速度の影響, 三木健司, 荘司郁夫, 中田裕輔, 林和, Jan. 2018, 17, 20
• Comparison between Sn-Sb and Sn-Ag-Cu-Ni-Ge alloys in Tensile Properties Using Miniature Size Specimen, Tatsuya Kobayashi, Masaki Yokoi, Kyosuke Kobayashi, Kohei Mitsui, Ikuo Shohji, Nov. 2017, The Electronic Packaging Interconnect Technology Symposium (EPITS 2017) Conference Program Book, 24
• Novel Development of Lead-free Solder and Their Mechanical Properties, Ikuo Shohji, Nov. 2017, The Electronic Packaging Interconnect Technology Symposium (EPITS 2017) Conference Program Book
• Change in Chemical Structure of Structural Adhesive under High Temperature and Humidity Conditions, Yugo Tomita, Ikuo Shohji, Shinji Koyama, Seigo Shimizu, Aug. 2017, Program of InterPACK2017, 64
• Corrosion Behavior of Copper-Based Heat Pipe Materials in Aqueous Propylene Glycol with Rust Inhibitor, Kazunari Higuchi, Ikuo Shohji, Shinji Koyama, Tetsuya Ando, Yoshikazu Mizutani, Yukio Inoue, Aug. 2017, Program of InterPACK2017, 64
• Effect of Surface Finish of Cu Electrode on Characteristics of High Melting Point Joint Using Sn-57Bi-1Ag, Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama, Aug. 2017, Program of InterPACK2017, 63
• Temperature Dependency of Adhesion Strength of Resin/Cu Interface and its Degradation Mechanism under Aging, Yu Tonozuka, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono, Aug. 2017, Program of InterPACK2017
• Improvement of Mechanical Strength of Sintered Mo Alloyed Steel by Optimization of Sintering and Cold-Forging Processes with Densificatiom, Y Kamakoshi, I Shohji, Y Inoue, S Fukuda, Aug. 2017, ICMER2017 Proceedings, IC011, 13, 14
• Finite Element Method Analysis of Cold-forging For Deformation and Densification of Mo alloyed Sintered Steel, Y Kamakoshi, S Nishida, K Kanbe, I Shohji, Aug. 2017, ICMER2017 Proceedings, IC012
• Formation Mechanism of Pillar-Shaped Intermetallic Compounds Dispersed Lead-Free Solder Joint, Y Nakata, T Hashimoto, M Kurasawa, Y Hayashi, I Shohji, Aug. 2017, ICMER2017 Proceedings, IC014
• Electrochemical Corrosion of Copper and Copper Alloy in Aqueous Propylene Glycol Containing Rust Inhibitors, Kazunari Higuchi, Ikuo Shohji, Tetsuya Ando, Shinji Koyama, Yoshikazu Mizutani, Yukio Inoue, Apr. 2017, ICEP 2017 Proceedings, P14, 582, 585
• Effect of Aging and Test Temperature on Adhesion Strength of Copper and Epoxy Resin, Yu Tonozuka, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono, Apr. 2017, ICEP 2017 Proceedings, P09, 563, 565
• Effect of High Temperature and Humidity Treatment on Adhesion Properties and Bulk Properties of Structural Adhesive, Yugo Tomita, Ikuo Shohji, Shinji Koyama, Seigo Shimizu, Apr. 2017, ICEP 2017 Proceedings, P08, 559, 562
• Fabrication of High Melting Point Joint using Sn-57Bi-1Ag Low Temperature Lead-free Solder and Gold-plated Electrode, Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama, Apr. 2017, ICEP 2017 Proceedings, P06, 551, 554
• A6061/SUS316Lの固相接合強度に及ぼすギ酸を用いた金属塩生成処理の効果, 齋藤広輝, 石原重憲, 鶴岡茂樹, 小山真司, 荘司郁夫, Jan. 2017, 445, 446
• (001)および(111)配向銀めっき皮膜のセルフアニーリング過程における再結晶挙動, 林佑美, 荘司郁夫, 小山真司, 宮澤寛, Jan. 2017, 439, 440
• 電気化学的測定法を用いた銅及び銅合金の腐食特性に及ぼすブライン中の防錆剤の影響調査, 樋口和成, 荘司郁夫, 小山真司, 安藤哲也, 水谷佳一, 井上行雄, Jan. 2017, 419, 424
• インサート材の金属塩被膜付与条件の最適化と鋳造用Al合金の接合界面への適用, 西城舜哉, 小山真司, 荘司郁夫, Jan. 2017, 401, 404
• 構造用接着剤の接着強度の劣化に及ぼす破壊形態および加水分解の影響, 冨田雄吾, 荘司郁夫, 小山真司, 清水誠吾, Jan. 2017, 227, 230
• 時効による高分子結合の変化に伴うエポキシ樹脂と銅との接着強度劣化挙動, 戸野塚悠, 荘司郁夫, 小山真司, 外薗洋昭, Jan. 2017, 223, 226
• ピラー状金属間化合物分散鉛フリーはんだ接合の形成メカニズムに関する検討, 中田裕輔, 倉澤元樹, 橋本富仁, 林和, 荘司郁夫, Jan. 2017, 159, 162
• ピラー状金属間化合物分散鉛フリーはんだ接合部の生成に及ぼす諸条件の効果, 林和, 荘司郁夫, 小山真司, 中田裕輔, 橋本富仁, Jan. 2017, 155, 158
• Sn-5Sbの機械的特性とパワーサイクル環境下におけるSn-5Sb接合部の特性変化, 小林恭輔, 荘司郁夫, 小山真司, 外薗洋昭, Jan. 2017, 141, 144
• Sn-57Bi-1Ag鉛フリーはんだ接合部のミクロ組織と接合強度に及ぼす電極材の影響, 丸屋優樹, 秦英恵, 荘司郁夫, 小山真司, Jan. 2017, 99, 102
• Liquid Phase Diffusion Bonding of AC2C and ADC12 Aluminum Casting Alloy by using Metal Salt Coated Zn Sheet, Shunya Saijo, Shinji Koyama, Ikuo Shohji, Nov. 2016, ABSTRACTS & PROGRAMME BOOK of AMPT2016, 063, 72
• Fracture Behaviours of Miniature Size Specimens of Sn-5Sb Lead-free Solder under Tensile and Fatigue Conditions, Kyosuke Kobayashi, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono, Nov. 2016, ABSTRACTS & PROGRAMME BOOK of AMPT2016, 062, 71
• Effect of Rust Inhibitor in Brine on Corrosion Properties of Copper, Kazunari Higuchi, Ikuo Shohji, Tetsuya Ando, Shinji Koyama, Nov. 2016, ABSTRACTS & PROGRAMME BOOK of AMPT2016, 058, 69
• Degradation Behaviors of Adhesion Strength Between Epoxy Resin and Copper under Aging at High Temperature, Yu Tonozuka, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono, Nov. 2016, ABSTRACTS & PROGRAMME BOOK of AMPT2016, 057, 69
• Degrdation Behaviors of Adhesion Strength of Structual Adhesive for Weld-Bonding under High Temperature and Humidity Conditions, Yugo Tomita, Ikuo Shohji, Shinji Koyama, Seigo Shimizu, Nov. 2016, ABSTRACTS & PROGRAMME BOOK of AMPT2016, 055, 68
• Bonding Characteristics of Sn-57Bi-1Ag Low-Temperature Lead-Free Solder to Gold-Plated Copper, Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama, Nov. 2016, ABSTRACTS & PROGRAMME BOOK of AMPT2016, 054, 67
• Change of Several Characteristics in Self-annealing of (001) Oriented Electrodeposited Silver Films, Yumi Hayashi, Ikuo Shohji, Shinji Koyama, Hiroshi Miyazawa, Nov. 2016, ABSTRACTS & PROGRAMME BOOK of AMPT2016, 053, 67
• Effect of Bonding Time and Bonding Temperature on Lead-Free Solder Joints Dispersed Pillar Shaped IMCS, Yawara Hayashi, Yusuke Nakata, Ikuo Shohji, Shinji Koyama, Tomohito Hashimoto, Nov. 2016, ABSTRACTS & PROGRAMME BOOK of AMPT2016, 052, 66
• ピラー状金属間化合物（ＩＭＣ）分散鉛フリーはんだ接合による高信頼性化検討, 中田裕輔，倉澤元樹，橋本富仁，林和，荘司郁夫, Sep. 2016, 119, 122
• パワーモジュール向けピラー状IMC分散鉛フリーはんだ接合部の開発, 中田裕輔, 橋本富仁, 林和, 荘司郁夫, May 2016, 14, 23
• Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-free Solder, Kyosuke Kobayashi, Ikuo Shohji, Hiroaki Hokazono, May 2016, Book of abstracts of THERMEC'2016, 516, 301
• Comparison of Self-annealing Behaviors in (001)- and (111)-Oriented Electrodeposited Silver Films by In Situ EBSP Analysis, Yumi Hayashi, Ikuo Shohji, Hiroshi Miyazawa, May 2016, Book of abstracts of THERMEC'2016, 369, 229
• Effect of Added Elements on Microstructures and Joint Strength of Lead-free Sn-based Solder Joint Dispersed IMC Pillar, Yawara Hayashi, Ikuo Shohji, Yusuke Nakata, Tomihito Hashimoto, May 2016, Book of abstracts of THERMEC'2016, 367, 228
• Fe基ろうによるSUS304ろう付部の腐食挙動と電気化学的性質, 角田貴宏, 石康道, 荘司郁夫, 松康太郎, 田口育宏, Feb. 2016, 431, 432
• (001)優先配向を示す銀めっき皮膜のセルフアニーリング挙動その場観察, 林佑美, 荘司郁夫, 宮澤寛, Feb. 2016, 405, 408
• -, 窪田悠人, 荘司郁夫, 土田徹勇起, 中村清智, Feb. 2016, Mate 2016 (Microjoining and Assembly Technology in Electronics) Proc., 395, 400
• パワーモジュール向けピラー状IMC分散鉛フリーはんだ接合部の開発, 中田裕輔, 橋本富仁, 林和, 荘司郁夫, Feb. 2016, 145, 150
• ピラー状IMC分散鉛フリーはんだ接合部の組織と接合強度, 林和, 荘司郁夫, 中田裕輔, 橋本富仁, Feb. 2016, 141, 144
• Sn-5Sb微小試験片の疲労特性に及ぼす温度の影響, 小林恭輔, 荘司郁夫, 外薗洋昭, Feb. 2016, 53, 56
• Sn-1．0Ag-0．7Cu-1．6Bi-0．2In低銀鉛フリーはんだの疲労特性に及ぼす負荷条件の影響, 髙橋祐樹, 荘司郁夫, Feb. 2016, 49, 52
• Evaluation of self-annealing behavior of electrodeposited silver film by EBSP analysis, Yumi Hayashi, Ikuo Shohji and Hiroshi Miyazawa, Dec. 2015, Proc. of 17th Electronics Packaging Technology Conference (EPTC), 141
• Development of high reliability lead-free solder joint dispersed IMC pillar, Yawara Hayashi, Ikuo Shohji, Yusuke Nakata and Tomihito Hashimoto, Dec. 2015, Proc. of 17th Electronics Packaging Technology Conference (EPTC), 139
• Effect of third element addition on joint strength of low-Ag lead-free solder, Kyosuke Kobayashi, Ikuo Shohji and Mitsuo Yamashita, Dec. 2015, Proc. of 17th Electronics Packaging Technology Conference (EPTC), 138
• Fatigue Properties and Fatigue Crack Propagation Behavior of Low-Ag Lead-free Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Solder, Yuki Takahashi and Ikuo Shohji, Jul. 2015, Program of InterPACK/ICNMM, 67
• Tensile Properties and Microstructures of High Temperature Bi-based Lead-free Solder, Zhang Haidong, Ikuo Shohji, Masayoshi Shimoda and Hirohiko Watanabe, Jul. 2015, Program of InterPACK/ICNMM, 67
• Corrosion Behavior of SUS304 Brazed Joint with Fe-based Filler Alternative to Ni-Based Filler, Takahiro Tsunoda, Ikuo Shohji, Kotaro Matsu, Kangdao Shi and Yasuhiro Taguchi, Jul. 2015, Program of InterPACK/ICNMM, 67
• Thermal Stress Analysis of Mounted Substrate Using Glass Interposer, Yuto Kubota, Ikuo Shohji, Tetsuyuki Tsuchida and Kiyotomo Nakamura, Jul. 2015, Program of InterPACK/ICNMM, 61
• エポキシフラックスの濡れ特性とはんだボール接合部の補強効果, 石山旺欣, 荘司郁夫, 雁部竜也, 渡邉裕彦, Feb. 2015, 415, 416
• 短繊維強化PPSの機械的特性に及ぼす繊維含有量と温度の影響, 髙橋諒伍, 荘司郁夫, 関祐貴, 丸山敏, Feb. 2015, 413, 414
• フリップチップ接合用アンダーフィル材の密着強度と疲労特性に及ぼすカップリング材の影響, 三ツ木寛尚, 荘司郁夫, 小山真司, Feb. 2015, 411, 412
• 有機基板に対するガラス配線基板の接続信頼性に及ぼす基板のCTE差の影響, 土田徹勇起, 中村清智, 窪田悠人, 荘司郁夫, Feb. 2015, 407, 408
• Niろう代替Fe基ろうによるSUS304ろう付継手のミクロ組織と耐食性, 角田貴宏, 荘司郁夫, 石康道, 松康太郎, 田口育宏, Feb. 2015, 387, 390
• Bi系高温鉛フリーはんだの引張特性に及ぼす温度と歪み速度の影響, 張海東, 荘司郁夫, 下田将義, 渡邉裕彦, Feb. 2015, 177, 180
• Sn-1.0Ag-0.7Cu-1.6Bi-0.2In低銀鉛フリーはんだの疲労特性, 髙橋祐樹, 荘司郁夫, Feb. 2015, 165, 168
• ガラスインターポーザ基板を用いた鉛フリーはんだ接合部の熱応力解析, 窪田悠人, 荘司郁夫, 土田徹勇起, 中村清智, Feb. 2015, 29, 32
• Tensile Properties of Low-melting Point Sn-Bi-Sb Solder, Yuto Kubota, Ikuo Shohji, Tetsuyuki Tsuchida and Kiyotomo Nakamura, Dec. 2014, Proc. of 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 788, 792
• Joint Strength and Microstructures of Brazed Joints of Stainless Steel with Fe-based Filler, Takahiro Tsunoda, Kangdao Shi, Ikuo Shohji, Kotaro Matsu and Yasuhiro Taguchi, Dec. 2014, Proc. of 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 855, 858
• Mechanical Properties of Low-silver Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Solder, Yuki Takahashi and Ikuo Shohji, Dec. 2014, Proc. of 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 784, 787
• Effect of Temperature on Tensile Properties of High-melting Point Bi System Solder, Haidong Zhang, Ikuo Shohji, Masayoshi Shimoda and Hirohiko Watanabe, Dec. 2014, Proc. of 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 780, 783
• Effect of Fiber Direction and Temperature on Fatigue Behaviors of Short Fiber-Reinforced PPS, Ryogo Takahashi, Ikuo Shohji, Yuki Seki and Satoshi Maruyama, Oct. 2014, Final Program of MS&T14, 125
• ICEP2014国際会議参加報告, 荘司郁夫, Oct. 2014, 83, 7, 571, 573
• 低Ag鉛フリーはんだの実力, 荘司郁夫, Oct. 2014, 83, 7, 528, 530
• Improvement Effect of Joint Reliability of Sn-3Ag-0.5Cu Solder Ball Joint with Epoxy-based Flux, Akiyoshi Ishiyama, Ikuo Shohji, Tatsuya Ganbe and Hirohiko Watanabe, Oct. 2014, Final Program of MS&T14
• Effect of Coupling Treatment of Filler and Copper Substrate on Adhesion of Underfill, Hironao Mitsugi, Ikuo Shohji and Shinji Koyama, Oct. 2014, Final Program of MS&T14, 125
• Effect of Fiber Direction and Temperature on Mechanical Properties of Short Fiber-Reinforced PPS, R. Takahashi, I. Shohji, Y. Seki and S. Maruyama, Apr. 2014, Proc. of ICEP 2014 (CD-ROM), 778, 781
• Effect of Coupling Agent on Adhesion of Underfill on Copper, H. Mitsugi, I. Shohji, S. Koyama and S. Kitagoh, Apr. 2014, Proc. of ICEP 2014 (CD-ROM), 774, 777
• Impact Properties of Sn-3Ag-0.5Cu Solder Ball Joint with Epoxy-Based Flux, A. Ishiyama, I. Shohji, T. Ganbe and H. Watanabe, Apr. 2014, Proc. of ICEP 2014 (CD-ROM), 766, 769
• 溶融Snとプラズマ窒化ステンレス鋼の界面反応, 服部真吾, 荘司郁夫, 桑原秀行, Feb. 2014, 397, 398
• 酢酸を用いた金属塩生成接合法によるAl合金/SUS304の固相接合条件の緩和, 松原広太, 小山真司, 荘司郁夫, Feb. 2014, 389, 390
• 金属塩生成接合法によるCu/Cu固相接合条件の緩和, 萩原尚基, 小山真司, 荘司郁夫, Feb. 2014, 387, 388
• 双ロール法により作製した高Al含有Mg合金の時効硬化とミクロ組織, 秋山主, 荘司郁夫, 小山真司, 西田進一, 渡利久規, 藤倉圭佑, Feb. 2014, 373, 376
• 短繊維強化樹脂材料の機械的特性に及ぼす繊維方向および温度の影響, 髙橋諒伍, 荘司郁夫, 関祐貴, 丸山敏, Feb. 2014, 369, 372
• リチウムイオン二次電池用電解銅箔の疲労特性に及ぼす添加剤の影響, 永山卓弥, 荘司郁夫, 西貞造, 呉元元, Feb. 2014, 357, 360
• Sn-3Ag-0.5CuはんだとW基板上Ni-Bめっきメタライズ界面に生成するSn-W構造, 依田智子, 原田正英, 西川徹, 小林竜也, 荘司郁夫, Feb. 2014, 291, 296
• フリップチップ接合用アンダーフィル材の機械的物性に及ぼすカップリング剤の影響, 三ツ木寛尚, 荘司郁夫, 小山真司, 北郷慎也, Feb. 2014, 279, 282
• エポキシ系フラックスによるボール接合部衝撃特性の向上効果, 石山旺欣, 荘司郁夫, 雁部竜也, 渡邉裕彦, Feb. 2014, 251, 254
• Sb, Zn添加Sn-Bi系はんだと無電解Ni/AuおよびNi/Pd/Au電極の接合特性に及ぼす時効の影響, 平田晃大, 荘司郁夫, 土田徹勇起, 大久保利一, Feb. 2014, 51, 54
• Change of Characterization in Electroless Plating Ni-B Alloy Films by Heat Treatment, Chiko Yorita, Takayoshi Watanabe, Hiroshi Kikuchi, Toru Nishikawa, Masahide Harada and Ikuo Shohji, Dec. 2013, Book of Abstracts of THERMEC 2013, 675, 676
• Effect of Strain Rate on Tensile Properties of Miniature Size Specimens of Several Lead-free Alloys, Ikuo Shohji and Yuichiro Toyama, Dec. 2013, Book of Abstracts of THERMEC 2013, 558, 559
