Application of Metal Sputtering Treatment to Cellulose Materials Used as Co-Deposited Material for Electrolytic Nickel Composite Plating, 飯岡諒, 川鍋渉, 小林竜也, 荘司郁夫, 2023年, 溶接学会論文集, 41, 4, 337, 347
Investigation of Deposition Conditions and Basic Properties of CNF Composite Ni Plated Film by Electroless Plating Method, Wataru Kawanabe, Makoto Iioka, Tatsuya Kobayashi, Ikuo Shohji, Materials Science Forum, 1106, 69, 74
Effect of Special Plating Films on Galvanic Corrosion Behavior between Metal and CFRTP, Tatsuya Kobayashi, Kei Shimizu, Ikuo Shohji, 2023年, Materials Science Forum, 1106, 63, 68
Investigation of Effects of Electroplating Conditions on TEMPO-Oxidized Cellulose Nanofiber Composited Nickel Electroplated Films, Makoto Iioka, Wataru Kawanabe, Tatsuya Kobayashi, Ikuo Shohji, 2023年, Materials Science Forum, 1106, 55, 62
Effect of High Temperature and Humidity on Bond Strength of Al/Resin Adhesive Joints, Itsuki Watanabe, Tatsuya Kobayashi, Ikuo Shohji, 2023年, Key Engineering Materials, 967, 63, 68
Effect of Sb Addition on Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Ball Joints, Marina Oyama, Tatsuya Kobayashi, Ikuo Shohji, Mohd Arif Anuar Mohd Salleh, 2023年, Key Engineering Materials, 967, 43, 49
Fabrication of High-Temperature Solder by Zn Plating Films Containing Al Particles, Tatsuya Kobayashi, Yuki Abiko, Ikuo Shohji, 2023年, Key Engineering Materials, 967, 37, 42
Effect of Plating Potential on Three-Dimensional Structural Plating Films and their Adhesion to Epoxy Resin, Tatsuya Kobayashi, Thai Anh Pham, Ikuo Shohji, 2023年, Key Engineering Materials, 966, 31, 36
Microstructure and Mechanical Properties of A6061/GA980 Resistance Spot Weld, Toshiki Nonomura, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Muneyoshi Iyota, 2023年, Key Engineering Materials, 966, 25, 30
Fabrication of Electroplated Nickel Composite Films Using Cellulose Nanofibers Introducedwith Carboxy Groups as Co-Deposited Materials, Makoto Iioka, Wataru Kawanabe, Tatsuya Kobayashi, Ikuo Shohji and Kota Sakamoto, 2023年, Surface, 6, 2, 164, 178
Sn-Sb-Ag系高温鉛フリーはんだの疲労特性に及ぼす添加元素の影響, 三ツ井恒平, 山本瑞貴, 川井健太郎, 小林竜也, 荘司郁夫, 渡邉裕彦, 2023年, エレクトロニクス実装学会誌, 26, 3, 266, 274
Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens, Tatsuya Kobayashi, Masaki Yokoi, Kyosuke Kobayashi, Kohei Mitsui, and Ikuo Shohji, 2018年, Solid State Phenomena, 273, 232, 239
Analysis of Stress-strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints, Ikuo Shohji, Tatsuya Kobayashi and Tomotake Tohei, 2011年, Key Engineering Materials, 462-463, 76, 81
Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu Solder Ball, Chiko Yorita, Tatsuya Kobayashi and Ikuo Shohji, 2011年, Key Engineering Materials, 462-463, 849, 854
An Experimental Study of Fabrication of Cellulose Nano-Fiber Composited Ni Film by Electroplating, Makoto Iioka, Wataru Kawanabe, Ikuo Shohji and Tatsuya Kobayashi, 2022年, Materials Transactions, 63, 6, 821, 828
半導体パッケージ検査用プローブ材と Sn-58Bi はんだ界面における反応層成長過程, https://www.mst.st.gunma-u.ac.jp/zai2/custom28.html#:~:text=%E6%B8%A1%E6%9C%83%E5%92%8C%E5%B7%B1%2C%20%E8%8D%98%E5%8F%B8%E9%83%81%E5%A4%AB%2C%20%E5%B0%8F%E6%9E%97%E7%AB%9C%E4%B9%9F%2C%20%E6%98%9F%E9%87%8E%E6%99%BA%E4%B9%85%2C%20%E4%BD%90%E8%97%A4%E8%B3%A2%E4%B8%80%2C%20%E5%B0%8F%E6%9E%97%E4%BF%8A%E4%BB%8B%2C%20%E5%B0%8F%E8%B0%B7%E7%9B%B4%E4%BB%81, 2022年, スマートプロセス学会誌, 11, 5, 188, 193
Sn-Sb-Ag系はんだダイボンド接合部のパワーサイクル損傷挙動に及ぼす添加元素の影響, 山中佑太, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦, 2023年, スマートプロセス学会誌, 11, 5, 194, 201
電子実装用エポキシ樹脂および Ni/ 樹脂接着部の吸水劣化挙動, 三ツ木寛尚, 鈴木陸, 荘司郁夫, 小林竜也, 2021年, スマートプロセス学会誌, 10, 6, 359, 364
