Researcher Database
| Kobayashi Tatsuya |  |
| Department of Mechanical Science and Technology | |
| Assistant Professor | |
Last Updated :2025/04/08
Researcher Profile and Settings
Affiliation
Profile and Settings
Name
Kobayashi, Tatsuya
Affiliation
Affiliation
Affiliation
Graduate School of Science and Technology
Degree
Association Memberships
Research Activities
Published Papers
- Fabrication and characterization of zinc-coated aluminum particle joining materials via zincate treatment, Tatsuya Kobayashi , Rika Goto, Ikuo Shohji, Nov. 2024, Journal of Materials Science, 59, 20812, 20823, Scientific journal
- Cu-Ni合金めっき液を用いた電気めっきと脱合金化によって形成された三次元構造膜の接着性評価, 小林竜也, PHAM THAI ANH, 荘司郁夫, Nov. 2024, 13, 6, 301, 306
- Recent Development of Joining Materials, Methods of Reliability Evaluations and Conductive Materials for Electronic Components, Tatsuya Kobayashi, Toshihiro Kuzuya, Tetsuya Ando, Sep. 2024, Materials Transactions, 65, 9, 176, 179
- Cu–Ni合金めっき膜を用いた金属/CFRTP接合部の疲労特性評価, 小林竜也，巽裕章，山﨑康平，岡下諒哉，荘司郁夫, Aug. 2024, 63, 1, 176, 179, Scientific journal
- Application of Metal Sputtering Treatment to Cellulose Materials Used as Co-Deposited Material for Electrolytic Nickel Composite Plating, 飯岡諒, 川鍋渉, 小林竜也, 荘司郁夫, 2023, 41, 4, 337, 347
- Investigation of Deposition Conditions and Basic Properties of CNF Composite Ni Plated Film by Electroless Plating Method, Wataru Kawanabe, Makoto Iioka, Tatsuya Kobayashi, Ikuo Shohji, Materials Science Forum, 1106, 69, 74
- Effect of Special Plating Films on Galvanic Corrosion Behavior between Metal and CFRTP, Tatsuya Kobayashi, Kei Shimizu, Ikuo Shohji, 2023, Materials Science Forum, 1106, 63, 68
- Investigation of Effects of Electroplating Conditions on TEMPO-Oxidized Cellulose Nanofiber Composited Nickel Electroplated Films, Makoto Iioka, Wataru Kawanabe, Tatsuya Kobayashi, Ikuo Shohji, 2023, Materials Science Forum, 1106, 55, 62
- Effect of High Temperature and Humidity on Bond Strength of Al/Resin Adhesive Joints, Itsuki Watanabe, Tatsuya Kobayashi, Ikuo Shohji, 2023, Key Engineering Materials, 967, 63, 68
- Effect of Sb Addition on Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Ball Joints, Marina Oyama, Tatsuya Kobayashi, Ikuo Shohji, Mohd Arif Anuar Mohd Salleh, 2023, Key Engineering Materials, 967, 43, 49
- Fabrication of High-Temperature Solder by Zn Plating Films Containing Al Particles, Tatsuya Kobayashi, Yuki Abiko, Ikuo Shohji, 2023, Key Engineering Materials, 967, 37, 42
- Effect of Plating Potential on Three-Dimensional Structural Plating Films and their Adhesion to Epoxy Resin, Tatsuya Kobayashi, Thai Anh Pham, Ikuo Shohji, 2023, Key Engineering Materials, 966, 31, 36
- Microstructure and Mechanical Properties of A6061/GA980 Resistance Spot Weld, Toshiki Nonomura, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Muneyoshi Iyota, 2023, Key Engineering Materials, 966, 25, 30
- Fabrication of Electroplated Nickel Composite Films Using Cellulose Nanofibers Introducedwith Carboxy Groups as Co-Deposited Materials, Makoto Iioka, Wataru Kawanabe, Tatsuya Kobayashi, Ikuo Shohji and Kota Sakamoto, 2023, Surface, 6, 2, 164, 178
- Sn-Sb-Ag系高温鉛フリーはんだの疲労特性に及ぼす添加元素の影響, 三ツ井恒平, 山本瑞貴, 川井健太郎, 小林竜也, 荘司郁夫, 渡邉裕彦, 2023, 26, 3, 266, 274
- Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens, Tatsuya Kobayashi, Masaki Yokoi, Kyosuke Kobayashi, Kohei Mitsui, and Ikuo Shohji, 2018, Solid State Phenomena, 273, 232, 239