• Effect of the contents of Se in high-cyanide silver plating solution on 200 orientation of the silver electro-deposited layer, Hiroshi Miyazawa, Masafumi Ogata, Keisuke Shinohara, Akira Sugawara and Ikuo Shohji, Dec. 2013, Book of Abstracts of THERMEC 2013, 421, 422
• Solid State Bonding of Al Alloy/SUS304 by Metal Salt Generation Bonding Technique with Acetic Acid, Kota Matsubara, Shinji Koyama, Hideo Nagata, Yoshiyuki Suda and Ikuo Shohji, Dec. 2013, Book of Abstracts of THERMEC 2013, 396, 397
• Cu / Cu Direct Bonding by Metal Salt Generation Bonding Technique with Formic Acid and Citric Acid, Naoki Hagiwara, Shinji Koyama and Ikuo Shohji, Dec. 2013, Book of Abstracts of THERMEC 2013, 216
• Mechanical Properties of Sn-58Bi, In-3Ag and SAC305 Solders Measured with Fine Diameter Specimens, Takashi Hisada, Ikuo Shohji, Yasuharu Yamada, Kazushige Toriyama and Mamoru Ueno, Nov. 2013, Proc. of IEEE CPMT Symposium Japan 2013, 205, 208
• アンダーフィル材の引張特性に及ぼすフィラー添加量および熱劣化の影響, 三ツ木寛尚, 北郷慎也, 荘司郁夫, 小山真司, Sep. 2013, 37, 44
• フローはんだ槽材料の長期信頼性評価, 荘司郁夫, Sep. 2013, 18, 9, 1, 5
• エレクトロニクス実装　－第二世代鉛フリーハンダ, 荘司郁夫, Aug. 2013, 2013年8月26日, 8, 9
• Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic Copper Foil, Takuya Nagayama, Hiroaki Yoshida and Ikuo Shohji, Jul. 2013, Proc. of InterPACK2013 (CD-ROM), IPACK2013-73172
• Effect of Electrode Material on Joint Strength of Soldered Joints with Sn-Bi and Sn-Bi-Sb Lead-free Solder Balls, Akihiro Hirata, Ikuo Shohji, Tetsuyuki Tsuchida and Toshikazu Ookubo, Jul. 2013, Proc. of InterPACK2013 (CD-ROM), IPACK2013-73171
• Interfacial Reaction between Molten Sn and Plasma Nitrided Stainless Steel, Shingo Hattori, Naoya Matsubara, Ikuo Shohji and Hideyuki Kuwahara, Jul. 2013, Proc. of InterPACK2013 (CD-ROM), IPACK2013-73170
• 鉛フリーはんだ微小試験片の引張特性に及ぼすミクロ組織とひずみ速度の影響, 當山雄一郎, 荘司郁夫, Jan. 2013, 459, 460
• リチウムイオン二次電池用電解銅箔の機械的特性に及ぼす添加剤の影響, 永山卓弥, 吉田浩亮，荘司郁夫, 西貞造, 呉元元, Jan. 2013, 341, 344
• 純Snによるプラズマ窒化ステンレス鋼の侵食挙動に及ぼす温度の影響, 服部真吾, 松原尚也, 荘司郁夫, 桑原秀行, Jan. 2013, 287, 290
• Sn-Bi系鉛フリーはんだボールと無電解Ni/AuおよびNi/Pd/Au電極の接合特性, 平田晃大, 荘司郁夫, 土田徹勇起, 大久保利一, Jan. 2013, 231, 234
• フリップチップ接合用アンダーフィル材の材料物性に及ぼす温度およびフィラー添加量の影響, 北郷慎也, 三ツ木寛尚, 荘司郁夫, 小山真司, Jan. 2013, 171, 176
• 無電解Niめっき皮膜中の添加剤とはんだ接合性, 土田徹勇起，大久保利一，狩野貴宏，荘司郁夫, Jan. 2013, 2, 1, 22, 25
• 微量元素添加による鉛フリーはんだの高信頼性化, 荘司郁夫, Dec. 2012, 46, 117, 9, 15
• 鉛フリーはんだによるフロー槽表面処理ステンレス鋼侵食評価の国際標準化, 荘司郁夫, Dec. 2012, 82, 12, 35, 40
• 微量元素添加による鉛フリーはんだの高信頼性化, 荘司郁夫, Dec. 2012, 60, 12, 76, 82
• A Study of Bonding Strength of Al/Cu by Metal Salt Generation Bonding Method, S. K. Ting, Hirokazu Hata, Shinji Koyama and Ikuo Shohji, Nov. 2012, Proc. of Visual-JW2012, 192, 193
• A Study of Solid State Bonding Strength of Al/Cu by Using Metal Salt Generation Bonding Method on Al Surface, Shinji Koyama, S. K. Ting, Ikuo Shohji, Hirokazu Hata, Naoki Hagiwara and Kota Matsubara, Nov. 2012, Proc. of Visual-JW2012, 167, 168
• Effect of Strain Rate on Tensile Properties of Miniature Size Lead-Free Alloys, Yuichiro Toyama and Ikuo Shohji, Nov. 2012, Proc. of IEMT 2012, IEMT2012-P151
• Effect of Filler Content on Tensile Properties of Underfill Material for Flip Chip Bonding, Shinya Kitagoh, Hironao Mitsugi, Shinji Koyama and Ikuo Shohji, Nov. 2012, Proc. of IEMT 2012, IEMT2012-P150
• Effect of Surface Modification by Citric Acid on Fluxless Vacuum Bonding of Cu with Sn-Cu Alloy, Masumi Hayakawa, Shinji Koyama and Ikuo Shohji, Nov. 2012, Proc. of IEMT 2012, IEMT2012-P149, IEMT2012-P149
• Effect of Ni, Ge and P Addition in Sn-Ag-Cu Lead-free Solder on Solder Joint Properties with Electroless Ni/Au Electrodes, Ikuo Shohji and Ryohei Arai, Nov. 2012, Proc. of IEMT 2012, IEMT2012-P032
• Investigation of Wetting Behavior of Sn-3Ag-0.5Cu Solder Paste to BGA Solder Ball, Maryam Husna Yahya, Keisuke Nakamura, Ikuo Shohji, Toshihiro Housen, Yumi Yamamoto and Yoshio Kaga, Nov. 2012, Proc. of IEMT 2012, IEMT2012-P03
• 鉛フリー無電解Niめっき皮膜中の共析物とはんだ実装信頼性, 土田徹勇起, 大久保利一, 狩野貴宏, 荘司郁夫, Sep. 2012, 141, 144
• エレクトロニクス実装　鉛フリーハンダのぬれ性評価, 荘司郁夫, Aug. 2012, 2012年8月27日, 4, 15
• ソルダペーストぬれ性評価装置の開発と方法の提案, 平本清, 西室将, 小山真司, 荘司郁夫, 宮本博永, Jul. 2012, 27, 38
• Effect of Substrate Material on Thermal Fatigue Life of Solder Joint of WLCSP, S. Kitagoh, I. Shohji, M. Miyazaki, J. Watanabe, K. Hatsuzawa, Apr. 2012, Proc. of ICEP-IAAC 2012 (CD-ROM), 693, 696
• Investigation of Impact Properties of Lead-free Solders using Micro-size Specimens, Y. Toyama, I. Shohji, Apr. 2012, Proc. of ICEP-IAAC 2012 (CD-ROM), 669, 672
• Microstructures and Joint Strength of Vacuum Jointed Cu with Sn-Cu Alloys, M. Hayakawa, I. Shohji, S. Koyama, H. Nara, N. Otomo, M. Uenishi, Apr. 2012, Proc. of ICEP-IAAC 2012 (CD-ROM), 661, 664
• 無電解Niめっきに共析する添加剤とはんだ接合性, 土田徹勇起，大久保利一，狩野貴宏，荘司郁夫, Apr. 2012, 63, 4, 233, 238
• 鉛フリーはんだの実装技術動向について, 荘司郁夫, Mar. 2012
• 鉛フリーめっき液を用いた無電解Ni/Au およびNi/Pd/Au めっき電極の接合特性, 狩野貴宏, 荘司郁夫, 土田徹勇起, 大久保利一, Jan. 2012, 439, 440
• Sn-Pb 共晶はんだ微小試験片の引張特性に及ぼすAu,PdおよびBi添加の影響, 菊池遼, 荘司郁夫, 根本規生, 中川剛, 海老原伸明, 岩瀬房雄, Jan. 2012, 433, 434
• WLCSPはんだ接合部の熱疲労寿命に及ぼす基板材質の影響, 北郷慎也, 荘司郁夫, 宮崎誠, 渡辺潤, 初澤健次, Jan. 2012, 377, 380
• Sn-Cu系鉛フリーはんだによるCuの真空接合部の接合部組織と接合強度, 早川真生, 荘司郁夫, 小山真司, 奈良英明, 大友昇, 上西正久, Jan. 2012, 85, 88
• 鉛フリーはんだ微小試験片の高速引張特性, 當山雄一郎, 荘司郁夫, Jan. 2012, 65, 68
• Sn-Cu-Ni系およびSn-Zn系鉛フリーはんだへのCuの溶解特性, 荘司郁夫，渡邉裕彦，永井麻里江，大澤勤, Jan. 2012, 13, 1
• The Study on Erosion Resistance Characteristics of Fe-MWCNT Composite Plating against Lead-Free Solder, Jun Watanabe, Norihisa Sekimori, Kenji Hatsuzawa, Takashi Uetani and Ikuo Shohji, Nov. 2011, Proceedings of ECO-MATES 2011, 2, 47, 48
• 金属塩生成法を用いたSn/Cu固相接合の低温化, 青木由希也, 小山真司, 荘司郁夫, Nov. 2011, 65, 70
• レーザ変位法を用いたソルダペーストぬれ性評価装置の開発, 荘司郁夫，小山真司，大屋一生，伊坂俊宏，宮本博永，西室将，平本清, Nov. 2011, 12, 11, 41, 45
• 無電解Ni/Pd/Auめっき皮膜のはんだ実装性とNiめっき皮膜中に共析した微量添加剤(Pb, S)濃度の関係, 土田徹勇起, 大久保利一, 狩野貴宏, 荘司郁夫, Sep. 2011, 145, 148
• エレクトロニクス実装　鉛フリー実装における信頼性向上, 荘司郁夫, Aug. 2011, 2011年8月22日, 10
• Effect of the Organic Acid Surface Modification on Bond Strength of Tin and Copper, Shinji Koyama, Yukinari Aoki and Ikuo Shohji, Jul. 2011, Proc. of InterPACK2011 (CD-ROM), IPACK2011-52072
• Erosion Behavior of Plasma Nitriding Stainless Steel by Molten Sn-Ag-Cu Lead-Free Solder, Naoya Matsubara, Ikuo Shohji and Hideyuki Kuwahara, Jul. 2011, Proc. of InterPACK2011 (CD-ROM), IPACK2011-52026
• Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application, Ryou Kikuchi, Ikuo Shohji, Yuta Saitoh, Norio Nemoto, Tsuyoshi Nakagawa, Nobuaki Ebihara and Fusao Iwase, Jul. 2011, Proc. of InterPACK2011 (CD-ROM), IPACK2011-52025
• Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-Free Solder Ball Joint With Electroless Ni/Pd/Au Plated Electrode, Takahiro Kano, Ikuo Shohji, Tetsuyuki Tsuchida and Toshikazu Ookubo, Jul. 2011, Proc. of InterPACK2011 (CD-ROM), IPACK2011-52024
• Sn-Ag-Cu系鉛フリーはんだによるプラズマ窒化ステンレス鋼の侵食挙動, 松原尚也, 住吉一仁, 荘司郁夫, 桑原秀行, Feb. 2011, 359, 360
• 多層カーボンナノチューブを用いた高熱伝導性アンダーフィル材の検討, 渡辺潤, 宮崎誠, 初澤健次, 荘司郁夫, Feb. 2011, 353, 354
• 無電解Ni/Pd/Auめっき電極と鉛フリーはんだとの接合特性に及ぼすPdめっき厚の影響, 狩野貴宏, 荘司郁夫, 土田徹勇起, 大久保利一, Feb. 2011, 333, 334
• Au, Pd添加Sn-Pb共晶はんだの引張特性に及ぼす時効の影響, 菊池遼, 齋藤雄大, 荘司郁夫, 根本規生, 中川剛, 海老原伸明, 岩瀬房雄, Feb. 2011, 331, 332
• 実装基板の接続信頼性に及ぼす基板材料特性の影響, 宮崎誠, 渡辺潤, 初澤健次, 北郷慎也, 荘司郁夫, Feb. 2011, 159, 164
• Einfluss von Ni-Dotierungen auf die Ablegierung von Cu in schmelzflussigen Sn-Ag-Cu (Ni-Ge)-Legierungen, Hirohiko Watanabe, Marie Nagai, Tsutomu Osawa und Ikuo Shohji, 2011, 8, 1872, 1879
• Dynamic mechanical behavior of Sn-Ag-Cu lead-free solders by tensile test under high strain rate, Kiyokazu Yasuda, Yoshihiro Sakin, Ikuo Shohji and Tadashi Takemoto, Nov. 2010, Proc. of Visual-JW 2010, 2, 29, 30
• Examination of improvement effect of surface modification of Cu with organic acid on solder paste wettability using a laser displacement meter, Shinji Koyama, Yukinari Aoki and Ikuo Shohji, Nov. 2010, Proc. of Visual-JW 2010, 1, 193, 194
• Development of wettability evaluation equipment for solder paste using laser displacement method, Shinji Koyama, Issei Oya, Toshihiro Isaka, Ikuo Shohji, Masashi Nishimuro, Kiyoshi Hiramoto and Hironaga Miyamoto, Nov. 2010, Proc. of Visual-JW 2010, 1, 191, 192
• 錫の酸化皮膜に対する有機酸の改質作用と固相接合強度への影響, 小山真司, 荘司郁夫, Oct. 2010, 55, 62
• 無電解Ni-P/Au、Ni-P/Pd/Auめっき皮膜のはんだ実装性に対するNiめっき添加剤の影響, 土田徹勇起, 大久保利一, 狩野貴宏, 荘司郁夫, Sep. 2010, 95, 98
• りん銅ろうを用いたステンレス鋼のろう付技術, 荘司郁夫，中澤崇徳，上西正久，大友昇, Sep. 2010, 58, 9, 62, 67
• エレクトロニクス実装　鉛フリーハンダによる実装の課題と解決策, 荘司郁夫, Aug. 2010, 2010年8月20日, 12
• Analysis of Stress-strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints, Ikuo Shohji, Tatsuya Kobayashi and Tomotake Tohei, Jun. 2010, Book of Abstracts Far East and Oceanic Fracture Society 2010, 98
• Effect of interfacial reaction on joint strength of semiconductor metallization and Sn-3Ag-0.5Cu solder ball, Chiko Yorita, Tatsuya Kobayashi and Ikuo Shohji, Jun. 2010, Book of Abstracts Far East and Oceanic Fracture Society 2010, 47
• Effect of Ni and Ag on Interfacial Reaction and Microstructure of Sn-Ag-Cu-Ni-Ge Solder Alloy, Hirohiko Watanabe, Masayoshi Shimoda, Noboru Hidaka and Ikuo Shohji, Jun. 2010, Book of Abstracts Far East and Oceanic Fracture Society 2010, 29
• Effect of Ag Content on Mechanical Properties of Lead-free Sn-Ag-Cu-Ni-Ge Alloy, Ikuo Shohji, Ryohei Arai, Hisao Ishikawa and Masao Kojima, Jun. 2010, Book of Abstracts Far East and Oceanic Fracture Society 2010, 23
• Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge, Hirohiko Watanabe, Marie Nagai, Tsutomu Osawa and Ikuo Shohji, Jun. 2010, Book of Abstracts Far East and Oceanic Fracture Society 2010, 23
• Sn-Ag-Cu-Ni-Ge系はんだ中へのCuの溶解特性に及ぼすNi添加量の影響, 永井麻里江, 渡邉裕彦, 大澤勤, 荘司郁夫, Feb. 2010, 225, 228
• n-Ag-Cu-Ni-Ge系はんだの強度特性に及ぼすAg添加量の影響, 新井亮平, 荘司郁夫, 石川久雄, 小島昌夫, Feb. 2010, 147, 150
• 半導体電極用メタライゼーションとSn-3Ag-0.5Cuはんだとの界面反応, 小林竜也, 荘司郁夫, 依田智子, Feb. 2010, 27, 30
• エレクトロニクス実装　環境負荷を低減する最新技術を探る, 荘司郁夫, Aug. 2009, 2009年8月7日, 10, 11
• Development of Joining Technology of Al Alloy Plate and Cu Alloy Pipe for Cooling System of Power Module, I. Oshiro, I. Shohji, H. Nara, N. Otomo and M. Uenishi, Apr. 2009, Proc. of ICEP (International Conference of Electronics Packaging) 2009, 951, 954
• Effect of Impurities of Au and Pd on Tensile Properties of Eutectic Sn-Pb Solder for Aerospace Application, Y. Saitoh, I. Shohji, N. Nemoto, T. Nakagawa, N. Ebihara and F. Iwase, Apr. 2009, Proc. of ICEP (International Conference of Electronics Packaging) 2009, 947, 950
• Comparison of Erosion Rates of SUS304 and SUS316 Stainless Steels by Molten Sn-3Ag-0.5Cu Solder, K. Sumiyoshi, I. Shohji and M. Miyazaki, Apr. 2009, Proc. of ICEP (International Conference of Electronics Packaging) 2009, 943, 946
• 溶融鉛フリーはんだによるSUS304鋼とSUS316鋼の侵食速度比較, 住吉一仁, 荘司郁夫, 高瀬博之, 宮崎誠, Jan. 2009, 395, 398
• The Effects of Ag, Ni, and Ge Elements in Lead-free Sn Base Solder Alloy, Mitsuo Yamashita, Noboru Hidaka and Ikuo Shohji, Dec. 2008, Proc. of Electronics Packaging Technology Conference 2008, 582, 587
• Phosphorus Particle Composite Plating with Ni-P Alloy Matrix, Yosuke Suzuki, Susumu Arai, Ikuo Shohji and Eiji Kobayashi, Oct. 2008, Pacific Rim Meeting on Electrochemical and Solid-State Science, Abs. 0090
• Sn基鉛フリーはんだのソルダリング特性に及ぼすAg, Ni, Ge添加の影響, 山下満男, 日高昇, 荘司郁夫, Oct. 2008, 57, 60
• Impact Properties of Sn-0.75Cu Lead-free Solder Ball Joint, Ikuo Shohji, Tsutomu Osawa, Takeshi Okashita and Hirohiko Watanabe, Sep. 2008, Advances in Fracture and Damage Mechanics VII, Proc. of 7th International Conference on Fracture and Damage Mechanics (FDM 2008), 745, 748
• Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint, Ikuo Shohji, Tomotake Tohei, Keisuke Yoshizawa, Masaharu Nishimoto, Yasushi Ogawa and Takayuki Kawano, Sep. 2008, Advances in Fracture and Damage Mechanics VII, Proc. of 7th International Conference on Fracture and Damage Mechanics (FDM 2008), 433, 436
• Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-free Solder Ball Joints, Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa and Masao Kojima, Sep. 2008, Advances in Fracture and Damage Mechanics VII, Proc. of 7th International Conference on Fracture and Damage Mechanics (FDM 2008), 429, 432
• 鉛フリー実装技術　－その最新動向を探る－, 荘司郁夫, Apr. 2008, 2008年4月21日, 8, 9
• CSPはんだ接合部の熱疲労寿命に及ぼすアンダーフィル材の材料物性の影響, 東平知丈, 吉澤啓介, 荘司郁夫, 西元正治, 小川泰史, 川野崇之, 水谷弓子, 大崎理彦, Feb. 2008, 115, 118
• Sn-Ag-Cu-Ni-Geはんだ接合界面の反応層形成について, 渡邉裕彦, 下田将義, 荘司郁夫, 大澤勤, Feb. 2008, 83, 88
• 高温放置環境下におけるSn-8Zn-3Biはんだと無電解Ni/Auめっき電極との界面反応, 下山悟志, 荘司郁夫, 石川久雄, 小島昌夫, Feb. 2008, 75, 78
• Effect of Underfill Materials on Thermal Fatigue Lives of Chip Size Package Solder Joints, Ikuo Shohji, Tomotake Tohei, Keisuke Yoshizawa, Masaharu Nishimoto, Yasushi Ogawa and Takayuki Kawano, Nov. 2007, Program & Abstracts of The Second International Symposium on Smart Processing Technology, 112