Mechanistic Study of Ni–Cr–P Alloy Electrodeposition and Characterization of Deposits, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake,Hiroki Yamamoto, Yuichiro Kamakoshi, 2021年07月31日, Journal of Electroanalytical Chemistry, 897, 15, 115582
Low Cycle Fatigue Characteristics of Oxygen-Free Copper for Electric Power Equipment, Takuma Tanaka, Togo Sugioka, Tatsuya Kobayashi, Ikuo Shohji, Yuya Shimada, Hiromitsu Watanabe and Yuichiro Kamakoshi, 2021年07月29日, Materials, 14, 4237
Microstructure and Properties of SUS304 Stainless Steel Joints Brazed with Electrodeposited Ni-Cr-P Alloy Coating, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Katsuharu Osanai, Tetsuya Ando, Junichiro Hirohashi, Tsunehito Wake, Katsufumi Inoue and Hiroki Yamamoto, 2021年07月28日, Materials, 14, 4216
Microstructure and Fatigue Behaviors of Dissimilar A6061/Galvannealed Steel Joints Fabricated by Friction Stir Spot Welding, Koki Kumamoto, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Yuichiro Kamakoshi, 2021年07月12日, Materials, 14, 3877
Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder, Mizuki Yamamoto, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui, Hirohiko Watanabe, 2021年07月07日, Materials, 14, 3799
Joining process of dissimilar materials using three-dimensional electrodeposited Ni-Cu film, T. Kobayashi, I. Shohji, 2021年01月, Materials and Manufacturing Processes
Investigation of Mechanical Properties of High Tg Epoxy Resin Material, Xinya ZHAO, Hironao MITSUGI, Ikuo SHOHJI and Tatsuya KOBAYASHI, 2021年, スマートプロセス学会誌, 10, 6, 365, 371
Mechanistic Study of Ni–Cr–P Alloy Electrodeposition and Characterization of Deposits, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake,Hiroki Yamamoto, Yuichiro Kamakoshi, 2021年, Journal of Electroanalytical Chemistry, 897, 115582
Low Cycle Fatigue Characteristics of Oxygen-Free Copper for Electric Power Equipment, Takuma Tanaka, Togo Sugioka, Tatsuya Kobayashi, Ikuo Shohji, Yuya Shimada, Hiromitsu Watanabe and Yuichiro Kamakoshi, 2021年, Materials, 14, 4237
Microstructure and Properties of SUS304 Stainless Steel Joints Brazed with Electrodeposited Ni-Cr-P Alloy Coating, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Katsuharu Osanai, Tetsuya Ando, Junichiro Hirohashi, Tsunehito Wake, Katsufumi Inoue and Hiroki Yamamoto, 2021年, Materials, 14, 4216
Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder, Mizuki Yamamoto, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui, Hirohiko Watanabe, 2021年, Materials, 14, 3799
Recent Development of Joining and Conductive Materials for Electronic Components, Tatsuya Kobayashi, Tetsuya Ando, 2021年, Materials Transactions, 62, 8, 1270, 1276
Brazing of Stainless Steel Using Electrolytic Ni-P Plating Film and Investigation of Corrosion Behavior, Anna Hashimoto, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake, Susumu Arai, Yuichiro Kamakoshi, 2021年, Materials Science Forum, 1016, 522, 527
Fabrication of three-dimensional microstructure film by Ni-Cu alloy electrodeposition for joining dissimilar materials, Tatsuya Kobayashi, Ikuo Shohji, 2021年, Materials Science Forum, 1016, 738, 743
Effect of Microstructure on Joint Strength of Fe/Al Resistance Spot Welding for Multi-Material Components, Koki Kumamoto, Ikuo Shohji, Tatsuya Kobayashi, Muneyoshi Iyota, 2021年, Materials Science Forum, 1016, 774, 779
Effect of Temperature and Humidity on Degradation Behavior of Cu/Epoxy Interface under High Temperature and High Humidity Aging, Riku Suzuki, Ikuo Shohji, Tatsuya Kobayashi, Yu Tonozuka, 2021年, Materials Science Forum, 1016, 1436, 1442
Investigation of Bonding Strength of Al Solid Phase Diffusion Bonded Joint with Surface Treatment Using Electrolyzed Water, Takuma Tanaka, Ikuo Shohji, Tatsuya Kobayashi, Hisashi Imai, 2021年, Materials Science Forum, 1016, 1466, 1472