- Analysis of Stress-strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints, Ikuo Shohji, Tatsuya Kobayashi and Tomotake Tohei, 2011, Key Engineering Materials, 462-463, 76, 81
- Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu Solder Ball, Chiko Yorita, Tatsuya Kobayashi and Ikuo Shohji, 2011, Key Engineering Materials, 462-463, 849, 854
- An Experimental Study of Fabrication of Cellulose Nano-Fiber Composited Ni Film by Electroplating, Makoto Iioka, Wataru Kawanabe, Ikuo Shohji and Tatsuya Kobayashi, 2022, Materials Transactions, 63, 6, 821, 828
- 半導体パッケージ検査用プローブ材と Sn-58Bi はんだ界面における反応層成長過程, 渡會 和己, 荘司 郁夫, 小林 竜也, 星野 智久, 佐藤 賢一, 小林 俊介, 小谷 直仁, 2022, 11, 5, 188, 193
- Sn-Sb-Ag系はんだダイボンド接合部のパワーサイクル損傷挙動に及ぼす添加元素の影響, 山中佑太, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦, 2023, 11, 5, 194, 201
- 電子実装用エポキシ樹脂および Ni/ 樹脂接着部の吸水劣化挙動, 三ツ木寛尚, 鈴木陸, 荘司郁夫, 小林竜也, 2021, 10, 6, 359, 364
- Mechanistic Study of Ni–Cr–P Alloy Electrodeposition and Characterization of Deposits, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake,Hiroki Yamamoto, Yuichiro Kamakoshi, 31 Jul. 2021, Journal of Electroanalytical Chemistry, 897, 15, 115582
- Low Cycle Fatigue Characteristics of Oxygen-Free Copper for Electric Power Equipment, Takuma Tanaka, Togo Sugioka, Tatsuya Kobayashi, Ikuo Shohji, Yuya Shimada, Hiromitsu Watanabe and Yuichiro Kamakoshi, 29 Jul. 2021, Materials, 14, 4237
- Microstructure and Properties of SUS304 Stainless Steel Joints Brazed with Electrodeposited Ni-Cr-P Alloy Coating, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Katsuharu Osanai, Tetsuya Ando, Junichiro Hirohashi, Tsunehito Wake, Katsufumi Inoue and Hiroki Yamamoto, 28 Jul. 2021, Materials, 14, 4216
- Microstructure and Fatigue Behaviors of Dissimilar A6061/Galvannealed Steel Joints Fabricated by Friction Stir Spot Welding, Koki Kumamoto, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Yuichiro Kamakoshi, 12 Jul. 2021, Materials, 14, 3877
- Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder, Mizuki Yamamoto, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui, Hirohiko Watanabe, 07 Jul. 2021, Materials, 14, 3799
- Joining process of dissimilar materials using three-dimensional electrodeposited Ni-Cu film, T. Kobayashi, I. Shohji, Jan. 2021, Materials and Manufacturing Processes
- Investigation of Mechanical Properties of High Tg Epoxy Resin Material, Xinya ZHAO, Hironao MITSUGI, Ikuo SHOHJI and Tatsuya KOBAYASHI, 2021, 10, 6, 365, 371
- Mechanistic Study of Ni–Cr–P Alloy Electrodeposition and Characterization of Deposits, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake,Hiroki Yamamoto, Yuichiro Kamakoshi, 2021, Journal of Electroanalytical Chemistry, 897, 115582
- Low Cycle Fatigue Characteristics of Oxygen-Free Copper for Electric Power Equipment, Takuma Tanaka, Togo Sugioka, Tatsuya Kobayashi, Ikuo Shohji, Yuya Shimada, Hiromitsu Watanabe and Yuichiro Kamakoshi, 2021, Materials, 14, 4237
- Microstructure and Properties of SUS304 Stainless Steel Joints Brazed with Electrodeposited Ni-Cr-P Alloy Coating, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Katsuharu Osanai, Tetsuya Ando, Junichiro Hirohashi, Tsunehito Wake, Katsufumi Inoue and Hiroki Yamamoto, 2021, Materials, 14, 4216
- Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder, Mizuki Yamamoto, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui, Hirohiko Watanabe, 2021, Materials, 14, 3799