• Growth Kinetics of Interfacial Reactions and Ball Shear Strength of Sn-9Zn Solder Joints on Electroless Ni/Au Plated Electrodes, Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa and Masao Kojima, Nov. 2007, Program & Abstracts of The Second International Symposium on Smart Processing Technology, 110
• Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimens, Ikuo Shohji, Tsutomo Osawa, Takashige Matsuki, Yoshiharu Kariya, Kiyokazu Yasuda and Tadashi Takemoto, Nov. 2007, Program & Abstracts of The Second International Symposium on Smart Processing Technology, 109
• Estimation of Thermal Fatigue Resistance of Sn-Bi(-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index, Kiyokazu Yasuda, Ikuo Shohji and Tadashi Takemoto, May 2007, Abstract Book IWJC-Korea 2007 (International Welding and Joining Conference-Korea 2007), 94, 95
• 低融点鉛フリーはんだの引張特性, 荘司郁夫,高橋武彦,日置進, Feb. 2007, 7, 2, 58, 61
• Sn-Ag系鉛フリーはんだの低サイクル疲労と表面変形度合の関係, 高橋武彦, 日置進, 荘司郁夫, 神谷修, Feb. 2007, 227, 232
• Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge, Ikuo Shohji, Satoshi Tsunoda, Hirohiko Watanabe and Tatsuhiko Asai, Nov. 2006, Abstracts and Program of 2006 Asian Pacific Conference for Fracture and Strength, 293
• Influence of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package, Ikuo Shohji, Keisuke Yoshizawa, Masaharu Nishimoto and Takayuki Kawano, Nov. 2006, Abstracts and Program of 2006 Asian Pacific Conference for Fracture and Strength, 292
• Development of Cu Brazing Sheet with Cu-P Composite Plating, Ikuo Shohji, Susumu Arai, Naoki Kano, Noboru Otomo and Masahisa Uenishi, Nov. 2006, Abstracts and Program of 2006 Asian Pacific Conference for Fracture and Strength, 292
• Effect of Ni and Ag on Interfacial Reaction and Microstructure of Sn-Ag-Cu-Ni-Ge Lead-Free Solder, Hirohiko Watanabe, Noboru Hidata, Ikuo Shohji and Mototaka Ito, Oct. 2006, Proceedings of Materials Science and Technology (MS&T) 2006: PRODUCT MANUFATURING, 135, 146
• Sn-Ag-Cu-Ni-Ge系鉛フリーはんだの接合部組織と接合強度, 荘司郁夫, 角田智史, 渡邉裕彦, 浅井竜彦, Jul. 2006, 1, 11
• New Lead Free Solder Composition and Physical Properties of Printed Wiring Board Laminate Material To Suppress Lift-Off and Improve Reliability, Kenichi Ikeda, Hideki Ishihara, Hirohiko Watanabe, Tatsuhiko Asai, Hiroaki Hokazono and Ikuo Shohji, Feb. 2006, Proceedings of IPC Printed Circuits Expo, APEX and the Designers Summit 2006, S39-02
• Sn-Ag-Cu-Ni-Ge系鉛フリーはんだの接合部組織および接合強度に及ぼすNi添加量の影響, 角田智史, 荘司郁夫, 渡邉裕彦, 浅井竜彦, Feb. 2006, 279, 284
• CSPはんだ接合部の熱応力緩和に及ぼすアンダーフィル材の影響, 吉澤啓介, 荘司郁夫, 西元正治, 川野崇之, Feb. 2006, 275, 278
• Sn-3.5Ag, Sn-0.7Cu鉛フリーはんだの表面変形度合による低サイクル疲労特性評価, 高橋武彦, 日置進, 荘司郁夫, 神谷修, Feb. 2006, 253, 258
• ウイスカ抑制Pbフリーはんだペースト, 林田喜任, 髙橋義之, 大野隆生, 荘司郁夫, Feb. 2006, 39, 44
• 先進実装技術および電子部品の現状と展望, 西原幹雄，鈴木一高，荘司郁夫, Jan. 2006, 9, 1, 24, 27
• Thermal stress relief in lead-free solder joint for chip size package with encapsulant materials, Ikuo Shohji, Keisuke Yoshizawa, Masaharu Nishimoto and Takayuki Kawano, Nov. 2005, Program & Abstract of International Symposium on Smart Processing Technology, 26
• ウイスカ抑制Pbフリーはんだ合金, 林田喜任, 髙橋義之, 大野隆生, 荘司郁夫, Oct. 2005, 273, 276
• Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with Sn-3Ag-0.5Cu, Ikuo Shohji, Hiroki Goto, Kiyotomo Nakamura and Toshikazu Ookubo, Oct. 2005, Final Program and Abstructs of Asian Pacific Conference for Fracture and Strength'04, 421
• An Evaluation of Fatigue Damage in Low-cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature, Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya, Jul. 2005, Proceedings of IPACK2005 (CD-ROM), IPACK2005-73152
• Comparison of Immersion Gold Plating in Reliability of a Lead-Free Solder Joint with Autocatalytic Electroless Gold Plating, Kiyotomo Nakamura, Ikuo Shohji, Hiroki Goto, and Toshikazu Ookubo, Jul. 2005, Proceedings of the 7th International Conference on Ecomaterials, 347, 353
• Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint, Ikuo Shohji, Hiroki Goto, Kiyotomo Nakamura and Toshikazu Ookubo, Jul. 2005, Proceedings of the 7th International Conference on Ecomaterials, 309, 315
• Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-Free Alloy under Heat Exposure Conditions, Ikuo Shohji, Satoshi Tsunoda, Hirohiko Watanabe,Tatsuhiko Asai and Megumi Nagano, Jul. 2005, Proceedings of the 7th International Conference on Ecomaterials, 248, 254
• エレクトロニクス分野におけるマイクロ接合・実装技術動向, 岩田剛治,荘司 郁夫, Jul. 2005, 74, 5, 83, 86
• Low cycle Fatigue behavior and Surface Feature by Image Processing of Sn-0.7Cu Lead-free Solder, Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya, Apr. 2005, Proceedings of the 6th International Conference on Fracture and Strength of Solids Part 1, 120, 125
• 誘電体被膜を有するアルミニウム箔とパラジウム電極との超音波接合, 櫻井司, 荘司郁夫, 大島雅史, Feb. 2005, 395, 398
• リフトオフ現象抑制のための新規鉛フリーはんだとプリント基板材料特性, 池田謙一, 石原秀樹, 渡邉裕彦, 浅井竜彦, 外薗洋昭, 荘司郁夫, Feb. 2005, 343, 348
• Sn-0.7Cu鉛フリーはんだの低サイクル疲労特性および画像を用いた疲労被害評価, 高橋武彦, 日置進, 荘司郁夫, 神谷修, Feb. 2005, 297, 302
• 鉛フリーはんだの接合部信頼性に及ぼす置換・還元型Auめっき層の影響, 後藤広樹, 荘司郁夫, 中村清智, 大久保利一, Feb. 2005, 183, 188
• 熱交換器用薄板ステンレス鋼のNiろう付, 荘司 郁夫,高山 智司,中澤 崇徳,松本 健,曳田 昌徳, 2005, vol.39, No.110, pp.35-39
• Joint Strength and Microstructure of microjoint with Sn-Ag-In-Bi Lead-free Solder, Ikuo Shohji and Hitoshi Ninomiya, Nov. 2004, Proceedings of New Frontiers of Process Science and Engineering in Advanced Materials '04, 227, 232
• High Speed Bonding of Resin Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil, Ikuo Shohji, Tsukasa Sakurai and Shinji Arai, Oct. 2004, Final Program and Abstructs of Asian Pacific Conference for Fracture and Strength'04, 416
• Mechanical Properties and Microstructure of SUS304 Brazed Joint with Ni-Base Filler Metals Added Cr Powder, Ikuo Shohji, Satoshi Takayama, Takanori Nakazawa, Ken Matsumoto and Masanori Hikita, Oct. 2004, Final Program and Abstructs of Asian Pacific Conference for Fracture and Strength'04, 212
• 日本における溶接の展望Ⅲ－５ マイクロ接合 １．先端高密度実装・微細接合, 荘司 郁夫, Jul. 2004, 73, 5, 74, 75
• Mechanical Properties of Various Lead-free Solders, Takehiko Takahashi, Susumu Hioki, Osamu Kamiya and Ikuo Shohji, Feb. 2004, Proc. of The 2nd International Conference on Structure, Processing and Properties of Materials, SPPM2004, 778, 785
• 高周波巻線チップコイル用高速接合技術の開発, 荘司郁夫, 新井慎二, 櫻井司, 久米原宏之, 薄波圭司, 木村由孝, 須齋嵩, Feb. 2004, 231, 236
• Tensile Properties of Sn-0.7mass%Cu Lead-free Solder, Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi and Susumu Hioki, Oct. 2003, Abstracts 2 of The 8th IUMRS International Conference on Advanced Materials 2003, 38
• Effect of Ni Coating over Cu Ball on the Microstructure of Flip Chip Joints with Cu-corred Solder Balls, Ikuo Shohji, Yuji Shiratori, Hiroshi Yoshida, Masahiko Mizukami and Akira Ichida, Jul. 2003, Proc. of InterPACK03(CD-ROM), InterPack2003-35120
• エレクトロニクス製作における微細接合技術, 荘司 郁夫, Apr. 2003, 51, 4, 62, 66
• 低融点鉛フリーはんだの引張特性, 荘司郁夫, 吉田知弘, 高橋武彦, 日置進, Feb. 2003, 229, 234
• 各種鉛フリーはんだの引張特性, 各種鉛フリーはんだの引張特性, Feb. 2003, 223, 228
• 日本における溶接の展望Ⅲ－５ マイクロ接合, 荘司 郁夫, Jul. 2002, 71, 5, 75, 77
• はんだ材料の機械的特性試験方法, 荘司郁夫, 日置進, Apr. 2002, 13, 28
• Sn-Zn系鉛フリーはんだ/Cu接合体の接合部組織と機械的特性, 荘司郁夫, 中村隆夫, 森史成, 藤内伸一, Jan. 2002, 289, 294
• りん銅ろうを用いたステンレス鋼のろう付技術の開発, 荘司 郁夫,中澤 崇徳,上西 正久,大友 昇, 2002, vol.36, No.107, pp.44-48.
• Brazing of stainless steel with CuP filler, Shohji Ikuo, Fujihira Mitsuhiro, Nakazawa Takanori, Uenishi Masahisa and Otomo Noboru, Oct. 2001, Proc. of 2001 International Brazing & Soldering Conference, 83, 88
• Thermal Fatigue Behavior of CSP Solder Joints with Sn-Ag Lead-free Solders under Thermal Cycle Conditions, Ikuo Shohji, Fuminari Mori, Shinichi Fujiuchi and Masaru Yamashita, Apr. 2001, Proc. of 2001 International Conference on Electronics Packaging, 296, 301
• 無電解NiバンプとPbフリーはんだを用いたフリップチップ接合部の熱疲労強度評価, 荘司郁夫，森史成, Feb. 2001, 101, 106
• Sn-Ag系Pbフリーはんだを用いたCSP接合部の熱疲労組織, 荘司郁夫, 森史成, 藤内伸一, 山下勝, May 2000, 33, 42
• エレクトロニクス実装におけるマイクロ接合の潮流と将来展望, 小林紘二郎, 荘司郁夫, Feb. 2000, 23, 2, 123, 132
• Sn-Agはんだを用いたBGA組織に及ぼすCuコアの影響, 佐伯敏男, 上西啓介, 小林紘二郎, 荘司郁夫, 山本雅春, Feb. 2000, 225, 260
• Sn-Ag系Pbフリーはんだを用いたCSP接合部の接合部組織と熱疲労強度評価, 荘司郁夫, 山下勝, Feb. 2000, 223, 228
• ペースト印刷法によるSolder capped bumpを用いたフリップチップリワーク法の開発, 森史成, 鳥山和重, 勝直樹, 荘司郁夫, Feb. 2000, 143, 146
• Cuコアはんだボールを用いたBGA接合部組織と機械的性質 -第2報-, 清野紳弥, 佐伯敏男, 上西啓介, 小林紘二郎, 荘司郁夫, 山本雅春, Feb. 2000, 125, 130
• In-Sn系はんだとAuのマイクロ接合部における金属間化合物成長過程, 藤原伸一, 小林紘二郎, 荘司郁夫, 藤井俊夫, Feb. 1999, 427, 432
• 0.5mmピッチCSP接合部の熱疲労強度評価, 荘司郁夫, 森日出雄, 折井靖光, Feb. 1999, 137, 142
• Cuコアはんだボールを用いたBGA接合部組織と機械的性質, 清野紳弥, 上西啓介, 荘司郁夫, 山本雅春, 小林紘二郎, Feb. 1999, 115, 120
• BGA/CSPのはんだ接合部の信頼性, 多久島正紀, 折井靖光, 荘司郁夫, 鳥山和重, Dec. 1998, 1, 8
• フリップチップ接合用はんだのせん断特性と熱疲労強度との関係について, 荘司郁夫, 折井靖光, 小林紘二郎, Jan. 1998, 199, 204
• フリップチップ用各種はんだの信頼性, 荘司郁夫, 折井靖光, 小林紘二郎, Jul. 1997, 47, 58
• フリップチップ接合部の熱疲労とクリープ特性, 荘司郁夫, 折井靖光, 小林紘二郎, Jan. 1997, 185, 190
• ワイヤボンド用チップを用いた狭ピッチフリップチップアタッチ実装法, 荘司郁夫, 山田毅, 木村英夫, 藤内伸一, 折井靖光, Jun. 1996, 7, 14
• Flip Chip Attach Technology by Au Bump and In Alloy Solder, I.Shohji, T.Yamada and H.Kimura, Apr. 1996, Proc. of the 9th IMC(International Microelectronics Conference), 314, 317
• ワイヤボンド用チップを用いたフリップチップアタッチ実装技術, 荘司郁夫, 山田毅, 木村英夫, 折井靖光, 藤内伸一, 酒井俊廣, Jan. 1996, 17, 22
• ノートパソコンにおけるMCM-Lの実装技術, 折井 靖光,荘司 郁夫,酒井 俊廣, Sep. 1995, 34, 9, 67, 71
• Other Metal BumpによるFlip Chip Attach実装技術の開発, 荘司郁夫, 山田毅, 木村英夫, Apr. 1995, 127, 130
• The Design of Flip chip Joint by Other Metal Bump - Flip Chip Attach Technology, Y.Tsukada, N.Watanuki, S.Okamoto and I.Shohji, Apr. 1994, Proc. of the 8th IMC(International Microelectronics Conference), 419, 424

Books etc

• 次世代半導体パッケージの最新動向とその材料、プロセスの開発, Contributor, 2023
• Leap to the Futute! 1　17 Program for Materials Science At Gunma University’s School of Science and Technology, Contributor, 2021, 88-91
• 接着・接合の支配要因と最適化技術, Contributor, 05 Feb. 2021, ISBN: 978-4-907002-84-8
• エレクトロニクス実装のためのマイクロ接合科学, 15 Oct. 2020, 2020, ISBN: 9784526080937
• Micro Joining and Reliability Design in Electronic Packaging, Ikuo Shohji, Yasumitu Orii, Kagakujyoho shuppan Co., Ltd., 2020
• 異種材料の接着・接合技術と マルチマテリアル化, Contributor, 2017, ISBN: 9784861046827
• 高分子の残留応力対策, Contributor, 2017, ISBN: 9784861046483
• －エレクトロニクス実装における－ マイクロ接合と信頼性設計法, 2014
• 機械材料学, 2014
• 精密加工と微細構造の形成技術, 2013
• マイクロ接合・実装技術, 2012, ISBN: 9784915957888
• 標準マイクロソルダリング技術 第３版, 2011, ISBN: 9784526066535
• 先端半導体パッケージ材料技術, 2010, ISBN: 9784861043321
• 塗工・成膜における密着・接着性の制御とその評価, 2005, ISBN: 486104071X
• ～”鉛フリー”対応～ BGA・CSP・フリップチップはんだ接合部の加速試験と信頼性評価法, 2005, ISBN: 4886572421
• 標準マイクロソルダリング技術 第２版, 2002

Presentations

• Sn-58Bi はんだとの界面反応抑制効果を有するプローブ材の開発, 渡會和己, 荘司郁夫, 小林竜也, 星野智久, 佐藤賢一, 小谷直仁, 小林俊介, 第141回マイクロ接合研究委員会, 12 May 2023
• 銅材料の疲労過程中の微視的金属組織変化の基礎研究, 嶋田祐也，渡辺広光，椙岡桐吾，荘司郁夫, 日本材料学会東海支部第17回学術講演会, 06 Mar. 2023
• Joining of Carbon Fiber Reinforced Thermoplastic to Metal using Electrodeposited Film, K. Yamazaki, I. Shohji, T. Kobayashi, 3rd International Conference on Materials Science and Engineering, Dec. 2022
• Deposition Mechanism and Water Repellency of Specially Shaped Plating Films, A. Kubo, I. Shohji, T. Kobayashi, 3rd International Conference on Materials Science and Engineering, Dec. 2022
• Brazing of Ferritic Stainless Steel with Al using Cr-free Brazing Filler Metal, Y. Matsuo, K. Tsukagoshi, I. Shohji, T. Kobayashi, J. Horohashi, K. Inoue, T. Wake, H. Yamamoto, 3rd International Conference on Materials Science and Engineering, Dec. 2022
• Observation of Early Fatigue Damage of Oxygen-free Copper for Electric Power Application by EBSD Analysis, T. Sugioka, I. Shohji, T. Kobayashi, 3rd International Conference on Materials Science and Engineering, Dec. 2022
• Interfacial Reaction Between Pd-Cu-Ni Alloy and Sn-58Bi Solder, K. Watarai, I. Shohji. T. Kobayashi, T. Hoshino, K. Sato, S. Kobayashi, N. Odani, 3rd International Conference on Materials Science and Engineering, Dec. 2022
• Experimental Study on a Use of Metal Sputtered Cellulose Powder as the Codeposited Particle into Nickel Electroplating Film, M. Iioka, W. Kawanabe, I. Shohji. T. Kobayashi, 3rd International Conference on Materials Science and Engineering, Dec. 2022
• Effect of Durability Improvement of Steel/Al Alloy Adhesive Joints by Ti-based Conversion Treatment, T. Kosaka, I. Shohji, T. Kobayashi, 3rd International Conference on Materials Science and Engineering, Dec. 2022
• 金属スパッタリング処理を施したセルロース粉末の電解ニッケル複合めっきの共析粒子としての適用検討, ース粉末の電解ニッケル複合めっきの共析粒子としての適用検討, 日本金属学会2022年秋期（第171回）講演大会, 23 Sep. 2022
• 電気化学測定を用いた特殊形状めっき膜の成膜原理と撥水性評価, 久保瑛史, 荘司郁夫, 小林竜也, 日本金属学会2022年秋期（第171回）講演大会, 23 Sep. 2022
• 無電解法を用いたNi-CNF複合めっき膜の創製, 川鍋渉, 飯岡諒, 荘司郁夫, 小林竜也, 日本金属学会2022年秋期（第171回）講演大会, 22 Sep. 2022
• スズ-セルロースナノファイバー複合めっきによる鉛フリーはんだの作製と評価, 木暮明勇輝, 荘司郁夫, 小林竜也, 日本金属学会2022年秋期（第171回）講演大会, 22 Sep. 2022
• Zn-Al粒子分散めっきによる高温はんだの創製, 安彦祐輝, 荘司郁夫, 小林竜也, 日本金属学会2022年秋期（第171回）講演大会, 22 Sep. 2022
• Ni-Cu合金めっき膜を付与した金属とCFRTPとのガルバニック腐食挙動, 清水憩, 荘司郁夫, 小林竜也, 日本金属学会2022年秋期（第171回）講演大会, 22 Sep. 2022