Large area bonding for power devices by pillar-like IMC effective dispersion control, Ikuo Shohji, Tatsuya Kobayashi, Yusuke Nakata, 2020年, Impact, 2020, 1, 76, 78
ステンレス鋼製熱交換器用Niろうの腐食挙動, 深井祐佑, 荘司郁夫, 小林竜也, 安藤哲也, 吉田拓也, 柏瀬毅, 大友昇, 2020年, スマートプロセス学会誌, 9, 3, 127, 132
Sn-Sb-Ag系高温鉛フリーはんだ合金の機械的性質に及ぼす微量Ni及びGe添加の影響, 三ツ井恒平, 荘司郁夫, 小林竜也, 渡邉裕彦, 2020年, スマートプロセス学会誌, 9, 3, 133, 139
接着継手の高温高湿環境下における樹脂材凝集力および 接着界面の劣化挙動調査, 安孫子 瞳;荘司 郁夫;小林 竜也;冨田 雄吾;松永 達則, 2019年, スマートプロセス学会誌, Journal of Smart Processing, 9, 2, 75, 81
Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge Lead-Free Solder, Masaki Yokoi, Tatsuya Kobayashi and Ikuo Shohji, 2018年12月, Materials Science Forum
Effect of Cooling Rate on Intermetallic Compounds Formation in Sn-Ag-Cu-In Solder, Kenji Miki, Tatsuya Kobayashi, Ikuo Shohji and Yusuke Nakata, 2018年12月, Materials Science Forum
Investigation of Crack Initiation in Glass Substrate by Residual Stress Analysis, Amon Shinohara, Tatsuya Kobayashi, Ikuo Shohji and Yuki Umemura, 2018年12月, Materials Science Forum
Microstructures and Mechanical Properties of Welded Joints of Several HighTensile Strength Steel, Takahiro Izumi, Tatsuya Kobayashi, Ikuo Shohji and Hiroaki Miyanaga, 2018年12月, Materials Science Forum
Plastic Deformation Simulation of Sintered Ferrous Material in Cold-Forging Process, Yuki Morokuma, Shinichi Nishida, Yuichiro Kamakoshi, Koshi Kanbe, TatsuyaKobayashi and Ikuo Shohji, 2018年12月, Materials Science Forum
高温高湿環境下における銅/エポキシ樹脂界面の劣化寿命評価, 戸野塚悠, 小林竜也, 荘司郁夫, 外薗洋昭, 高橋邦明, 江連徳, 2018年03月, スマートプロセス学会誌, 7, 4, 128-134
Sn-3Ag-0.5CuはんだとW基板上めっきメタライズ界面に生成するSn-W 構造, 依田 智子;原田 正英;西川 徹;小林 竜也;荘司 郁夫, 2014年, スマートプロセス学会誌, Journal of Smart Processing, 3, 4, 232, 239
Microstructure and Fatigue Behaviors of Dissimilar A6061/Galvannealed Steel Joints Fabricated by Friction Stir Spot Welding, Koki Kumamoto, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Yuichiro Kamakoshi, 2021年, Materials, 14, 3877
Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens, Kobayashi, Tatsuya;Shohji, Ikuo, 2019年, METALS, METALS, 9, 12
Effects of Ni Addition to Sn-5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties, Kobayashi, Tatsuya;Mitsui, Kohei;Shohji, Ikuo, 2019年, MATERIALS TRANSACTIONS, 60, 6, 888, 894
Recent Development of Joining and Conductive Materials for Electronic Components, Kobayashi, Tatsuya;Ando, Tetsuya, 2021年, MATERIALS TRANSACTIONS, 62, 8, 1270, 1276
Formation of Cu-Ni Alloy Plating Film for Improving Adhesion between Metal and Resin, Kobayashi, Tatsuya;Kubo, Akifumi;Shohji, Ikuo, 2022年, MATERIALS TRANSACTIONS, 63, 6, 800, 804
Recent Development of Joining and Conductive Materials for Electronic Components, Kobayashi Tatsuya;Ando Tetsuya, 2021年08月, MATERIALS TRANSACTIONS, 62, 8, 1270, 1276
Effects of Ni Addition to Sn–5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties, Kobayashi Tatsuya;Mitsui Kohei;Shohji Ikuo, 2019年06月, MATERIALS TRANSACTIONS, 60, 6, 888, 894
Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints, Kobayashi, Tatsuya;Shohji, Ikuo;Nakata, Yusuke, 2018年, ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2018
Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens, Kobayashi, Tatsuya;Kobayashi, Kyosuke;Mitsui, Kohei;Shohji, Ikuo, 2018年, ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2018
An Evaluation of the Wear Resistance of Electroplated Nickel Coatings Composited with 2,2,6,6-Tetramethylpiperidine 1-oxyl-Oxidized Cellulose Nanofibers., Iioka Makoto;Kawanabe Wataru;Tsujimura Subaru;Kobayashi Tatsuya;Shohji Ikuo, 2024年01月, Polymers, 16, 2