- Recent Development of Joining and Conductive Materials for Electronic Components, Tatsuya Kobayashi, Tetsuya Ando, 2021, Materials Transactions, 62, 8, 1270, 1276
- Brazing of Stainless Steel Using Electrolytic Ni-P Plating Film and Investigation of Corrosion Behavior, Anna Hashimoto, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake, Susumu Arai, Yuichiro Kamakoshi, 2021, Materials Science Forum, 1016, 522, 527
- Fabrication of three-dimensional microstructure film by Ni-Cu alloy electrodeposition for joining dissimilar materials, Tatsuya Kobayashi, Ikuo Shohji, 2021, Materials Science Forum, 1016, 738, 743
- Effect of Microstructure on Joint Strength of Fe/Al Resistance Spot Welding for Multi-Material Components, Koki Kumamoto, Ikuo Shohji, Tatsuya Kobayashi, Muneyoshi Iyota, 2021, Materials Science Forum, 1016, 774, 779
- Effect of Temperature and Humidity on Degradation Behavior of Cu/Epoxy Interface under High Temperature and High Humidity Aging, Riku Suzuki, Ikuo Shohji, Tatsuya Kobayashi, Yu Tonozuka, 2021, Materials Science Forum, 1016, 1436, 1442
- Investigation of Bonding Strength of Al Solid Phase Diffusion Bonded Joint with Surface Treatment Using Electrolyzed Water, Takuma Tanaka, Ikuo Shohji, Tatsuya Kobayashi, Hisashi Imai, 2021, Materials Science Forum, 1016, 1466, 1472
- Large area bonding for power devices by pillar-like IMC effective dispersion control, Ikuo Shohji, Tatsuya Kobayashi, Yusuke Nakata, 2020, Impact, 2020, 1, 76, 78
- ステンレス鋼製熱交換器用Niろうの腐食挙動, 深井祐佑, 荘司郁夫, 小林竜也, 安藤哲也, 吉田拓也, 柏瀬毅, 大友昇, 2020, 9, 3, 127, 132
- Sn-Sb-Ag系高温鉛フリーはんだ合金の機械的性質に及ぼす微量Ni及びGe添加の影響, 三ツ井恒平, 荘司郁夫, 小林竜也, 渡邉裕彦, 2020, 9, 3, 133, 139
- Investigation of Degradation Behavior of Cohesion of Resin and Adhesion Interface under High Temperature and High Humidity Conditions, ABIKO Hitomi;SHOHJI Ikuo;KOBAYASHI Tatsuya;TOMITA Yugo;MATSUNAGA Tatsunori, 2019, Journal of Smart Processing, 9, 2, 75, 81
- Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge Lead-Free Solder, Masaki Yokoi, Tatsuya Kobayashi and Ikuo Shohji, Dec. 2018, Materials Science Forum
- Effect of Cooling Rate on Intermetallic Compounds Formation in Sn-Ag-Cu-In Solder, Kenji Miki, Tatsuya Kobayashi, Ikuo Shohji and Yusuke Nakata, Dec. 2018, Materials Science Forum
- Investigation of Crack Initiation in Glass Substrate by Residual Stress Analysis, Amon Shinohara, Tatsuya Kobayashi, Ikuo Shohji and Yuki Umemura, Dec. 2018, Materials Science Forum
- Microstructures and Mechanical Properties of Welded Joints of Several HighTensile Strength Steel, Takahiro Izumi, Tatsuya Kobayashi, Ikuo Shohji and Hiroaki Miyanaga, Dec. 2018, Materials Science Forum
- Plastic Deformation Simulation of Sintered Ferrous Material in Cold-Forging Process, Yuki Morokuma, Shinichi Nishida, Yuichiro Kamakoshi, Koshi Kanbe, TatsuyaKobayashi and Ikuo Shohji, Dec. 2018, Materials Science Forum
- 高温高湿環境下における銅／エポキシ樹脂界面の劣化寿命評価, 戸野塚悠, 小林竜也, 荘司郁夫, 外薗洋昭, 高橋邦明, 江連徳, Mar. 2018, 7, 4, 128-134
- Sn-W Structure Produced at the Interface Between Sn-3Ag-0.5Cu Solder and Plating Metallization on W Substrate, YORITA Chiko;HARADA Masahide;NISHIKAWA Toru;KOBAYASHI Tatsuya;SHOHJI Ikuo, 2014, Journal of Smart Processing, 3, 4, 232, 239