• 三次元構造Ni-Cu合金めっきの生成メカニズムの調査, Pham Thai Anh, 荘司郁夫, 小林竜也, 日本金属学会2022年秋期（第171回）講演大会, 22 Sep. 2022
• Sn-Ag-Cu系はんだボール接合部のせん断強度に及ぼすSb添加の影響, 小山真里奈, 荘司郁夫. 小林竜也, Anuar Mohd Salleh Mohd Arif, 日本金属学会2022年秋期（第171回）講演大会, 22 Sep. 2022
• Pd-Cu-Ni合金とSn-58Biはんだとの界面反応, 渡會和己, 荘司郁夫, 小林竜也, 星野智久, 佐藤賢一, 小林俊介, 小谷直仁, 日本金属学会2022年秋期（第171回）講演大会, 22 Sep. 2022
• Al/エポキシ樹脂接着部の接着強度に及ぼす高温高湿時効の影響, 渡部樹, 荘司郁夫, 小林竜也, 日本金属学会2022年秋期（第171回）講演大会, 21 Sep. 2022
• Cu-Mn-Niろうによるフェライト系ステンレス鋼ろう付部のミクロ組織, 松尾祐哉, 荘司郁夫, 小林竜也, 広橋順一郎, 井上勝文, 和氣庸人, 山本巨紀, 日本金属学会2022年秋期（第171回）講演大会, 21 Sep. 2022
• 金属/CFRTPの接合性に及ぼす特殊形状めっきおよび下地めっき成膜プロセスの影響, 山﨑康平, 荘司郁夫, 小林竜也, 日本金属学会2022年秋期（第171回）講演大会, 21 Sep. 2022
• Ti系化成処理による鋼/Al合金接着剤継手の耐久性向上効果, 小坂豪志, 荘司郁夫, 小林竜也, 日本金属学会2022年秋期（第171回）講演大会, 21 Sep. 2022
• A6061/GA980抵抗スポット溶接部のミクロ組織と機械的特性, 野々村俊希, 小坂豪志, 荘司郁夫, 小林竜也, 伊與田宗慶, 日本金属学会2022年秋期（第171回）講演大会, 21 Sep. 2022
• 電力機器用無酸素銅の初期疲労損傷観察, 椙岡桐吾, 荘司郁夫, 小林竜也, 日本金属学会2022年秋期（第171回）講演大会, 21 Sep. 2022
• 初期疲労損傷過程における無酸素銅のすべり挙動調査とEBSD解析, 椙岡桐吾，荘司郁夫，小林竜也, 溶接学会2022年度秋季全国大会, 09 Sep. 2022
• Pd-Cu-Ni合金/Sn-58Biはんだ界面反応層の時効による変化, 渡會和己，荘司郁夫，小林竜也，星野智久，佐藤賢一，小林俊介，小谷直仁, 溶接学会2022年度秋季全国大会, 09 Sep. 2022
• Al含有フェライト系ステンレス鋼のCu-Mn-Niろうによるろう付, 松尾祐哉，荘司郁夫，小林竜也，広橋順一郎，井上勝文，和氣庸人，山本巨紀, 溶接学会2022年度秋季全国大会, 09 Sep. 2022
• Sn-Sb-Ag 系高温鉛フリーはんだの疲労損傷挙動に及ぼす添加元素の影響, 荘司郁夫, 山本瑞貴, 山中佑太, 小林竜也, 三ツ井恒平, 渡邉裕彦, 第136回マイクロ接合研究委員会, Dec. 2021
• 電子実装用エポキシ樹脂および接着界面の劣化挙動, 荘司郁夫, 第 52 回 IEEE EPS Japan Chapter イブニングミーティング, 26 Nov. 2021
• 半導体パッケージ検査用プローブ材と Sn-58Bi はんだとの界面反応の調査, 渡會和己, 荘司郁夫, 小林竜也, 星野智久, 佐藤賢一, 小林俊介, 小谷直仁, 日本金属学会2021年秋期（第169回）講演大会, 17 Sep. 2021
• Sn-Sb-Ag-Ni-Ge 系はんだ接合部のパワーサイクル損傷挙動, 山中佑太, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦, 日本金属学会2021年秋期（第169回）講演大会, 17 Sep. 2021
• Sn-Sb-Ag-Ni-Ge 系はんだ合金の疲労特性に及ぼす Ni 添加量の影響, 山本瑞貴, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦, 日本金属学会2021年秋期（第169回）講演大会, 17 Sep. 2021
• ニッケル - セルロースナノファイバ複合電解めっき膜の共析形態に及ぼす電流密度および通電電荷密度の影響, 飯岡諒, 川鍋渉, 荘司郁夫, 小林竜也, 日本金属学会2021年秋期（第169回）講演大会, 17 Sep. 2021
• 複合めっきによるセルロースナノファイバー含有鉛フリーはんだの作製と評価, 木暮明勇輝, 荘司郁夫, 小林竜也, 日本金属学会2021年秋期（第169回）講演大会, 17 Sep. 2021
• Ni-P-Cr 合金めっき膜を用いたろう付部の腐食挙動, 松尾祐哉, 劉澍彬, 荘司郁夫, 小林竜也, 広橋順一郎, 和氣庸人, 山本巨紀, 日本金属学会2021年秋期（第169回）講演大会, 17 Sep. 2021
• Al めっき鋼板めっき部のホットスタンプ過程におけるミクロ組織変化, 神谷恭平, 荘司郁夫, 小林 竜也, 宮長博章, 日本金属学会2021年秋期（第169回）講演大会, 16 Sep. 2021
• 三次元Ni-Cuめっき膜を用いたCFRTPとステンレス鋼との接合, 山﨑康平, 荘司郁夫, 小林竜也, 日本金属学会2021年秋期（第169回）講演大会, 16 Sep. 2021
• GA 鋼 /Al 合金のレーザ溶接部のミクロ組織と接合強度, 中山耕作, 荘司郁夫, 小林 竜也, 松永達則, 日本金属学会2021年秋期（第169回）講演大会, 16 Sep. 2021
• A6061/GA980 摩擦攪拌点接合部のミクロ組織と機械的特性, 小坂豪志, 熊本光希, 荘司郁夫, 小林竜也, 日本金属学会2021年秋期（第169回）講演大会, 16 Sep. 2021
• 電力機器用無酸素銅の低サイクル疲労特性調査, 椙岡桐吾, 荘司郁夫, 小林竜也, 嶋田祐也, 渡辺 広光, 日本金属学会2021年秋期（第169回）講演大会, 15 Sep. 2021
• Al プレート上に生成した特殊形状めっき膜の撥水性評価, 久保瑛史, 荘司郁夫, 小林 竜也, 日本金属学会2021年秋期（第169回）講演大会, 15 Sep. 2021
• 鋳造を利用したプリカーサ法における溶湯への増粘剤粒子添加方法の検討, 鈴木良祐，松原雅昭，半谷禎彦，荘司郁夫，藤井英俊, 日本鋳造工学会第177 回全国講演大会, 23 May 2021
• 発泡補修における補修部材の気孔率制御, 鈴木良祐，浅川友祐，松原雅昭，半谷禎彦，莊司郁夫，藤井英俊, 軽金属学会第140回春期大会, 15 May 2021
• 電解法によるNi-P-Crろう材膜の創製, 劉澍彬，荘司郁夫，小林竜也，広橋順一郎，和氣庸人，山本巨紀, 2021年度第1回日本溶接協会ろう部会技術委員会先端材料接合委員会, 12 May 2021
• ソルダリングの基礎と応用2 －ソルダリング部の信頼性, 荘司郁夫, 溶接学会 2020年度 溶接工学専門講座 ナノ・マイクロ接合における材料・プロセスと微小領域の評価法, 17 Nov. 2020
• 高温高湿環境下における樹脂/金属接着部の劣化挙動, 荘司郁夫, 日本接着学会　構造接着・精密接着研究会 2020年度 第2回研究講演会, 09 Oct. 2020
• Fe/Al レーザ溶接部のミクロ組織と機械的特性, 中山耕作, 荘司郁夫, 小林竜也, 松永達則, 日本金属学会2020年秋期（第167回）講演大会, 17 Sep. 2020
• A6061/亜鉛めっき鋼板FSSW 部のミクロ組織と接合強度, 熊本光希, 荘司郁夫, 小林竜也, 日本金属学会2020年秋期（第167回）講演大会, 17 Sep. 2020
• 車載用薄板鋼板の抵抗スポット溶接の有限要素シミュレーション, 神谷恭平, 荘司郁夫, 小林竜也, 金井健, 日本金属学会2020年秋期（第167回）講演大会, 17 Sep. 2020
• Sn-Sb-Ag 系高温鉛フリーはんだの疲労特性に及ぼすNi 添加の影響, 山本瑞貴, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦, 日本金属学会2020年秋期（第167回）講演大会, 16 Sep. 2020
• 無酸素銅の低サイクル領域における疲労特性調査, 山中佑太, 荘司郁夫, 小林竜也, 小幡佳弘, 倉澤元樹, 日本金属学会2020年秋期（第167回）講演大会, 16 Sep. 2020
• 無酸素銅の低サイクル領域における疲労特性調査, 田中拓真, 荘司郁夫, 小林竜也, 唐澤安緒, 日本金属学会2020年秋期（第167回）講演大会, 16 Sep. 2020
• マルチマテリアル用マイクロ接合技術の最新動向, 荘司郁夫, 日本塑性加工学会 接合・複合分科会 第 99 回研究会・見学会「最近のミクロ接合・複合技術の展開」, 29 Nov. 2019
• ⽔溶液処理を施したAlの固相拡散接合の接合強度調査, 田中拓真, 荘司郁夫, 小林竜也, 今井久司, スマートプロセス学会令和元年度学術講演会, 26 Nov. 2019
• Fe/Al抵抗溶接部の接合強度に及ぼす溶接条件の影響, 熊本光希, 荘司郁夫, ⼩林⻯也, 伊與⽥宗慶, スマートプロセス学会令和元年度学術講演会, 26 Nov. 2019
• 接着継⼿の⾼温⾼湿環境下における樹脂材凝集⼒および接着界⾯の劣化挙動調査, 安孫⼦瞳, 荘司郁夫, ⼩林⻯也, 冨⽥雄吾, 松永達則, スマートプロセス学会令和元年度学術講演会, 26 Nov. 2019
• 腐⾷による熱交換器⽤Niろうのミクロ組織変化, 深井祐佑, ⼩林⻯也, 荘司郁夫, 安藤哲也, 吉⽥拓也, 柏瀬毅, ⼤友昇, スマートプロセス学会令和元年度学術講演会, 26 Nov. 2019
• 電析Ni-11mass%P合⾦ろうの電気化学的挙動の調査, 橋本晏奈, 荘司郁夫, 小林竜也, 劉澍彬, スマートプロセス学会令和元年度学術講演会, 26 Nov. 2019
• 加速劣化試験による銅/樹脂接着界⾯の劣化挙動調査, 鈴木陸, 荘司郁夫, ⼩林⻯也, ⼾野塚悠, スマートプロセス学会令和元年度学術講演会, 26 Nov. 2019
• Effect of Aging under High-temperature and High-humidity Environment on Adhesion Strength and Change in Chemical Structure of Structural Adhesive, Hitomi Abiko, Ikuo Shohji, Seigo Shimizu, Yugo Tomita, MS&T19, 01 Oct. 2019
• Investigation of Mechanical Properties of Sn-5Sb and Sn-6.4Sb-3.9Ag Hightemperature Lead-free Solder, Kohei Mitsui, Ikuo Shohji, MS&T19, 01 Oct. 2019
• Investigation of Corrosion Resistance of Nickel-based Brazing Filler Metal for Stainless Steel for Heat Exchanger, Yusuke Fukai, Ikuo Shohji, Tetsuya Ando, Takuya Yoshida, Tuyoshi Kashiwase, MS&T19, 01 Oct. 2019
• エポキシ樹脂/銅接着界面の高温高湿環境下における劣化挙動, 鈴木陸,荘司郁夫,小林竜也,戸野塚悠, 日本金属学会2019年秋期講演大会, 13 Sep. 2019
• Sn-Sb-Ag および Sn-Sb-Ag-Ni-Ge 系合金の高温疲労特性調査, 三ツ井恒平,荘司郁夫,小林竜也,渡邉裕彦, 日本金属学会2019年秋期講演大会, 13 Sep. 2019
• 高温高湿環境下における接着継手の強度低下メカニズム, 安孫子瞳,荘司郁夫,小林竜也,松永達則,冨田雄吾, 日本金属学会2019年秋期講演大会, 12 Sep. 2019
• Fe/Al 抵抗スポット溶接部のミクロ組織と接合強度, 熊本光希,荘司郁夫,小林竜也,伊與田宗慶, 日本金属学会2019年秋期講演大会, 12 Sep. 2019
• 電解 Ni-P 被膜を利用した熱交換器用 SUS304 鋼のろう付, 橋本晏奈,劉澍彬,荘司郁夫,小林竜也, 日本金属学会2019年秋期講演大会, 12 Sep. 2019
• ミクロ組織観察による Ni ろうの腐食挙動調査, 深井祐佑,荘司郁夫,小林竜也,安藤哲也,吉田拓也,柏瀬毅,大友昇, 日本金属学会2019年秋期講演大会, 12 Sep. 2019
• 水溶液処理を利用した Al 固相拡散接合の検討, 田中拓真,荘司郁夫,小林竜也,今井久司, 日本金属学会2019年秋期講演大会, 12 Sep. 2019
• マルチマテリアルの展開 ー車載版から電子版へー, 荘司 郁夫, 群馬大学重点支援プロジェクト「発展型マルチマテリアル実装プラットフォームの構築」最先端研究成果紹介シンポジウム, 08 Mar. 2019
• 熱交換器用Niろうの電気化学測定による腐食挙動調査, 深井祐佑,荘司郁夫,安藤哲也,吉田拓也,柏瀬毅,大友昇, Mate 2019(Microjoining and Assembly Technology in Electronics), 30 Jan. 2019
• Sn-５SbおよびSn-Sb-Ag三元共晶合金の高温疲労特性, 三ツ井恒平,荘司郁夫, Mate 2019(Microjoining and Assembly Technology in Electronics), 30 Jan. 2019
• Sn-Sb-Ni系高温用鉛フリーはんだの微細組織及び機械的特性, 小林竜也,三ツ井恒平,荘司郁夫, Mate 2019(Microjoining and Assembly Technology in Electronics), 30 Jan. 2019
• 構造用接着剤の接着強度の劣化に及ぼす高温高湿環境の影響, 安孫子瞳,荘司郁夫,清水誠吾,冨田雄吾, Mate 2019(Microjoining and Assembly Technology in Electronics), 30 Jan. 2019
• Finite Element Method Analysis of Densification Process of Sintered Steelfor Automobile in Cold Forging, Y. Morokuma,Y. Kamakoshi,S.Nishida,I. Shohji, AEEIT-2019, 10 Jan. 2019
• Erosion Resistance Properties of Iron-carbon Composite Plating to MoltenLead-freeSolder, J. Watanabe,K. Hatsuzawa,S. Ogata,S. Yoshida,I. Shohji, 4th International Conference on Nanojoining and Microjoining 2018 (NMJ2018), 08 Dec. 2018, English
• Micro-brazing of Stainless Steel using Ni-P Alloy Plating, Shubin Liu,Ikuo Shohji,Makoto Iioka,Anna Hashimoto,Junichiro Hirohashi,TsunehitoWake,Susumu Arai, 4th International Conference on Nanojoining and Microjoining 2018 (NMJ2018), 08 Dec. 2018, English
• Residual Stress Analysis in Glass Substrate for Electronic Packaging byFiniteElement Method, A. Shinohara,I. Shohji,Y. Umemura, 4th International Conference on Nanojoining and Microjoining 2018 (NMJ2018), 08 Dec. 2018, English
• Effect of Ni Addition on Tensile and Fatigue Properties of Sn-Sb Alloy, T. Kobayashi,K. Mitsui,I. Shohji, 4th International Conference on Nanojoining and Microjoining 2018 (NMJ2018), 04 Dec. 2018, English
• Fe-Alレーザ接合部の組織および強度に及ぼすレーザ照射⽅向の影響, 安孫子瞳,荘司郁夫,清水誠吾,松永達則, スマートプロセス学会平成30年度秋季総合学術講演会, 27 Nov. 2018
• Sn-5SbおよびSn-3.5Ag-0.5Cu-0.07Ni-0.01Ge鉛フリーはんだのミクロ組織と引張特性, 小林竜也,小林恭輔,横井雅輝,三ツ井恒平,荘司郁夫, スマートプロセス学会平成30年度秋季総合学術講演会, 27 Nov. 2018
• ガラス基板の残留応⼒および反り挙動の調査, 篠原亜門,荘司郁夫,梅村優樹, スマートプロセス学会平成30年度秋季総合学術講演会, 27 Nov. 2018
• ⾼張⼒鋼重ね継⼿の継⼿強度に及ぼすミクロ組織および⽌端部形状の影響, 泉隆宏,荘司郁夫,宮長博章, スマートプロセス学会平成30年度秋季総合学術講演会, 27 Nov. 2018
• 熱交換機⽤Niろうの腐⾷挙動調査, 深井祐佑,荘司郁夫,安藤哲也, スマートプロセス学会平成30年度秋季総合学術講演会, 27 Nov. 2018
• 有限要素法を用いたガラス基板の残留応力解析, 篠原亜門,荘司郁夫,梅村優樹, 日本金属学会2018年秋期講演大会, 20 Sep. 2018
• Sn-5Sb を用いたピン接合部の高温疲労特性, 三ツ井恒平,荘司郁夫, 日本金属学会2018年秋期講演大会, 20 Sep. 2018
• Sn-Ag-Cu-Ni-Ge 微小試験片の機械的特性と疲労部のEBSD 解析, 横井雅輝,荘司郁夫, 日本金属学会2018年秋期講演大会, 20 Sep. 2018
• Ni-P複合めっき法によるNiろうの創製, 飯岡諒,橋本晏奈,荘司郁夫,広橋順一郎,和氣庸人, 日本金属学会2018年秋期講演大会, 20 Sep. 2018
• 熱交換機用Ni ろうの腐食挙動の電気化学測定, 深井祐佑,荘司郁夫,安藤哲也,吉田拓也,柏瀬毅,大友昇, 日本金属学会2018年秋期講演大会, 20 Sep. 2018
• レーザ溶接によるFe-Al接合部のミクロ組織と機械的特性, 安孫子瞳,荘司郁夫,清水清吾,松永達則, 日本金属学会2018年秋期講演大会, 20 Sep. 2018
• Sn-Ag-Cu-In 系はんだ接合部でのピラー状IMC 生成に及ぼす接合時冷却速度の影響, 三木健司,荘司郁夫,中田裕輔,林和, 日本金属学会2018年秋期講演大会, 20 Sep. 2018
• 高張力鋼溶接部の疲労強度に及ぼす溶接ワイヤおよび余盛形状の影響, 泉隆宏,荘司郁夫,宮長博章, 日本金属学会2018年秋期講演大会, 20 Sep. 2018
• 鉄系焼結材における冷間鍛造シミュレーション, 諸隈湧気,鎌腰雄一郎,西田進一,荘司郁夫, 日本金属学会2018年秋期講演大会, 20 Sep. 2018
• ピラー状金属間化合物分散鉛フリーはんだ接合部生成に及ぼす冷却速度の影響, 三木健司,荘司郁夫,中田裕輔,林和, Mate 2018(Microjoining and Assembly Technology in Electronics), 2018
• Sn-Ag-Cu-Ni-Ge微小試験片の引張特性および疲労特性に及ぼす温度の影響, 横井雅輝,荘司郁夫, Mate 2018(Microjoining and Assembly Technology in Electronics), 2018
• ピラー状金属間化合物分散鉛フリーはんだ接合部の信頼性に関する検討, 中田裕輔,林和,倉澤元樹,橋本富仁,三木健司,荘司郁夫, Mate 2018(Microjoining and Assembly Technology in Electronics), 2018
• 有限要素解析によるガラス基板のき裂発生メカニズムの調査, 篠原亜門,荘司郁夫,梅村優樹, Mate 2018(Microjoining and Assembly Technology in Electronics), 2018
• Sn-57Bi-1Ag 鉛フリーはんだを用いた低温接合に及ぼすAg 電極材の影響, 丸屋優樹,秦英恵,荘司郁夫, Mate 2018(Microjoining and Assembly Technology in Electronics), 2018
• 高温高湿試験による銅/エポキシ樹脂接着界面の寿命評価, 戸野塚悠,荘司郁夫,外薗洋昭,高橋邦明,江連徳, Mate 2018(Microjoining and Assembly Technology in Electronics), 2018
• 有限要素法による多孔質材料の大変形シミュレーション, 諸隈湧気,鎌腰雄一郎,西田進一,荘司郁夫, Mate 2018(Microjoining and Assembly Technology in Electronics), 2018
• Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge Lead-Free Solder, THERMEC'2018, 2018
• Investigation of Crack initiation in Glass Substrate by Residual Stress analysis, THERMEC'2018, 2018
• A Study on Reliability of Pillar-Shaped intermetallic Compounds Dispersed Lead-Free Solder Joint, THERMEC'2018, 2018
• Plastic Deformation Simulation of Sintered Ferrous Material in Cold-Forging Process, THERMEC'2018, 2018
• Effect of Cooling Rate on intermetallic Compounds Formation in Sn-Ag-Cu-In Solder, THERMEC'2018, 2018
• Microstructure and Mechanical Properties of Welded Joints of Several High Tensile Strength Steel, THERMEC'2018, 2018
• Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge Lead-Free Solder, THERMEC'2018, 2018
• Investigation of Crack initiation in Glass Substrate by Residual Stress analysis, THERMEC'2018, 2018
• A Study on Reliability of Pillar-Shaped intermetallic Compounds Dispersed Lead-Free Solder Joint, THERMEC'2018, 2018
• Plastic Deformation Simulation of Sintered Ferrous Material in Cold-Forging Process, THERMEC'2018, 2018
• Effect of Cooling Rate on intermetallic Compounds Formation in Sn-Ag-Cu-In Solder, THERMEC'2018, 2018
• Microstructure and Mechanical Properties of Welded Joints of Several High Tensile Strength Steel, THERMEC'2018, 2018
• Sn-57Bi-1Ag鉛フリーはんだ接合部のミクロ組織と接合強度に及ぼす電極材の影響, 丸屋優樹,秦英恵,荘司郁夫,小山真司, Mate 2017(Microjoining and Assembly Technology in Electronics), 2017
• Sn-5Sbの機械的特性とパワーサイクル環境下におけるSn-5Sb接合部の特性変化, 小林恭輔,荘司郁夫,小山真司,外薗洋昭, Mate 2017(Microjoining and Assembly Technology in Electronics), 2017
• ピラー状金属間化合物分散鉛フリーはんだ接合部の生成に及ぼす諸条件の効果, 林和,荘司郁夫,小山真司,中田裕輔,橋本富仁, Mate 2017(Microjoining and Assembly Technology in Electronics), 2017
• 時効による高分子結合の変化に伴うエポキシ樹脂と銅との接着強度劣化挙動, 戸野塚悠,荘司郁夫,小山真司,外薗洋昭, Mate 2017(Microjoining and Assembly Technology in Electronics), 2017
• 構造用接着剤の接着強度の劣化に及ぼす破壊形態および加水分解の影響, 冨田雄吾,荘司郁夫,小山真司,清水誠吾, Mate 2017(Microjoining and Assembly Technology in Electronics), 2017
• 電気化学的測定法を用いた銅及び銅合金の腐食特性に及ぼすブライン中の防錆剤の影響調査, 樋口和成,荘司郁夫,小山真司,安藤哲也,水谷佳一,井上行雄, Mate 2017(Microjoining and Assembly Technology in Electronics), 2017
• (001)および(111)配向銀めっき皮膜のセルフアニーリング過程における再結晶挙動, 林佑美,荘司郁夫,小山真司,宮澤寛, Mate 2017(Microjoining and Assembly Technology in Electronics), 2017
• ピラー状金属間化合物分散鉛フリーはんだ接合の形成メカニズムに関する検討, 中田裕輔,倉澤元樹,橋本富仁,林和,荘司郁夫, Mate 2017(Microjoining and Assembly Technology in Electronics), 2017
• 高張力銅溶接部のミクロ組織と機械的性質, スマートプロセス学会平成29年度秋季総合学術講演会, 2017
• エポキシ樹脂と銅との接着強度に及ぼす高温高湿時効の影響, スマートプロセス学会平成29年度秋季総合学術講演会, 2017
• 残留応力によるガラス基板のき裂発生に関する基礎的研究, スマートプロセス学会平成29年度秋季総合学術講演会, 2017
• ピラー状金属間化合物がはんだ接合部の熱疲労信頼性に与える影響, スマートプロセス学会平成29年度秋季総合学術講演会, 2017
• Sn-Ag-Cu-In系鉛フリーはんだ接合部中での金属間化合物生成に及ぼす冷却速度の影響, スマートプロセス学会平成29年度秋季総合学術講演会, 2017
• Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge微小試験片の引張・疲労特性と破壊挙動, スマートプロセス学会平成29年度秋季総合学術講演会, 2017
• Sn-57Bi-1Ag鉛フリーはんだを用いた低温接合部の高融点化に及ぼす各種電極材の影響, スマートプロセス学会平成29年度秋季総合学術講演会, 2017
• Comparison between Sn-Sb and Sn-Ag-Cu-Ni-Ge alloys in Tensile Properties Using Miniature Size Specimen, The Electronic Packaging Interconnect Technology Symposium (EPITS 2017), 2017
• 高温高湿処理によるウェルドボンド用構造用接着剤バルク材の劣化挙動, 日本金属学会2017年秋期講演大会, 2017
• 鉄系焼結冷間鍛造材の塑性変形シミュレーション, 日本金属学会2017年秋期講演大会, 2017
• Sn-Ag-Cu-Ni-Ge系鉛フリーはんだの機械的特性, 日本金属学会2017年秋期講演大会, 2017
• Sn-57Bi-1Ag鉛フリーはんだ接合部の接合特性と溶融特性に及ぼすAg電極材の影響, 日本金属学会2017年秋期講演大会, 2017
• ピラー状金属間化合物の生成および接合強度に及ぼす接合条件の影響, 日本金属学会2017年秋期講演大会, 2017
• 青銅の腐食挙動に及ぼすブライン中の防錆剤の影響, 日本金属学会2017年秋期講演大会, 2017
• Change in Chemical Structure of Structural Adhesive under High Temperature and Humidity Conditions, InterPACK2017, 2017
• Corrosion Behavior of Copper-Based Heat Pipe Materials in Aqueous Propylene Glycol with Rust Inhibitor, InterPACK2017, 2017
• Effect of Surface Finish of Cu Electrode on Characteristics of High Melting Point Joint Using Sn-57Bi-1Ag, InterPACK2017, 2017
• Temperature Dependency of Adhesion Strength of Resin/Cu Interface and its Degradation Mechanism under Aging, InterPACK2017, 2017
• Improvement of Mechanical Strength of Sintered Mo Alloyed Steel by Optimization of Sintering and Cold-forging Processes with Densification, ICMER2017, 2017
• Finite Element Method Analysis of Cold Forging For Deformation and Densification of Mo alloyed Sintered Steel, ICMER2017, 2017
• Formation Mechanism of Pillar-Shaped Intermetallic Compounds Dispersed Lead-Free Solder Joint, ICMER2017, 2017
• Effect of High Temperature and Humidity Treatment on Adhesion Properties and Bulk Properties of Structural Adhesive, ICEP2017, 2017
• Fabrication of High Melting Point Joint using Sn-57Bi-1Ag Low Temperature Lead-free Solder andGold-plated Electrode, ICEP2017, 2017
• 酢酸塩被膜付与Znシートを用いたA1070の液相拡散接合, 軽金属学会第132回春期大会, 2017
• チタンの耐食・耐摩耗性に及ぼすほう化・窒化処理の影響, 軽金属学会第132回春期大会, 2017
• ガラスコア電子部品接合部の高速せん断特性, 日本金属学会2017年秋期講演大会, 2017
• ビスフェノールＦ型エポキシ樹脂と銅との接着強度に及ぼす試験温度の影響, 日本金属学会2017年秋期講演大会, 2017
• Electrochemical Corrosion of Copper and Copper Alloy in Aqueous Propylene Glycol Containing Rust Inhibitors, ICEP2017, 2017
• Effect of Aging and Test Temperature on Adhesion Strength of Copper and Epoxy Resin, ICEP2017, 2017
• Comparison between Sn-Sb and Sn-Ag-Cu-Ni-Ge alloys in Tensile Properties Using Miniature Size Specimen, The Electronic Packaging Interconnect Technology Symposium (EPITS 2017), 2017
• Change in Chemical Structure of Structural Adhesive under High Temperature and Humidity Conditions, InterPACK2017, 2017
• Corrosion Behavior of Copper-Based Heat Pipe Materials in Aqueous Propylene Glycol with Rust Inhibitor, InterPACK2017, 2017
• Effect of Surface Finish of Cu Electrode on Characteristics of High Melting Point Joint Using Sn-57Bi-1Ag, InterPACK2017, 2017
• Temperature Dependency of Adhesion Strength of Resin/Cu Interface and its Degradation Mechanism under Aging, InterPACK2017, 2017
• Improvement of Mechanical Strength of Sintered Mo Alloyed Steel by Optimization of Sintering and Cold-forging Processes with Densification, ICMER2017, 2017
• Finite Element Method Analysis of Cold Forging For Deformation and Densification of Mo alloyed Sintered Steel, ICMER2017, 2017
• Formation Mechanism of Pillar-Shaped Intermetallic Compounds Dispersed Lead-Free Solder Joint, ICMER2017, 2017
• Electrochemical Corrosion of Copper and Copper Alloy in Aqueous Propylene Glycol Containing Rust Inhibitors, ICEP2017, 2017
• Effect of Aging and Test Temperature on Adhesion Strength of Copper and Epoxy Resin, ICEP2017, 2017
• Effect of High Temperature and Humidity Treatment on Adhesion Properties and Bulk Properties of Structural Adhesive, ICEP2017, 2017
• Fabrication of High Melting Point Joint using Sn-57Bi-1Ag Low Temperature Lead-free Solder andGold-plated Electrode, ICEP2017, 2017
• パワーモジュール向けピラー状IMC分散鉛フリーはんだ接合部の開発, 中田裕輔,橋本富仁,林和,荘司郁夫, 第113回マイクロ接合研究委員会, 2016
• Fe基ろうによるSUS304ろう付部の腐食挙動と電気化学的性質, 角田貴宏,石康道,荘司郁夫,松康太郎,田口育宏, Mate 2016(Microjoining and Assembly Technology in Electronics) Proc, 2016
• (001)優先配向を示す銀めっき皮膜のセルフアニーリング挙動その場観察, 林佑美,荘司郁夫,宮澤寛, Mate 2016(Microjoining and Assembly Technology in Electronics) Proc, 2016
• 有限要素解析によるガラスインターポーザ実装基板の熱応力解析, 窪田悠人,荘司郁夫,土田徹勇起,中村清智, Mate 2016(Microjoining and Assembly Technology in Electronics), 2016
• Sn-5Sb微小試験片の疲労特性に及ぼす温度の影響, 小林恭輔,荘司郁夫,外薗洋昭,西村芳孝, Mate 2016(Microjoining and Assembly Technology in Electronics) Proc, 2016
• Sn-1．0Ag-0．7Cu-1．6Bi-0．2In 低銀鉛フリーはんだの疲労特性に及ぼす負荷条件の影響, 髙橋祐樹,荘司郁夫, Mate 2016(Microjoining and Assembly Technology in Electronics) Proc, 2016
• ピラー状IMC分散鉛フリーはんだ接合部の組織と接合強度, 林和,荘司郁夫,中田裕輔,橋本富仁, Mate 2016(Microjoining and Assembly Technology in Electronics), 2016
• 構造用接着剤による冷間圧延鋼板の接着強度に及ぼす高温高湿処理の影響, スマートプロセス学会平成28年度秋季総合学術講演会, 2016
• ビスフェノールＦ型エポキシ樹脂と銅との接着強度に及ぼす高温時効の影響, スマートプロセス学会平成28年度秋季総合学術講演会, 2016
• Effect of Rust Inhibitor in Brine on Corrosion Properties of Copper, AMPT2016, 2016
• Degradation Behaviors of Adhesion Strength Between Epoxy Resin and Copper under Aging at High Temperature, AMPT2016, 2016
• Degrdation Behaviors of Adhesion Strength of Structual Adhesive for Weld-Bonding under High Temperature and Humidity Conditions, AMPT2016, 2016
• Bonding Characteristics of Sn-57Bi-1Ag Low-Temperature Lead-Free Solder to Gold-Plated Copper, AMPT2016, 2016
• Change of Several Characteristics in Self-annealing of (001) Oriented Electrodeposited Silver Films, AMPT2016, 2016
• Effect of Bonding Time and Bonding Temperature on Lead-Free Solder Joints Dispersed Pillar Shaped, AMPT2016, 2016
• 銅及び銅合金の腐食特性に及ぼすブライン中の防錆剤の影響, 日本金属学会2016年秋期講演大会, 2016
• パワーモジュール用封止樹脂と銅との接着強度に及ぼす時効の影響, 日本金属学会2016年秋期講演大会, 2016
• Sn-5Sb微小試験片の引張・疲労特性と破壊挙動, 日本金属学会2016年秋期講演大会, 2016
• (001)および(111)優先配向を示す銀めっき皮膜のセルフアニーリング挙動調査, 日本金属学会2016年秋期講演大会, 2016
• ピラー状IMC分散鉛フリーはんだ接合部の組織と接合強度に及ぼす基板材の影響, 日本金属学会2016年秋期講演大会, 2016
• Sn-57Bi-1Ag低温鉛フリーはんだの接合特性に及ぼす電極材の影響, 日本金属学会2016年秋期講演大会, 2016
• 電気化学的測定によるブライン中における銅及び銅合金の腐食挙動調査, 溶接学会平成28年度秋季全国大会, 2016
• 銅とエポキシ樹脂の接着強度におよぼす金属表面処理の影響, 溶接学会平成28年度秋季全国大会, 2016
• Sn-57Bi-1AgはんだとAu電極による接合部の高融点化検討, 溶接学会平成28年度秋季全国大会, 2016
• Niろう代替Fe基ろうの接合特性について, 第1回ろう部会技術委員会 先端材料接合委員会, 2016
• Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-free Solder, THERMEC'2016, 2016
• Comparison of Self-annealing Behaviors in (001)- and (111)-Oriented Electrodeposited Silver Films by In Situ EBSP Analysis, THERMEC'2016, 2016
• Effect of Added Elements on Microstructures and Joint Strength of Lead-free Sn-based Solder Joint Dispersed IMC Pillar, THERMEC'2016, 2016
• A5052/SUS316Lの接合強度に及ぼす金属塩生成処理効果とその持続性評価, 溶接学会平成28年度秋季全国大会, 2016
• 金属塩被膜を付与したインサート材を用いたAl合金の液相拡散接合, 溶接学会平成28年度秋季全国大会, 2016
• A5052/SUS316Lの接合強度に及ぼすギ酸塩被膜処理効果とその化学特性評価, 日本金属学会2016年秋期講演大会, 2016
• ピラー状金属間化合物（ＩＭＣ）分散鉛フリーはんだ接合による高信頼性化, ＭＥＳ2016（第26回マイクロエレクトロニクスシンポジウム）, 2016
• Fracture Behaviours of Miniature Size Specimens of Sn-5Sb Lead-free Solder under Tensile and Fatigue Conditions, AMPT2016, 2016
• ウェルドボンド用構造用接着剤の劣化メカニズム, 日本金属学会2016年秋期講演大会, 2016
• 高温高湿下におけるウェルドボンド用構造用接着剤の劣化挙動, 溶接学会平成28年度秋季全国大会, 2016
• Sn-5Sb微小試験片の引張特性および疲労特性に及ぼす温度の影響, 溶接学会平成28年度秋季全国大会, 2016
• ピラー状ＩＭＣ分散鉛フリーはんだ接合部の接合特性に及ぼす接合条件, 溶接学会平成28年度秋季全国大会, 2016
• ギ酸塩被膜付与Znシートを用いた鋳造用Al合金の液相拡散接合, 日本金属学会2016年秋期講演大会, 2016
• Fracture Behaviours of Miniature Size Specimens of Sn-5Sb Lead-free Solder under Tensile and Fatigue Conditions, AMPT2016, 2016
• Effect of Rust Inhibitor in Brine on Corrosion Properties of Copper, AMPT2016, 2016
• Degradation Behaviors of Adhesion Strength Between Epoxy Resin and Copper under Aging at High Temperature, AMPT2016, 2016
• Degrdation Behaviors of Adhesion Strength of Structual Adhesive for Weld-Bonding under High Temperature and Humidity Conditions, AMPT2016, 2016
• Bonding Characteristics of Sn-57Bi-1Ag Low-Temperature Lead-Free Solder to Gold-Plated Copper, AMPT2016, 2016
• Change of Several Characteristics in Self-annealing of (001) Oriented Electrodeposited Silver Films, AMPT2016, 2016
• Effect of Bonding Time and Bonding Temperature on Lead-Free Solder Joints Dispersed Pillar Shaped, AMPT2016, 2016
• Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-free Solder, THERMEC'2016, 2016
• Comparison of Self-annealing Behaviors in (001)- and (111)-Oriented Electrodeposited Silver Films by In Situ EBSP Analysis, THERMEC'2016, 2016
• Effect of Added Elements on Microstructures and Joint Strength of Lead-free Sn-based Solder Joint Dispersed IMC Pillar, THERMEC'2016, 2016
• エポキシフラックスの濡れ特性とはんだボール接合部の補強効果, 石山旺欣,荘司郁夫,雁部竜也,渡邉裕彦, Mate 2015(Microjoining and Assembly Technology in Electronics), 2015
• ガラスインターポーザ基板を用いた鉛フリーはんだ接合部の熱応力解析, 窪田悠人,荘司郁夫,土田徹勇起,中村清智, Mate 2015(Microjoining and Assembly Technology in Electronics), 2015
• Sn-1.0Ag-0.7Cu-1.6Bi-0.2In低銀鉛フリーはんだの疲労特性, 髙橋祐樹,荘司郁夫, Mate 2015(Microjoining and Assembly Technology in Electronics), 2015
• Bi系高温鉛フリーはんだの引張特性に及ぼす温度と歪み速度の影響, 張海東,荘司郁夫,下田将義,渡邉裕彦, Mate 2015(Microjoining and Assembly Technology in Electronics), 2015
• Niろう代替Fe基ろうによるSUS304ろう付継手のミクロ組織と耐食性, 角田貴宏,荘司郁夫,石康道,松康太郎,田口育宏, Mate 2015(Microjoining and Assembly Technology in Electronics), 2015
• フリップチップ接合用アンダーフィル材の密着強度と疲労特性に及ぼすカップリング材の影響, 三ツ木寛尚,荘司郁夫,小山真司, Mate 2015(Microjoining and Assembly Technology in Electronics), 2015
• 短繊維強化PPSの機械的特性に及ぼす繊維含有量と温度の影響, 髙橋諒伍,荘司郁夫,関祐貴,丸山敏, Mate 2015(Microjoining and Assembly Technology in Electronics), 2015
• 有機基板に対するガラス配線基板の接続信頼性に及ぼす基板のCTE差の影響, 土田徹勇起,中村清智,窪田悠人,荘司郁夫, Mate 2015(Microjoining and Assembly Technology in Electronics), 2015
• 低銀鉛フリーはんだの接合強度に及ぼすBi,Ni,Ge添加の影響, 日本金属学会2015年秋期講演大会（第157回）, 2015
• ガラスインターポーザ基板を用いた低融点鉛フリーはんだ接合部の熱応力解析, 日本金属学会2015年秋期講演大会（第157回）, 2015
• Sn-1.0Ag-0.7Cu-1.6Bi-0.2In低銀鉛フリーはんだの機械的特性と疲労き裂進展挙動, 日本金属学会2015年秋期講演大会（第157回）, 2015
• 車載用鉛フリーはんだ接合部におけるIMC分散生成の検討, 日本金属学会2015年秋期講演大会（第157回）, 2015
• EBSP法によるAg電解膜のセルフアニーリング挙動その場観察, 日本金属学会2015年秋期講演大会（第157回）, 2015
• Niろう代替Fe基ろうによるSUS304ろう付継手の腐食挙動, 日本金属学会2015年秋期講演大会（第157回）, 2015
• Thermal Stress Analysis of Mounted Substrate Using Glass Interposer, InterPACK2015, 2015
• Corrosion Behavior of SUS304 Brazed Joint with Fe-based Filler Alternative to Ni-Based Filler, InterPACK2015, 2015
• Tensile Properties and Microstructures of High Temperature Bi-based Lead-free Solder, InterPACK2015, 2015
• Fatigue Properties and Fatigue Crack Propagation Behavior of Low-Ag Lead-free Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Solder, InterPACK2015, 2015
• Evaluation of self-annealing behavior of electrodeposited silver film by EBSP analysis, 17th Electronics Packaging Technology Conference (EPTC), 2015
• Development of high reliability lead-free solder joint dispersed IMC pillar, 17th Electronics Packaging Technology Conference (EPTC), 2015
• アンダーフィル用樹脂材料の機械的特性に及ぼす添加剤の影響, 樹脂実装研究会講演会, 2015
• Effect of third element addition on joint strength of low-Ag lead-free solder, 17th Electronics Packaging Technology Conference (EPTC), 2015
• Effect of third element addition on joint strength of low-Ag lead-free solder, 17th Electronics Packaging Technology Conference (EPTC), 2015
• Evaluation of self-annealing behavior of electrodeposited silver film by EBSP analysis, 17th Electronics Packaging Technology Conference (EPTC), 2015
• Development of high reliability lead-free solder joint dispersed IMC pillar, 17th Electronics Packaging Technology Conference (EPTC), 2015
• Thermal Stress Analysis of Mounted Substrate Using Glass Interposer, InterPACK2015, 2015
• Corrosion Behavior of SUS304 Brazed Joint with Fe-based Filler Alternative to Ni-Based Filler, InterPACK2015, 2015
• Tensile Properties and Microstructures of High Temperature Bi-based Lead-free Solder, InterPACK2015, 2015
• Fatigue Properties and Fatigue Crack Propagation Behavior of Low-Ag Lead-free Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Solder, InterPACK2015, 2015
• Sb, Zn添加Sn-Bi系はんだと無電解Ni/AuおよびNi/Pd/Au電極の接合特性に及ぼす時効の影響, 平田晃大,荘司郁夫,土田徹勇起,大久保利一, Mate 2014(Microjoining and Assembly Technology in Electronics), 2014
• エポキシ系フラックスによるボール接合部衝撃特性の向上効果, 石山旺欣,荘司郁夫,雁部竜也,渡邉裕彦, Mate 2014(Microjoining and Assembly Technology in Electronics), 2014
• フリップチップ接合用アンダーフィル材の機械的物性に及ぼすカップリング剤の影響, 三ツ木寛尚,荘司郁夫,小山真司,北郷慎也, Mate 2014(Microjoining and Assembly Technology in Electronics), 2014
• リチウムイオン二次電池用電解銅箔の疲労特性に及ぼす添加剤の影響, 永山卓弥,荘司郁夫,西貞造,呉元元, Mate 2014(Microjoining and Assembly Technology in Electronics), 2014
• 短繊維強化樹脂材料の機械的特性に及ぼす繊維方向および温度の影響, 髙橋諒伍,荘司郁夫,関祐貴,丸山敏, Mate 2014(Microjoining and Assembly Technology in Electronics), 2014
• 双ロール法により作製した高Al含有Mg合金の時効硬化とミクロ組織, 秋山主,荘司郁夫,小山真司,西田進一,渡利久規,藤倉圭佑, Mate 2014(Microjoining and Assembly Technology in Electronics), 2014
• 溶融Snとプラズマ窒化ステンレス鋼の界面反応, 服部真吾,荘司郁夫,桑原秀行, Mate 2014(Microjoining and Assembly Technology in Electronics), 2014
• 次世代鉛フリーはんだ接合の動向, 第28回エレクトロニクス実装学会春季講演大会, 2014
• Ni ろう代替Fe 基ろうによるSUS304 ろう付継手のミクロ組織と接合強度, 日本金属学会2014年秋期講演大会（第155回）, 2014
• Fe-Cr-Ni-P 系ろうによるSUS304 ろう付継手の接合強度, 日本金属学会2014年秋期講演大会（第155回）, 2014
• Sn-Ag-Cu-Bi-In 系低銀鉛フリーはんだの機械的特性, 日本金属学会2014年講演大会（第155回）, 2014
• Sn-Bi-Sb 系低融点鉛フリーはんだの機械的特性, 日本金属学会2014年秋期講演大会（第155回）, 2014
• フリップチップ接合用アンダーフィル材/銅の密着強度に及ぼすカップリング剤の影響, 日本金属学会2014年秋期講演大会（第155回）, 2014
• Bi 系高温鉛フリーはんだの機械的特性調査, 日本金属学会2014年秋期講演大会（第155回）, 2014