- Microstructure and Fatigue Behaviors of Dissimilar A6061/Galvannealed Steel Joints Fabricated by Friction Stir Spot Welding, Koki Kumamoto, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Yuichiro Kamakoshi, 2021, Materials, 14, 3877
- Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens, Kobayashi, Tatsuya;Shohji, Ikuo, 2019, METALS, 9, 12
- Effects of Ni Addition to Sn-5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties, Kobayashi, Tatsuya;Mitsui, Kohei;Shohji, Ikuo, 2019, MATERIALS TRANSACTIONS, 60, 6, 888, 894
- Recent Development of Joining and Conductive Materials for Electronic Components, Kobayashi, Tatsuya;Ando, Tetsuya, 2021, MATERIALS TRANSACTIONS, 62, 8, 1270, 1276
- Formation of Cu-Ni Alloy Plating Film for Improving Adhesion between Metal and Resin, Kobayashi, Tatsuya;Kubo, Akifumi;Shohji, Ikuo, 2022, MATERIALS TRANSACTIONS, 63, 6, 800, 804
- Recent Development of Joining and Conductive Materials for Electronic Components, Kobayashi Tatsuya;Ando Tetsuya, Aug. 2021, MATERIALS TRANSACTIONS, 62, 8, 1270, 1276
- Effects of Ni Addition to Sn–5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties, Kobayashi Tatsuya;Mitsui Kohei;Shohji Ikuo, Jun. 2019, MATERIALS TRANSACTIONS, 60, 6, 888, 894
- Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints, Kobayashi, Tatsuya;Shohji, Ikuo;Nakata, Yusuke, 2018, ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2018
- Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens, Kobayashi, Tatsuya;Kobayashi, Kyosuke;Mitsui, Kohei;Shohji, Ikuo, 2018, ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2018
- An Evaluation of the Wear Resistance of Electroplated Nickel Coatings Composited with 2,2,6,6-Tetramethylpiperidine 1-oxyl-Oxidized Cellulose Nanofibers., Iioka Makoto;Kawanabe Wataru;Tsujimura Subaru;Kobayashi Tatsuya;Shohji Ikuo, Jan. 2024, Polymers, 16, 2
MISC
- Society5.0のエネルギーシステムを支える革新的接合材料, 荘司郁夫, 小林竜也, 2020, 7, 11, 50, 54, Introduction commerce magazine
- 電解膜を介したステンレス鋼とCFRTPの異種材料接合, 小林竜也, 2021, 69, 9, 132, 133, Introduction commerce magazine
Books etc
Presentations
- Microstructural analysis and mechanical properties evaluation of zinc-coated aluminum particles, Tatsuya Kobayashi, TMS2025, 24 Mar. 2025, 23 Mar. 2025, 27 Mar. 2025, English
- Zn被覆Al粒子接合材における接合界面の解析および接合特性の評価, 小林竜也, 第128回界面接合研究委員会, 24 Jan. 2025
- 電位制御による三次元構造膜の生成と樹脂との接着性評価, 小林竜也, 2024年度第1回日本溶接協会ろう部会技術委員会先端材料接合委員会, 26 Jul. 2024
- 電解膜を介した金属とプラスチックの異材接合, 小林竜也, 溶接学会2023年度秋季全国大会, 14 Sep. 2023
- Al 粒子を用いた液相焼結型接合材の開発, 小林竜也, Mate2023, 25 Jan. 2023
- 特殊めっき膜を用いた5052アルミニウム合金とCFRTPの異材接合, 小林竜也, 軽金属学会 第143回秋期大会, 13 Nov. 2022
- 特殊形状めっき膜を用いた金属とプラスチックの異種材料接合技術, 小林竜也, 第116回複合材料懇話会, 03 Dec. 2021
- 特殊形状めっき膜を用いた金属とプラスチックの接合, 小林竜也, 荘司郁夫, 第134回マイクロ接合研究委員会, 29 Jul. 2021
- パワー半導体実装用新規鉛フリーはんだの機械的特性と接合特性, 小林竜也, 日本機械学会 RC278研究分科会, 03 Sep. 2019
- パワー半導体実装用高温鉛フリーはんだの開発, 小林竜也, 日本溶接協会 ろう部会技 術委員会, 26 Jul. 2019
- Sn-Sb-Ni系高温用鉛フリーはんだの微細組織 および機械的特性, 小林竜也, Mate2019, 30 Jan. 2019
- Effect of Ni Addition on Tensile and Fatigue Properties of Sn-Sb Alloy, Tatsuya Kobayashi, Kohei Mitsui and Ikuo Shohji, 4th International Conference on Nanojoining and Microjoining, 03 Dec. 2018, Nara
- Comparison between Sn-Sb and Sn-Ag-Cu- Ni-Ge Alloys in Tensile Properties Using Miniature Size Specimen, Tatsuya Kobayashi, Masaki Yokoi, Kyosuke Kobayashi, Kohei Mitsui and Ikuo Shohji, Electronic Packaging Interconnect Technology Symposium 2017 , 02 Nov. 2017, Fukuoka
- 低温ジンケート処理を用いたZnめっき被覆Al粒子接合材の作製と評価, 小林竜也, 2024年度先端ウェットプロセス技術研究会講演会, 19 Mar. 2025