• 自動車部品用短繊維強化樹脂材料の疲労特性に及ぼす繊維配向の影響, 日本金属学会2014年秋期講演大会（第155回）, 2014
• 高Al 含有Mg-Al-Zn 系合金の疲労特性, 日本金属学会2014年秋期講演大会（第155回）, 2014
• 次世代鉛フリーはんだ接合の動向, JIEP2014ワークショップ 日本ブランド復権のカギを握る実装イノベーション －魅力ある機能・品質・コストへの挑戦－, 2014
• 車載電子デバイス実装における実装材料の信頼性評価, マイクロソルダリング技術 教育・認証フェスタ ～パワーデバイスの信頼性評価～, 2014
• 低Ag鉛フリーはんだの機械的特性, 日本溶接協会はんだ・微細接合部会シンポジウム～多様化する電子実装用微細接合～, 2014
• Mechanical Properties of Low-silver Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Solder, Proc. of 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), pp.784-787 (2014), 2014
• Joint Strength and Microstructures of Brazed Joints of Stainless Steel with Fe-based Filler, Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 2014
• Joint Strength and Microstructures of Brazed Joints of Stainless Steel with Fe-based Filler, Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 2014
• Tensile Properties of Low-melting Point Sn-Bi-Sb Solder, Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 2014
• Effect of Coupling Treatment of Filler and Copper Substrate on Adhesion of Underfill, Final Program of MS&T14,(2014 ), 2014
• Improvement Effect of Joint Reliability of Sn-3Ag-0.5Cu Solder Ball Joint with Epoxy-based Flux, Final Program of MS&T14,(2014 ), 2014
• Effect of Fiber Direction and Temperature on Fatigue Behaviors of Short Fiber-Reinforced PPS, Final Program of MS&T14,(2014 ), 2014
• Impact Properties of Sn-3Ag-0.5Cu Solder Ball Joint with Epoxy-Based Flux, ICEP 2014, 2014
• Effect of Coupling Agent on Adhesion of Underfill Materials on Copper, ICEP 2014, 2014
• Effect of Fiber Direction and Temperature on Mechanical Properties of Short Fiber-Reinforced PPS, ICEP 2014, 2014
• エポキシフラックスを用いたはんだボール接合部の衝撃特性に及ぼす時効処理の影響, 日本金属学会2014年秋期講演大会（第155回）, 2014
• Effect of Temperature on Tensile Properties of High-melting Point Bi System Solder, Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 2014
• Mechanical Properties of Low-silver Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Solder, Proc. of 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), pp.784-787 (2014), 2014
• Joint Strength and Microstructures of Brazed Joints of Stainless Steel with Fe-based Filler, Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 2014
• Joint Strength and Microstructures of Brazed Joints of Stainless Steel with Fe-based Filler, Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 2014
• Tensile Properties of Low-melting Point Sn-Bi-Sb Solder, Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 2014
• Effect of Coupling Treatment of Filler and Copper Substrate on Adhesion of Underfill, Final Program of MS&T14,(2014 ), 2014
• Improvement Effect of Joint Reliability of Sn-3Ag-0.5Cu Solder Ball Joint with Epoxy-based Flux, Final Program of MS&T14,(2014 ), 2014
• Effect of Fiber Direction and Temperature on Fatigue Behaviors of Short Fiber-Reinforced PPS, Final Program of MS&T14,(2014 ), 2014
• Impact Properties of Sn-3Ag-0.5Cu Solder Ball Joint with Epoxy-Based Flux, ICEP 2014, 2014
• Effect of Coupling Agent on Adhesion of Underfill Materials on Copper, ICEP 2014, 2014
• Effect of Fiber Direction and Temperature on Mechanical Properties of Short Fiber-Reinforced PPS, ICEP 2014, 2014
• Effect of Temperature on Tensile Properties of High-melting Point Bi System Solder, Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 2014
• フリップチップ接合用アンダーフィル材の材料物性に及ぼす温度およびフィラー添加量の影響, Mate 2013(Microjoining and Assembly Technology in Electronics), 2013
• Sn-Bi系鉛フリーはんだボールと無電解Ni/AuおよびNi/Pd/Au電極の接合特性, Mate 2013(Microjoining and Assembly Technology in Electronics), 2013
• 純Snによるプラズマ窒化ステンレス鋼の侵食挙動に及ぼす温度の影響, Mate 2013(Microjoining and Assembly Technology in Electronics), 2013
• リチウムイオン二次電池用電解銅箔の機械的特性に及ぼす添加剤の影響, Mate 2013(Microjoining and Assembly Technology in Electronics), 2013
• 鉛フリーはんだ微小試験片の引張特性に及ぼすミクロ組織とひずみ速度の影響, Mate 2013(Microjoining and Assembly Technology in Electronics), 2013
• 双ロール法により作製した高Al含有Mg合金の時効硬化, 日本金属学会2013年秋期講演大会（第153回）, 2013
• Sb, Zn添加Sn-Bi系はんだボールと無電解Ni/AuおよびNi/Pd/Au電極の接合特性, 日本金属学会2013年秋期講演大会（第153回）, 2013
• フリップチップ接合用アンダーフィル材の機械的特性に及ぼすフィラー添加量と時 効処理の影響, 日本金属学会2013年秋期講演大会（第153回）, 2013
• 純Snとプラズマ窒化処理ステンレス鋼の界面反応に及ぼす母材の影響, 日本金属学会2013年秋期講演大会（第153回）, 2013
• 電子部品用Cu膜の変質挙動, 日本金属学会2013年秋期講演大会 第153回, 2013
• 酢酸を用いた金属塩生成接合法によるCu/Cu固相接合, 日本金属学会2013年秋期講演大会（第153回）, 2013
• リチウムイオン二次電池用電解銅箔の疲労特性調査, 日本金属学会2013年秋期講演大会（第153回）, 2013
• 高シアン浴を用いた銀めっき膜の結晶配向制御とその特性, 日本銅学会 第53回講演大会, 2013
• 銀めっき膜の{200}配向に及ぼす高シアン浴中セレンの影響, 日本銅学会 第53回講演大会, 2013
• アンダーフィル材の引張特性に及ぼすフィラー添加量および熱劣化の影響, 第３回 電子デバイス実装研究委員会, 2013
• Mechanical Properties of Sn-58Bi, In-3Ag and SAC305 Solders Measured with Fine Diameter Specimens, IEEE CPMT Symposium Japan 2013, 2013
• Cu / Cu Direct Bonding by Metal Salt Generation Bonding Technique with Formic Acid and Citric Acid, THERMEC’2013, 2013
• Solid State Bonding of Al Alloy/SUS304 by Metal Salt Generation Bonding Technique with Acetic Acid, THERMEC’2013, 2013
• Effect of the contents of Se in high-cyanide silver plating solution on 200 orientation of the silver electro-deposited layer, THERMEC’2013, 2013
• Effect of Strain Rate on Tensile Properties of Miniature Size Specimens of Several Lead-free Alloys, THERMEC’2013, 2013
• Change of Characterization in Electroless Plating Ni-B Alloy Films by Heat Treatment, THERMEC’2013, 2013
• Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic Copper Foil, InterPACK2013, 2013
• Effect of Electrode Material on Joint Strength of Soldered Joints with Sn-Bi and Sn-Bi-Sb Lead-free Solder Balls, InterPACK2013, 2013
• Interfacial Reaction between Molten Sn and Plasma Nitrided Stainless Steel, InterPACK2013, 2013
• 窒化処理膜などの拡散タイプ処理膜の損傷メカニズムと評価試験方法, JEITA 環境調和型先端実装技術 成果報告会2013, 2013
• 自動車部品用繊維強化樹脂材料の機械的特性調査, 日本金属学会2013年秋期講演大会（第153回）, 2013
• Mechanical Properties of Sn-58Bi, In-3Ag and SAC305 Solders Measured with Fine Diameter Specimens, IEEE CPMT Symposium Japan 2013, 2013
• Cu / Cu Direct Bonding by Metal Salt Generation Bonding Technique with Formic Acid and Citric Acid, THERMEC’2013, 2013
• Solid State Bonding of Al Alloy/SUS304 by Metal Salt Generation Bonding Technique with Acetic Acid, THERMEC’2013, 2013
• Effect of the contents of Se in high-cyanide silver plating solution on 200 orientation of the silver electro-deposited layer, THERMEC’2013, 2013
• Effect of Strain Rate on Tensile Properties of Miniature Size Specimens of Several Lead-free Alloys, THERMEC’2013, 2013
• Change of Characterization in Electroless Plating Ni-B Alloy Films by Heat Treatment, THERMEC’2013, 2013
• Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic Copper Foil, InterPACK2013, 2013
• Effect of Electrode Material on Joint Strength of Soldered Joints with Sn-Bi and Sn-Bi-Sb Lead-free Solder Balls, InterPACK2013, 2013
• Interfacial Reaction between Molten Sn and Plasma Nitrided Stainless Steel, InterPACK2013, 2013
• 鉛フリーはんだ微小試験片の高速引張特性, Mate 2012(Microjoining and Assembly Technology in Electronics) Proc. pp.65-68, 2012
• Sn-Cu系鉛フリーはんだによるCuの真空接合部の接合部組織と接合強度, Mate 2012(Microjoining and Assembly Technology in Electronics) Proc. pp.85-88, 2012
• WLCSPはんだ接合部の熱疲労寿命に及ぼす基板材質の影響, Mate 2012(Microjoining and Assembly Technology in Electronics) Proc. pp.377-380, 2012
• Sn-Pb 共晶はんだ微小試験片の引張特性に及ぼすAu,PdおよびBi添加の影響, Mate 2012(Microjoining and Assembly Technology in Electronics) Proc. pp.433-434, 2012
• 鉛フリーめっき液を用いた無電解Ni/Au およびNi/Pd/Au めっき電極の接合特性, Mate 2012(Microjoining and Assembly Technology in Electronics) Proc. pp.439-440, 2012
• 鉛フリーはんだの実装技術動向について, JAXA 鉛フリー化の影響に関するシンポジウム ～宇宙機の鉛フリー化対応に伴う課題と対策～前刷集, 2012
• Microstructures and Joint Strength of Vacuum Jointed Cu with Sn-Cu Alloys, ICEP-IAAC 2012, 2012
• ナノインデンテータを用いた電解銅箔の機械的特性評価, 日本金属学会2012年秋期（第151回）大会, 2012
• 微小鉛フリーはんだ材の引張特性に与えるひずみ速度の影響, 日本金属学会2012年秋期（第151回）大会, 2012
• プラズマ窒化処理ステンレス鋼の純Snによる侵食挙動, 日本金属学会2012年秋期（第151回）大会, 2012
• 鉛フリーNiめっき液を用いた無電解Ni/Au およびNi/Pd/Au めっき電極の接合特性, 日本金属学会2012年秋期（第151回）大会, 2012
• Sn-Cu系鉛フリーはんだによるCuの真空接合に及ぼすクエン酸表面処理の影響, 日本金属学会2012年秋期（第151回）大会, 2012
• Investigation of Impact Properties of Lead-free Solders using Micro-size Specimens, ICEP-IAAC 2012, 2012
• Effect of Substrate Material on Thermal Fatigue Life of Solder Joint of WLCSP, ICEP-IAAC 2012, 2012
• ソルダペーストぬれ性評価装置の開発と方法の提案, 第５３回溶接学会マイクロ接合研究委員会ソルダリング分科会, 2012
• 鉛フリー無電解Niめっき皮膜中の共析物とはんだ実装信頼性, MES 2012(マイクロエレクトロニクスシンポジウム), 2012
• Investigation of Wetting Behavior of Sn-3Ag-0.5Cu Solder Paste to BGA Solder Ball, IEMT 2012, 2012
• Effect of Ni, Ge and P Addition in Sn-Ag-Cu Lead-free Solder on Solder Joint Properties with Electroless Ni/Au Electrodes, IEMT 2012, 2012
• Effect of Surface Modification by Citric Acid on Fluxless Vacuum Bonding of Cu with Sn-Cu Alloy, IEMT 2012, 2012
• Effect of Filler Content on Tensile Properties of Underfill Material for Flip Chip Bonding, IEMT 2012, 2012
• Effect of Strain Rate on Tensile Properties of Miniature Size Lead-Free Alloys, IEMT 2012, 2012
• A Study of Solid State Bonding Strength of Al/Cu by Using Metal Salt Generation Bonding Method on Al Surface, Visual-JW2012, 2012
• A Study of Bonding Strength of Al/Cu by Metal Salt Generation Bonding Method, Visual-JW2012, 2012
• 窒化処理膜などの拡散タイプ処理膜の損傷メカニズムと評価試験方法, JEITA 環境調和型先端実装技術 成果報告会2012, 2012
• フリップチップ接合用アンダーフィル材の引張特性に及ぼすフィラー含有量の影響, 日本金属学会2012年秋期（第151回）大会, 2012
• Microstructures and Joint Strength of Vacuum Jointed Cu with Sn-Cu Alloys, ICEP-IAAC 2012, 2012
• Investigation of Impact Properties of Lead-free Solders using Micro-size Specimens, ICEP-IAAC 2012, 2012
• Effect of Substrate Material on Thermal Fatigue Life of Solder Joint of WLCSP, ICEP-IAAC 2012, 2012
• Investigation of Wetting Behavior of Sn-3Ag-0.5Cu Solder Paste to BGA Solder Ball, IEMT 2012, 2012
• Effect of Ni, Ge and P Addition in Sn-Ag-Cu Lead-free Solder on Solder Joint Properties with Electroless Ni/Au Electrodes, IEMT 2012, 2012
• Effect of Surface Modification by Citric Acid on Fluxless Vacuum Bonding of Cu with Sn-Cu Alloy, IEMT 2012, 2012
• Effect of Filler Content on Tensile Properties of Underfill Material for Flip Chip Bonding, IEMT 2012, 2012
• Effect of Strain Rate on Tensile Properties of Miniature Size Lead-Free Alloys, IEMT 2012, 2012
• A Study of Solid State Bonding Strength of Al/Cu by Using Metal Salt Generation Bonding Method on Al Surface, Visual-JW2012, 2012
• A Study of Bonding Strength of Al/Cu by Metal Salt Generation Bonding Method, Visual-JW2012, 2012
• 実装基板の接続信頼性に及ぼす基板材料特性の影響, Mate 2011(Microjoining and Assembly Technology in Electronics) Proc. pp.159-164, 2011
• Au, Pd添加Sn-Pb共晶はんだの引張特性に及ぼす時効の影響, Mate 2011(Microjoining and Assembly Technology in Electronics) Proc. pp.331-332, 2011
• 無電解Ni/Pd/Auめっき電極と鉛フリーはんだとの接合特性に及ぼすPdめっき厚の影響, Mate 2011(Microjoining and Assembly Technology in Electronics) Proc. pp.333-334, 2011
• 多層カーボンナノチューブを用いた高熱伝導性アンダーフィル材の検討, Mate 2011(Microjoining and Assembly Technology in Electronics) Proc. pp.353-354, 2011
• Sn-Ag-Cu系鉛フリーはんだによるプラズマ窒化ステンレス鋼の侵食挙動, Mate 2011(Microjoining and Assembly Technology in Electronics) Proc. pp.359-360, 2011
• Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-Free Solder Ball Joint With Electroless Ni/Pd/Au Plated Electrode, Proc. of InterPACK2011 (CD-ROM), IPACK2011-52024, 2011
• Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application, Proc. of InterPACK2011 (CD-ROM), IPACK2011-52025, 2011
• Erosion Behavior of Plasma Nitriding Stainless Steel by Molten Sn-Ag-Cu Lead-Free Solder, Proc. of InterPACK2011 (CD-ROM), IPACK2011-52026, 2011
• Effect of the Organic Acid Surface Modification on Bond Strength of Tin and Copper, Proc. of InterPACK2011 (CD-ROM), IPACK2011-52072, 2011
• 無電解Ni/Pd/Auめっき皮膜のはんだ実装性とNiめっき皮膜中に共析した微量添加剤(Pb, S)濃度の関係, MES 2011(Micro Electronics Symposium) Proc. pp.145-148, 2011
• 金属塩生成法を用いたSn/Cu固相接合の低温化, 第５２回マイクロ接合研究委員会ソルダリング分科会資料, pp.65-70, 2011
• The Study on Erosion Resistance Characteristics of Fe-MWCNT Composite Plating against Lead-Free Solder, Proceedings of ECO-MATES 2011, Vol.2, (2011), pp.47-48, 2011
• 鉛フリー対応はんだ鏝先へのFe-MWCNT複合めっき適用性についての検討, エレクトロニクス実装学会春季講演大会論文集, 25(2011) pp.391-392, 2011
• 窒化処理膜などの表面拡散タイプ処理膜の損傷メカニズムと評価試験方法, JEITA 環境調和型先端実装技術 成果報告会2011，pp.47-60, 2011
• 電解銅箔の高強度化におよぼす添加剤の影響, 日本金属学会講演概要DVD（第149回），(2011) 94., 2011
• 鉛フリーめっき液を用いた無電解Ni/Au およびNi/Pd/Au めっき電極と鉛フリーはんだの接合特性, 日本金属学会講演概要DVD（第149回），(2011) 262., 2011
• Sn-Cu系鉛フリーはんだによるCuの真空接合に及ぼすNiおよびGeの影響, 日本金属学会講演概要DVD（第149回），(2011) 263., 2011
• Bi 添加Sn-Pb 共晶はんだの引張特性に及ぼす時効の影響, 日本金属学会講演概要DVD（第149回），(2011) 264., 2011
• 双ロール法により作製した高Al含有Mg合金の機械的特性, 日本金属学会講演概要DVD（第149回），(2011) 394., 2011
• アルカリ処理によるアルミニウムと銅の直接接合法の検討, 日本金属学会講演概要DVD（第149回），(2011) 468., 2011
• 溶融Pb フリーはんだによる窒化処理ステンレス鋼の侵食挙動, 日本金属学会講演概要DVD（第149回），(2011) 482., 2011
• 微小試験片による鉛フリーはんだの衝撃特性評価, 日本金属学会講演概要DVD（第149回），(2011) 483., 2011
• WLCSP はんだ接合部の信頼性に及ぼす基板材質の影響, 日本金属学会講演概要DVD（第149回），(2011) 484., 2011
• B 添加溶融塩浸漬によるSUS304 ステンレス鋼表面の硬化処理, 日本金属学会講演概要DVD（第149回），(2011) 541., 2011
• アルカリ性溶液を用いたAl/Al低温固相接合法の検討, 日本金属学会講演概要DVD（第149回），(2011) 597., 2011
• Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-Free Solder Ball Joint With Electroless Ni/Pd/Au Plated Electrode, Proc. of InterPACK2011 (CD-ROM), IPACK2011-52024, 2011
• Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application, Proc. of InterPACK2011 (CD-ROM), IPACK2011-52025, 2011
• Erosion Behavior of Plasma Nitriding Stainless Steel by Molten Sn-Ag-Cu Lead-Free Solder, Proc. of InterPACK2011 (CD-ROM), IPACK2011-52026, 2011
• Effect of the Organic Acid Surface Modification on Bond Strength of Tin and Copper, Proc. of InterPACK2011 (CD-ROM), IPACK2011-52072, 2011
• The Study on Erosion Resistance Characteristics of Fe-MWCNT Composite Plating against Lead-Free Solder, Proceedings of ECO-MATES 2011, Vol.2, (2011), pp.47-48, 2011
• 半導体電極用メタライゼーションとSn-3Ag-0.5Cuはんだとの界面反応, 小林竜也,荘司郁夫,依田智子, Mate 2010(Microjoining and Assembly Technology in Electronics) Proc., 2010
• Sn-Ag-Cu-Ni-Ge系はんだの強度特性に及ぼすAg添加量の影響, 新井亮平,荘司郁夫,石川久雄,小島昌夫, Mate 2010(Microjoining and Assembly Technology in Electronics), 2010
• Sn-Ag-Cu-Ni-Ge系はんだ中へのCuの溶解特性に及ぼすNi添加量の影響, 永井麻里江,渡邉裕彦,大澤勤,荘司郁夫, Mate 2010(Microjoining and Assembly Technology in Electronics) Proc., 2010
• Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge Alloy, Far East and Oceanic Fracture Society 2010, 2010
• Effect of Ag Content on Mechanical Properties of Lead-free Sn-Ag-Cu-Ni-Ge Alloy, Far East and Oceanic Fracture Society 2010, 2010
• Effect of Ni and Ag on Interfacial Reaction and Microstructure of Sn-Ag-Cu-Ni-Ge Solder Alloy, Far East and Oceanic Fracture Society 2010, 2010
• Effect of interfacial reaction on joint strength of semiconductor metallization and Sn-3Ag-0.5Cu solder ball, Far East and Oceanic Fracture Society 2010, 2010
• Analysis of Stress-strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints, Far East and Oceanic Fracture Society 2010, 2010
• 無電解Ni-P/Au、Ni-P/Pd/Auめっき皮膜のはんだ実装性に対するNiめっき添加剤の影響, MES 2010(Micro Electronics Symposium), 2010
• 錫の酸化皮膜に対する有機酸の改質作用と固相接合強度への影響, 第９５回溶接学会マイクロ接合研究委員会, 2010
• Development of wettability evaluation equipment for solder paste using laser displacement method, Visual-JW 2010, 2010
• Examination of improvement effect of surface modification of Cu with organic acid on solder paste wettability using a laser displacement meter, Visual-JW 2010, 2010
• フラックス残渣によるアンダーフィル封止信頼性に及ぼす影響, エレクトロニクス実装学会春季講演大会, 2010
• ステンレス鋼表面処理材の健全性評価と損傷挙動評価, JEITA鉛フリー化活動成果報告会2010, 2010
• Sn-Ag-Cu系はんだの接合強度に及ぼす微量元素添加の影響, 日本金属学会（第147回）, 2010
• Sn-Cu系鉛フリーはんだのCuの溶解特性, 日本金属学会（第147回）, 2010
• 無電解Ni/Pd/Auめっき電極と鉛フリーはんだとの接合特性, 日本金属学会（第147回）, 2010
• 溶融鉛フリーはんだによるプラズマ窒化ステンレス鋼の損傷挙動, 日本金属学会（第147回）, 2010
• 高速引張試験によるSn-Ag-Cu鉛フリーはんだの機械的特性, 日本金属学会（第147回）, 2010
• Au添加Sn-Pb共晶はんだの引張特性に及ぼす時効の影響, 日本金属学会（第147回）, 2010
• CSPはんだ接合部の熱疲労寿命に及ぼす応力－歪みヒステリシスループ形状の影響, 日本金属学会（第147回）, 2010
• Dynamic mechanical behavior of Sn-Ag-Cu lead-free solders by tensile test under high strain rate, Visual-JW 2010, 2010
• Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge Alloy, Far East and Oceanic Fracture Society 2010, 2010
• Effect of Ag Content on Mechanical Properties of Lead-free Sn-Ag-Cu-Ni-Ge Alloy, Far East and Oceanic Fracture Society 2010, 2010
• Effect of Ni and Ag on Interfacial Reaction and Microstructure of Sn-Ag-Cu-Ni-Ge Solder Alloy, Far East and Oceanic Fracture Society 2010, 2010
• Effect of interfacial reaction on joint strength of semiconductor metallization and Sn-3Ag-0.5Cu solder ball, Far East and Oceanic Fracture Society 2010, 2010
• Analysis of Stress-strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints, Far East and Oceanic Fracture Society 2010, 2010
• Development of wettability evaluation equipment for solder paste using laser displacement method, Visual-JW 2010, 2010
• Examination of improvement effect of surface modification of Cu with organic acid on solder paste wettability using a laser displacement meter, Visual-JW 2010, 2010
• Dynamic mechanical behavior of Sn-Ag-Cu lead-free solders by tensile test under high strain rate, Visual-JW 2010, 2010
• 溶融鉛フリーはんだによるSUS304鋼とSUS316鋼の侵食速度比較, 住吉一仁,荘司郁夫,高瀬博之,宮崎誠, Mate 2009(Microjoining and Assembly Technology in Electronics) Proc., 2009
• Comparison of Erosion Rates of SUS304 and SUS316 Stainless Steels by Molten Sn-3Ag-0.5Cu Solder, Proc. of ICEP (International Conference of Electronics Packaging) 2009, pp.943-946, 2009
• Effect of Impurities of Au and Pd on Tensile Properties of Eutectic Sn-Pb Solder for Aerospace Application, Proc. of ICEP (International Conference of Electronics Packaging) 2009, pp.947-950, 2009
• Development of Joining Technology of Al Alloy Plate and Cu Alloy Pipe for Cooling System of Power Module, Proc. of ICEP (International Conference of Electronics Packaging) 2009, pp.951-954, 2009
• Sn-Cu系鉛フリーはんだによるAlとCuの真空接合, 溶接学会平成21年度春季全国大会講演概要，第84集(2009)pp.4-5, 2009
• ポリ塩化ビニル付着試験片を用いた溶融鉛フリーはんだによるステンレス鋼の侵食深さ評価, 日本金属学会講演概要（第145回），(2009) pp.433., 2009
• 半導体電極用メタライゼーションとSn-3Ag-0.5Cu鉛フリーはんだとの接合信頼性, 本金属学会講演概要（第145回），(2009) pp.435., 2009
• Sn-Ag-Cu-Ni-Ge系鉛フリーはんだのCuの溶解特性に及ぼすNi添加量の影響, 日本金属学会講演概要（第145回），(2009) pp.435., 2009
• Sn-Ag-Cu-Ni-Ge系はんだの引張特性と接合特性に及ぼすAg添加量の影響, 日本金属学会講演概要（第145回），(2009) pp.436., 2009
• Sn-Cu系鉛フリーはんだによるめっき処理Al合金とCu合金フラックスレス接合, 日本金属学会講演概要（第145回），(2009) pp.436., 2009
• Sn-Pb共晶はんだの引張特性に及ぼすAu、Pd添加量の影響, 日本金属学会講演概要（第145回），(2009) pp.436., 2009
• Comparison of Erosion Rates of SUS304 and SUS316 Stainless Steels by Molten Sn-3Ag-0.5Cu Solder, Proc. of ICEP (International Conference of Electronics Packaging) 2009, pp.943-946, 2009
• Effect of Impurities of Au and Pd on Tensile Properties of Eutectic Sn-Pb Solder for Aerospace Application, Proc. of ICEP (International Conference of Electronics Packaging) 2009, pp.947-950, 2009
• Development of Joining Technology of Al Alloy Plate and Cu Alloy Pipe for Cooling System of Power Module, Proc. of ICEP (International Conference of Electronics Packaging) 2009, pp.951-954, 2009
• Sn-Ag-Cu-Ni-Geはんだ接合界面の反応層形成について, 渡邉裕彦,下田将義,荘司郁夫,大澤勤, Mate 2008(Microjoining and Assembly Technology in Electronics) Proc., 2008
• 微小試験片による各種鉛フリーはんだの引張特性評価, 大澤勤,荘司郁夫,松木孝樹,苅谷義治,安田清和,竹本正, Mate 2008(Microjoining and Assembly Technology in Electronics) Proc., 2008
• CSPはんだ接合部の熱疲労寿命に及ぼすアンダーフィル材の材料物性の影響, 東平知丈,吉澤啓介,荘司郁夫,西元正治,小川泰史,川野崇之,水谷弓子,大崎理彦, Mate 2008(Microjoining and Assembly Technology in Electronics) Proc., 2008
• 高温放置環境下におけるSn-8Zn-3Biはんだと無電解Ni/Auめっき電極との界面反応, 下山悟志,荘司郁夫,石川久雄,小島昌夫, Mate 2008(Microjoining and Assembly Technology in Electronics) Proc., 2008
• 複合Ni-Pめっき被膜とポリアセタールとの摩耗特性, 日本金属学会講演概要（第143回），(2008) pp.382., 2008
• Phosphorus Particle Composite Plating with Ni-P Alloy Matrix, Pacific Rim Meeting on Electrochemical and Solid-State Science, Abs. 0090 (2008), 2008
• Sn基鉛フリーはんだのソルダリング特性に及ぼすAg, Ni, Ge添加の影響, 溶接学会第４６回マイクロ接合研究委員会ソルダリング分科会資料, pp.57-60(2008), 2008
• The Effects of Ag, Ni, and Ge Elements in Lead-free Sn Base Solder Alloy, Proc. of Electronics Packaging Technology Conference 2008, pp.582-587 (2008), 2008
• 表面処理分科会及び大学・研究機関での取り組み ～ステンレス鋼表面処理被膜の各種特性の解析及び表面処理材の損傷試験～, JEITA鉛フリー化活動成果報告会2008，(2008)pp.91-103., 2008
• Sn-9ZnおよびSn-3Ag-0.5Cu鉛フリーはんだボール接合部の衝撃特性比較, 日本金属学会講演概要（第143回），(2008) pp.271., 2008
• Sn-0.75Cuはんだボール接合部の衝撃特性評価, 日本金属学会講演概要（第143回），(2008) pp.272., 2008
• Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-free Solder Ball Joints, Advances in Fracture and Damage Mechanics Ⅶ, Proc. of 7th International Conference on Fracture and Damage Mechanics(FDM 2008), pp.429-432 (2008), 2008
• Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint, Advances in Fracture and Damage Mechanics Ⅶ, Proc. of 7th International Conference on Fracture and Damage Mechanics(FDM 2008), pp.433-436 (2008), 2008
• Impact Properties of Sn-0.75Cu Lead-free Solder Ball Joint, Advances in Fracture and Damage Mechanics Ⅶ, Proc. of 7th International Conference on Fracture and Damage Mechanics(FDM 2008), pp.745-748 (2008), 2008
• CSP鉛フリーはんだ接合部の熱疲労寿命に及ぼす熱サイクル条件の影響, 日本金属学会講演概要（第143回），(2008) pp.272., 2008
• Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-free Solder Ball Joints, Advances in Fracture and Damage Mechanics Ⅶ, Proc. of 7th International Conference on Fracture and Damage Mechanics(FDM 2008), pp.429-432 (2008), 2008
• Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint, Advances in Fracture and Damage Mechanics Ⅶ, Proc. of 7th International Conference on Fracture and Damage Mechanics(FDM 2008), pp.433-436 (2008), 2008
• Impact Properties of Sn-0.75Cu Lead-free Solder Ball Joint, Advances in Fracture and Damage Mechanics Ⅶ, Proc. of 7th International Conference on Fracture and Damage Mechanics(FDM 2008), pp.745-748 (2008), 2008
• The Effects of Ag, Ni, and Ge Elements in Lead-free Sn Base Solder Alloy, Proc. of Electronics Packaging Technology Conference 2008, pp.582-587 (2008), 2008
• Phosphorus Particle Composite Plating with Ni-P Alloy Matrix, Pacific Rim Meeting on Electrochemical and Solid-State Science, Abs. 0090 (2008), 2008
• Sn-Ag系鉛フリーはんだの低サイクル疲労と表面変形度合の関係, 高橋 武彦,日置 進,荘司 郁夫,神谷 修, Mate 2007(Microjoining and Assembly Technology in Electronics) Proc. pp.227-232, 2007
• Ni-P合金複合めっき膜の熱処理による組織変化, 表面技術協会第115回講演大会要旨集，8A-10, p.98, 2007
• Ni-B合金複合めっき膜の熱処理による組織変化, 表面技術協会第115回講演大会要旨集，8A-11，pp.99-100, 2007
• Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimens, Program & Abstracts of The Second International Symposium on Smart Processing Technology p.109, 2007
• Effect of Underfill Materials on Thermal Fatigue Lives of Chip Size Package Solder Joints, Program & Abstracts of The Second International Symposium on Smart Processing Technology, p.112, 2007
• 電子デバイスの鉛フリー実装における信頼性, 溶接連合講演会予稿集，pp.109-114, 2007
• アンダーフィル封止CSP鉛フリーはんだ接合部の熱疲労寿命評価, 日本金属学会講演概要（第141回），(2007) pp.214., 2007
• 無電解Ni/Auめっき電極を用いたSn-Zn系はんだ接合部の界面反応層成長とせん断強度, 日本金属学会講演概要（第141回），(2007) pp.217., 2007
• Estimation of Thermal Fatigue Resistance of Sn-Bi(-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index, Abstract Book IWJC-Korea 2007 (International Welding and Joining Conference-Korea 2007) pp. 94-95, 2007
• Growth Kinetics of Interfacial Reactions and Ball Shear Strength of Sn-9Zn Solder Joints on Electroless Ni/Au Plated Electrodes, Program & Abstracts of The Second International Symposium on Smart Processing Technology, p.110, 2007
• Sn-Ag-Cu系鉛フリーはんだ微小試験片の引張特性に及ぼす時効の影響, 日本金属学会講演概要（第141回），(2007) pp.214., 2007
• Sn-Ag-Cu-Ni-Geはんだの電極界面反応相成長に与えるNi添加量の影響, 日本金属学会講演概要（第141回），(2007) pp.217., 2007
• 電鋳Ni-Co合金メッシュの耐刷特性, 日本金属学会講演概要（第141回），(2007) pp.254., 2007
• 鉛フリーはんだ微細組織と機械的特性, 大阪大学接合科学研究所特別講演・研究集会「エレクトロニクス実装におけるスマートプロセス・評価技術シンポジウム」，(2007) pp.51-60., 2007
• Estimation of Thermal Fatigue Resistance of Sn-Bi(-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index, Abstract Book IWJC-Korea 2007 (International Welding and Joining Conference-Korea 2007) pp. 94-95, 2007
• Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimens, Program & Abstracts of The Second International Symposium on Smart Processing Technology p.109, 2007
• Growth Kinetics of Interfacial Reactions and Ball Shear Strength of Sn-9Zn Solder Joints on Electroless Ni/Au Plated Electrodes, Program & Abstracts of The Second International Symposium on Smart Processing Technology, p.110, 2007
• Effect of Underfill Materials on Thermal Fatigue Lives of Chip Size Package Solder Joints, Program & Abstracts of The Second International Symposium on Smart Processing Technology, p.112, 2007
• ウイスカ抑制Pbフリーはんだペースト, 林田 喜任,髙橋 義之,大野 隆生,荘司 郁夫, Mate 2006(Microjoining and Assembly Technology in Electronics) Proc., 2006
• Sn-3.5Ag, Sn-0.7Cu鉛フリーはんだの表面変形度合による低サイクル疲労特性評価, 高橋 武彦,日置 進,荘司 郁夫,神谷 修, Mate 2006(Microjoining and Assembly Technology in Electronics) Proc., 2006
• CSPはんだ接合部の熱応力緩和に及ぼすアンダーフィル材の影響, 吉澤 啓介,荘司 郁夫,西元 正治,川野 崇之, Mate 2006(Microjoining and Assembly Technology in Electronics) Proc., 2006
• Sn-Ag-Cu-Ni-Ge系鉛フリーはんだの接合部組織および接合強度に及ぼすNi添加量の影響, 角田 智史,荘司 郁夫,渡邉 裕彦,浅井 竜彦, Mate 2006(Microjoining and Assembly Technology in Electronics) Proc., 2006
• Ni-P複合めっき膜の熱処理による組織変化, 表面技術協会第113回講演大会講演要旨集,p.157, 2006
• Ni-B複合めっき膜の熱処理による組織変化, 表面技術協会第113回講演大会講演要旨集，p.158-159, 2006
• Effect of Ni and Ag on Interfacial Reaction and Microstructure of Sn-Ag-Cu-Ni-Ge Lead-Free Solder, Proceedings of Materials Science and Technology (MS&T) 2006: PRODUCT MANUFATURING, pp.135-146, 2006
• Development of Cu Brazing Sheet with Cu-P Composite Plating, Abstracts and Program of 2006 Asian Pacific Conference for Fracture and Strength, pp.292 (2006), 2006
• Influence of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package, Abstracts and Program of 2006 Asian Pacific Conference for Fracture and Strength, pp.292, 2006
• New Lead Free Solder Composition and Physical Properties of Printed Wiring Board Laminate Material To Suppress Lift-Off and Improve Reliability, Proc. of IPC Printed Circuits Expo, APEX and the Designers Summit 2006, S39-02, 2006
• Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge, Abstracts and Program of 2006 Asian Pacific Conference for Fracture and Strength, pp.293, 2006
• Sn-Ag-Cu-Ni-Ge系鉛フリーはんだの接合部組織と接合強度, 第４１回マイクロ接合研究委員会ソルダリング分科会資料, pp.1-11, 2006
• 有限要素解析を用いたCSPはんだ接合部の熱応力緩和評価, 日本機械学会関東支部ブロック合同講演会-2006 桐生-講演論文集，p.49-50, 2006
• 大型設備導入教育, 日本機械学会関東支部ブロック合同講演会-2006 桐生-講演論文集，p.129-130, 2006
• 熱サイクル環境下におけるアンダーフィル材によるCSPはんだ接合部の熱応力緩和, 日本金属学会講演概要（第139回）, pp.228, 2006
• Cu-P合金複合めっき, 2006年電気化学秋季大会要旨集，2L03,p.271, 2006
• Ni-P合金複合めっき, 表面技術協会第114回講演大会要旨集，14A-22, p.57, 2006
• Ni-B合金複合めっき, 表面技術協会第114回講演大会要旨集，14A-20，pp.53-54, 2006
• Effect of Ni and Ag on Interfacial Reaction and Microstructure of Sn-Ag-Cu-Ni-Ge Lead-Free Solder, Proceedings of Materials Science and Technology (MS&T) 2006: PRODUCT MANUFATURING, pp.135-146, 2006
• Influence of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package, Abstracts and Program of 2006 Asian Pacific Conference for Fracture and Strength, pp.292, 2006
• Development of Cu Brazing Sheet with Cu-P Composite Plating, Abstracts and Program of 2006 Asian Pacific Conference for Fracture and Strength, pp.292 (2006), 2006
• Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge, Abstracts and Program of 2006 Asian Pacific Conference for Fracture and Strength, pp.293, 2006
• New Lead Free Solder Composition and Physical Properties of Printed Wiring Board Laminate Material To Suppress Lift-Off and Improve Reliability, Proc. of IPC Printed Circuits Expo, APEX and the Designers Summit 2006, S39-02, 2006
• 鉛フリーはんだの接合部信頼性に及ぼす置換・還元型Auめっき層の影響, 後藤広樹,荘司 郁夫,中村清智,大久保利一, Proc. of Mate(Microjoining and Assembly Technology in Electronics) 2005, 2005
• リフトオフ現象抑制のための新規鉛フリーはんだとプリント基板材料特性, 池田謙一,石原秀樹,渡邉裕彦,浅井竜彦,外園洋昭,荘司 郁夫, Proc. of Mate (Microjoining and Assembly Technology in Electronics) 2005, 2005
• 誘電体被膜を有するアルミニウム箔とパラジウム電極との超音波接合, 櫻井司,荘司 郁夫,大島雅史, Proc. of Mate (Microjoining and Assembly Technology in Electronics) 2005, 2005
• ナノ粒子を用いたNi-B複合めっき, 表面技術協会第112回講演大会講演要旨集, p.57-58, 2005
• Low cycle Fatigue behavior and Surface Feature by Image Processing of Sn-0.7Cu Lead-free Solder, Proceedings of the 6th International Conference on Fracture and Strength of Solids Part 1, pp.120-125, 2005
• Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-Free Alloy under Heat Exposure Conditions, Proceedings of the 7th International Conference on Ecomaterials, pp.248-254, 2005
• Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint, Proceedings of the 7th International Conference on Ecomaterials, pp.309-315, 2005
• Comparison of Immersion Gold Plating in Reliability of a Lead-Free Solder Joint with Autocatalytic Electroless Gold Plating, Proceedings of the 7th International Conference on Ecomaterials, pp.347-353, 2005
• An Evaluation of Fatigue Damage in Low-cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature, Proceedings of IPACK2005 (CD-ROM), IPACK2005-73152, 2005
• Thermal stress relief in lead-free solder joint for chip size package with encapsulant materials, Program & Abstract of International Symposium on Smart Processing Technology, p.26, 2005
• アンダーフィル材によるCSPはんだ接合部の熱応力緩和効果, 日本金属学会講演概要（第137回）, pp.412., 2005
• ナノ粒子を用いたCu-P複合めっき, 表面技術協会第112回講演大会講演要旨集, p.11, 2005
• ナノ粒子を用いたNi-P複合めっき, 表面技術協会第112回講演大会講演要旨, p.55-56, 2005
• Sn-Ag-Cu-Ni-Geはんだを用いた鉛フリー接合部の接合強度とミクロ組織, 日本金属学会講演概要（第137回）pp.412, 2005
• ウイスカ抑制Pbフリーはんだ合金, MES 2005(Micro Electronics Symposium) Proc., 2005
• Low cycle Fatigue behavior and Surface Feature by Image Processing of Sn-0.7Cu Lead-free Solder, Proceedings of the 6th International Conference on Fracture and Strength of Solids Part 1, pp.120-125, 2005
• Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-Free Alloy under Heat Exposure Conditions, Proceedings of the 7th International Conference on Ecomaterials, pp.248-254, 2005
• Comparison of Immersion Gold Plating in Reliability of a Lead-Free Solder Joint with Autocatalytic Electroless Gold Plating, Proceedings of the 7th International Conference on Ecomaterials, pp.347-353, 2005
• Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint, Proceedings of the 7th International Conference on Ecomaterials, pp.309-315, 2005
• An Evaluation of Fatigue Damage in Low-cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature, Proceedings of IPACK2005 (CD-ROM), IPACK2005-73152, 2005
• Thermal stress relief in lead-free solder joint for chip size package with encapsulant materials, Program & Abstract of International Symposium on Smart Processing Technology, p.26, 2005
• 高周波巻線チップコイル用高速接合技術の開発, 荘司 郁夫,新井 慎二,櫻井 司,久米原 宏之,薄波 圭司,木村 由孝,須齋 嵩, Proc. of Mate(Microjoining and Assembly Technology in Electronics)2004, 2004
• Cu複合めっき皮膜の作製, 表面技術協会第110回講演大会講演要旨集，p.14, 2004
• 鉛フリーはんだの機械的特性試験方法の標準化（JIS Z 3198-2）, 第18回エレクトロニクス実装学術講演大会講演論文集，pp.47-48., 2004
• Sn-3Ag-0.5Cu鉛フリーはんだと配線電極表面処理材の界面反応, 日本金属学会講演概要（第134回），pp.112., 2004
• 鉛フリーはんだJIS化の動き－機械的特性試験方法を中心に, 第１９回環境対応実装技術フォーラム資料，pp.1-21, 2004
• 鉛フリーはんだJIS化の動き－機械的特性試験方法を中心に－, エレクトロニクス実装学会 電子部品・実装技術委員会 電子部品研究会／先進実装技術研究会共催公開講演会, 2004
• エレクトロニクス製作における微細接合技術, マイクロ加工フォーラム講演概要集， 2004国際ウエルディングショーフォーラム運営委員会pp.24-28., 2004
• 微細被覆銅線とSn電極との超音波接合, 日本金属学会講演概要（第135回），pp.270., 2004
• 圧延Cu箔電極材とSn-3Ag-0.5Cu鉛フリーはんだの界面反応, 日本金属学会講演概要（第135回）,pp.475, 2004
• Cr粉を添加したBNi-2ろうによるSUS304鋼のろう付, 日本金属学会講演概要（第135回），pp.548, 2004
• Joint Strength and Microstructure of microjoint with Sn-Ag-In-Bi Lead-free Solder, Proceedings of New Frontiers of Process Science and Engineering in Advanced Materials '04, 2004
• Mechanical Properties of Various Lead-free Solders, Proceedings of The 2nd International Conference on Structure, Processing and Properties of Materials, SPPM2004, 2004
• Mechanical Properties and Microstructure of SUS304 Brazed Joint with Ni-Base Filler Metals Added Cr Powder, Final Program and Abstructs of Asian Pacific Conference for Fracture and Strength'04, 2004
• Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with Sn-3Ag-0.5Cu, Final Program and Abstructs of Asian Pacific Conference for Fracture and Strength'04, 2004
• High Speed Bonding of Resin Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil, Final Program and Abstructs of Asian Pacific Conference for Fracture and Strength'04, 2004
• Mechanical Properties of Various Lead-free Solders, Proceedings of The 2nd International Conference on Structure, Processing and Properties of Materials, SPPM2004, 2004
• Mechanical Properties and Microstructure of SUS304 Brazed Joint with Ni-Base Filler Metals Added Cr Powder, Final Program and Abstructs of Asian Pacific Conference for Fracture and Strength'04, 2004
• Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with Sn-3Ag-0.5Cu, Final Program and Abstructs of Asian Pacific Conference for Fracture and Strength'04, 2004
• High Speed Bonding of Resin Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil, Final Program and Abstructs of Asian Pacific Conference for Fracture and Strength'04, 2004
• Joint Strength and Microstructure of microjoint with Sn-Ag-In-Bi Lead-free Solder, Proceedings of New Frontiers of Process Science and Engineering in Advanced Materials '04, 2004
• 各種鉛フリーはんだの引張特性, 高橋 武彦,日置 進,荘司 郁夫,吉田 知弘, Proc. of Mate(Microjoining and Assembly Technology in Electronics)2003, 2003
• 低融点鉛フリーはんだの引張特性, 荘司 郁夫,吉田 知弘,高橋 武彦,日置 進, Proc. of Mate(Microjoining and Assembly Technology in Electronics)2003, 2003
• 熱交換器用SUS304鋼のNiろう接合強度に及ぼす板厚の影響, 日本機械学会関東支部10周年記念ブロック合同講演会-2003桐生-講演論文集，pp.77-78, 2003
• Sn-8Zn-3Bi鉛フリーソルダのクリープ特性, 日本金属学会講演概要（第133回）, pp.379, 2003
• 熱交換器用ステンレス鋼のNiろう接合継手の強度と組織, 日本金属学会講演概要（第133回），pp.608, 2003
• Effect of Ni Coating over Cu Ball on the Microstructure of Flip Chip Joints with Cu-corred Solder Balls, Proc. of InterPACK03(CD-ROM), 2003
• Tensile Properties of Sn-0.7mass%Cu Lead-free Solder, Abstracts 2 of The 8th IUMRS International Conference on Advanced Materials 2003, 2003
• Effect of Ni Coating over Cu Ball on the Microstructure of Flip Chip Joints with Cu-corred Solder Balls, Proc. of InterPACK03(CD-ROM), 2003
• Tensile Properties of Sn-0.7mass%Cu Lead-free Solder, Abstracts 2 of The 8th IUMRS International Conference on Advanced Materials 2003, 2003
• Sn-Zn系鉛フリーはんだ/Cu接合体の接合部組織と機械的特性, 荘司 郁夫,中村 隆夫,森 史成,藤内 伸一, Mate 2002(Microjoining and Assembly Technology in Electronics) Proc., 2002
• Sn-Ag系鉛フリーはんだの引張特性, 溶接学会平成14年度春季全国大会講演概要，第70集，pp.134-135, 2002
• りん銅ろうを用いたSUS444鋼のろう付, 溶接学会平成14年度春季全国大会講演概要，第70集, pp.278-279, 2002
• りん銅ろうを用いたSUS444鋼のろう付, 溶接学会第60回界面接合研究委員会資料, IJ-01-2002, pp.1-7, 2002
• 鉛フリーはんだの引張試験とその結果, 日本素材物性学会平成14年度（第12回）年会講演要旨集, pp.74-77, 2002
• はんだ材料の機械的特性試験方法, 第67回マイクロ接合研究委員会資料, pp.13-28, 2002
• 無電解NiバンプとPbフリーはんだを用いたフリップチップ接合部の熱疲労強度評価, 荘司 郁夫,森 史成, Proc. of Mate(Microjoining and Assembly Technology in Electronics)2001, 2001
• はんだ/Au,NiめっきパッドBGA接合部信頼性に及ぼすCu添加の影響, 日本金属学会春期大会講演概要(2001) pp.132, 2001
• りん銅ろうを用いたSUS316鋼のろう付け, 溶接学会平成13年度春季全国大会講演概要，第68集, pp.238-239, 2001
• 鉛フリーマイクロ接合部の熱疲労挙動, 東北大学電気通信研究所共同研究プロジェクト「グローバルインテグレーション超低消費電力無線通信ハイブリッドULSIプロセス技術の研究」研究会, 2001
• りん銅ろうを用いたステンレス鋼のろう付, 日本溶接協会平成１３年度第１回貴金属ろう部会技術委員会先端材料接合委員会, 2001
• Sn-Zn系鉛フリーはんだ/Cu接合体の時効組織, 溶接学会平成13年度秋季全国大会講演概要，第69集,pp.262-263, 2001
• Thermal Fatigue Behavior of CSP Solder Joints with Sn-Ag Lead-free Solders under Thermal Cycle Conditions, Proc. of 2001 International Conference on Electronics Packaging, 2001
• Thermal Fatigue Behavior of CSP Solder Joints with Sn-Ag Lead-free Solders under Thermal Cycle Conditions, Proc. of 2001 International Conference on Electronics Packaging, 2001
• Sn-Ag系Pbフリーはんだを用いたCSP接合部の接合部組織と熱疲労強度評価, 荘司 郁夫,山下 勝, Proc. of Mate(Microjoining and Assembly Technology in Electronics)2000, 2000
• ペースト印刷法によるSolder capped bumpを用いたフリップチップリワーク法の開発, 森 史成,鳥山 和重,勝 直樹,荘司 郁夫, Proc. of Mate(Microjoining and Assembly Technology in Electronics)2000, 2000
• Cuコアはんだボールを用いたBGA接合部組織と機械的性質 -第2報-, 清野 紳弥,佐伯 敏男,上西 啓介,小林 紘二郎,荘司 郁夫,山本 雅春, Proc. of Mate(Microjoining and Assembly Technology in Electronics)2000, 2000
• Sn-Agはんだを用いたBGA組織に及ぼすCuコアの影響, 佐伯 敏男,上西 啓介,小林 紘二郎,荘司 郁夫,山本 雅春, Proc. of Mate(Microjoining and Assembly Technology in Electronics)2000, 2000
• BGAマイクロ接合部組織に及ぼすSn-Pb,Sn-Ag系はんだへのCu添加の影響, 溶接学会平成12年度秋季全国大会講演概要，pp.154-155, 2000
• Sn-Ag系Pbフリーはんだを用いたCSP接合部の熱疲労組織, 第60回マイクロ接合研究委員会資料,？pp.33-42, 2000
• 0.5mmピッチCSP接合部の熱疲労強度評価, 荘司 郁夫,森 日出雄,折井 靖光, Proc. of Mate(Microjoining and Assembly Technology in Electronics)'99, 1999
• Cuコアはんだボールを用いたBGA接合部組織と機械的性質, 清野 紳弥,上西 啓介,小林 紘二郎,荘司 郁夫,山本 雅春, Proc. of Mate(Microjoining and Assembly Technology in Electronics)'99, 1999
• In-Sn系はんだとAuのマイクロ接合部における金属間化合物成長過程, 藤原 伸一,小林 紘二郎,荘司 郁夫,藤井 俊夫, Proc. of Mate(Microjoining and Assembly Technology in Electronics)'99, 1999
• BGA/CSPのはんだ接合部の信頼性, 第１３回エレクトロニクス実装学術講演大会,？pp.229-230, 1999
• Pbフリーはんだを用いたCSPはんだ接合部の熱疲労組織, 溶接学会平成11年度秋季全国大会講演概要，pp.344-345, 1999
• Solder capped bumpを用いたFlip chip rework法の開発, 溶接学会平成11年度秋季全国大会講演概要，pp.336-337, 1999
• フリップチップ接合用はんだのせん断特性と熱疲労強度との関係について, 荘司 郁夫,折井 靖光,小林 紘二郎, Proc. of Mate(Microjoining and Assembly Technology in Electronics)'98, 1998
• In-Sn系はんだとAuとのマイクロ接合部における金属間化合物成長過程, 溶接学会平成10年度秋季全国大会講演概要，pp.110-111, 1998
• BGA/CSPのはんだ接合部の信頼性, 第56回マイクロ接合研究委員会資料,？pp.1-8, 1998
• CSPはんだ接合部の熱疲労強度評価, 溶接学会平成10年度秋季全国大会講演概要，pp.108-109, 1998
• フリップチップ接合部の熱疲労とクリープ特性, 荘司 郁夫,折井 靖光,小林 紘二郎, Proc. of Mate(Microjoining and Assembly Technology in Electronics)'97, 1997
• 樹脂系プリント配線板を用いたフリップチップ接合部の熱疲労, 溶接学会平成９年度春季全国大会講演概要，pp.110-111, 1997
• フリップチップ接合用はんだのせん断特性と熱疲労寿命値との関連性, 溶接学会平成９年度秋季全国大会講演概要,？第61集，pp.490-491, 1997
• In-48Sn共晶はんだとAuのマイクロ接合部における金属間化合物成長過程, 溶接学会平成９年度秋季全国大会講演概要，pp.488-489, 1997
• フリップチップ用各種はんだの信頼性, 第23回マイクロ接合研究委員会ソルダリング分科会資料,？pp.47-58, 1997
• ワイヤボンド用チップを用いたフリップチップアタッチ実装技術, 荘司 郁夫,山田 毅,木村 英夫,折井 靖光,藤内 伸一,酒井 俊廣, Proc. of Mate(Microjoining and Assembly Technology in Electronics)'96 Symposium, 1996
• Flip Chip Attach Technology by Au Bump and In Alloy Solder, SHOHJI IKUO,Takeshi Yamada,Hideo Kimura, Proc. of IMC(International Microelectronics Conference)1996, 1996
• ワイヤボンド用チップを用いた狭ピッチフリップチップアタッチ実装法, 第２１回マイクロ接合研究委員会ソルダリング分科会資料,？pp.7-14, 1996
• Other Metal BumpによるFlip Chip Attach実装技術の開発, 荘司 郁夫,山田 毅,木村 英夫, 第６回MES'95（マイクロエレクトロニクスシンポジウム）論文集, 1995
• The Design of Flipchip Joint by Other Metal Bump - Flip Chip Attach Technology, Yutaka Tsukada,Noriyuki Watanuki,Shigeki Okamoto,SHOHJI IKUO, Proc. of IMC(International Microelectronics Conference)1994, 1994
• アルミニウム双結晶の再結晶, 軽金属学会第８１回秋期大会概要集,？pp.23-24, 1991

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